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Modified epoxy resin system

An epoxy resin system and modification technology, applied in the field of electronic composite materials, can solve the problems of insufficient curing, high brittleness, low shrinkage, etc., achieve good curing effect, improve heat resistance, and overcome the effect of bonding decline

Inactive Publication Date: 2018-09-18
嘉兴立一新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280-295°C), and cyanate ester resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but it has not been widely used due to defects such as insufficient curing and high brittleness.

Method used

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  • Modified epoxy resin system
  • Modified epoxy resin system
  • Modified epoxy resin system

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Embodiment 1

[0023] A modified epoxy resin system, and its preparation method includes the following steps:

[0024] (1) Disperse nano-silica foam in toluene, then add vinyl propionate, tert-butyl diazoacetate and allyl aralkylphenol; stir at 110°C for 30 minutes; then add tetramethyl ethyl Diamine, after uniform dispersion, add dibutyl zinc dilaurate, reflux for 7 hours, and finally add acetone to obtain modified silica with a solid content of 40%; nano silica foam, vinyl propionate, diazonium The mass ratio of tert-butyl acetate, allyl aralkyl phenol, tetramethyl ethylene diamine, and dibutyl zinc dilaurate is 1: 1: 0.5: 1.5: 0.5: 0.008; the present invention uses vinyl propionate first Ester, tert-butyl diazoacetate, allyl aralkylphenol, and tetramethylethylenediamine monomer treat nano-silica foam, which reduces the reactivity of the filler and improves the dispersibility of the filler in the organic matter. Play a role when hot-press curing;

[0025] (2) At room temperature, mix 3,3'-dit...

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Abstract

The invention relates to a modified epoxy resin system; preparation comprises the steps: adding modified silica into a bifunctional epoxy system, and adding a monofunctional epoxy system and nano-polytetrafluoroethylene particles, to obtain a glue solution; and adjusting the solid content of the glue solution to 50% by propylene glycol methyl ether acetate to obtain the modified epoxy resin system. A board prepared based on the modified epoxy resin system has excellent flame retardancy and heat resistance, especially prominent wear resistance.

Description

Technical field [0001] The invention belongs to the technical field of electronic composite materials, and specifically relates to a modified epoxy resin system. Background technique [0002] With the continuous development of science and technology, the application of polymer-based composite materials has become more and more extensive. At the same time, various application fields also put forward higher requirements for different materials, such as high temperature resistance, ablation resistance, and wear resistance. With the emphasis on flame retardancy, products are required to have flame retardant properties. Flame retardancy is required for levels, which are UL94 V-2, UL94 V-1 and UL94 V-0 levels, of which UL94 V-0 level is the existing An international standard to determine whether a substance is flame-retardant. Finding a balance between fire protection and environmental protection is an important node in the development of flame retardant products in the future. The ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L27/18C08K9/04C08K7/26C08K3/04C08J5/24
CPCC08J5/24C08J2363/00C08J2427/18C08K3/042C08K7/26C08K9/04C08K2201/011
Inventor 梁国正韩建王志龙
Owner 嘉兴立一新材料股份有限公司
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