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Low melting point lead-free solder alloy for photovoltaic welding ribbon, and preparation method thereof

A lead-free solder and photovoltaic ribbon technology, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems that lead does not conform to the concept of environmental protection, easily causes various diseases, and invades the human body. To achieve the effects of excellent wetting performance and spreading performance, simple preparation method and good electrical conductivity

Inactive Publication Date: 2018-09-18
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But lead is a toxic metal. On the one hand, precipitation in the human body can cause poisoning. Lead and its compounds can easily invade the human body through the respiratory tract, digestive tract and wounded skin, and easily cause various diseases; on the other hand, the use of lead does not Does not conform to the environmental protection concept advocated now

Method used

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preparation example Construction

[0021] The present invention also provides a method for preparing a low-melting-point lead-free solder alloy for photovoltaic soldering strips, which is characterized in that the specific steps are as follows:

[0022] Step 1: Weigh Sn 50%-55%, Bi 40%-45%, Sb 1%-5%, X 0.1%-1% by mass percentage, the X is In or Ga, and the mass of the above components The sum of the percentages is 100%;

[0023] Step 2: preparing a Sn-Sb master alloy ingot;

[0024] Since the Sb element in the alloy composition belongs to the category of high melting point, in order to solve the problem of serious burning loss of low melting point elements in the process of pure metal smelting, it is necessary to take measures of intermediate alloys in the smelting process.

[0025] The specific preparation method of step 2 is: take part of the Sn and all the Sb weighed in step 1 and place them in a crucible, heat up to 750°C, and after they are all melted, stir with a tungsten rod for 5 minutes, then cool to ...

Embodiment 1

[0036] A method for preparing a low-melting-point lead-free solder alloy for a photovoltaic ribbon, the specific steps are as follows:

[0037] Step 1: Weigh Sn52%, Bi 45%, Sb 2%, In 1% respectively by mass percentage, and the sum of the mass percentages of the above components is 100%;

[0038]Step 2: Take part of the Sn and all the Sb weighed in step 1 and place them in a crucible, heat up to 750°C, and stir with a tungsten rod for 5 minutes after they are all melted, then cool to 400°C and keep warm for 30 minutes. Stir once every 5 minutes with a tungsten rod. During the smelting process, KCl+LiCl molten salt with a mass ratio of 1.25:1 is used for protection, and finally cast into a Sn-Sb master alloy ingot for use; wherein, in the prepared Sn-Sb master alloy ingot It consists of the following components in terms of mass percentage: Sn93%, Sb7%, and the sum of the mass percentages of the above components is 100%.

[0039] The specific preparation method of step 3 is: usi...

Embodiment 2

[0042] A method for preparing a low-melting-point lead-free solder alloy for a photovoltaic ribbon, the specific steps are as follows:

[0043] Step 1: Weigh Sn 55%, Bi 43.9%, Sb 1%, In 0.1% respectively by mass percentage, and the sum of the mass percentages of the above components is 100%;

[0044] Step 2: Take part of the Sn and all the Sb weighed in step 1 and place them in a crucible, heat up to 750°C, and stir with a tungsten rod for 5 minutes after they are all melted, then cool to 400°C and keep warm for 30 minutes. Stir once every 5 minutes with a tungsten rod. During the smelting process, KCl+LiCl molten salt with a mass ratio of 1.25:1 is used for protection, and finally cast into a Sn-Sb master alloy ingot for use; wherein, in the prepared Sn-Sb master alloy ingot It consists of the following components in terms of mass percentage: Sn93%, Sb7%, and the sum of the mass percentages of the above components is 100%.

[0045] The specific preparation method of step 3 i...

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Abstract

The invention discloses a low melting point lead-free solder alloy for a photovoltaic welding ribbon, wherein the alloy comprises, by mass, 50-55% of Sn, 40-45% of Bi, 1-5% of Sb, and 0.1-1% of X, andX is In or Ga. The preparation method comprises: 1, respectively weighing 50-55% of Sn, 40-45% of Bi, 1-5% of Sb, and 0.1-1% of X, wherein X is In or Ga; 2, preparing a Sn-Sb interalloy ingot; and 3,preparing a Sn-Bi-Sb-X low melting point solder alloy. According to the present invention, the tin-bismuth-antimony-based solder alloy for the photovoltaic welding ribbon has advantages of low melting point, good electrical conductivity and excellent soldering and brazing performance; and the preparation method is simple and can be used for mass production.

Description

technical field [0001] The invention belongs to the technical field of non-ferrous alloys and photovoltaic ribbons, and in particular relates to a low-melting-point lead-free solder alloy for photovoltaic ribbons; the invention also relates to a preparation method of the low-melting-point lead-free solder alloy for photovoltaic ribbons. Background technique [0002] With the prosperity and development of modern industry, the energy consumption of fossil fuels such as traditional coal, oil, and natural gas is increasing day by day, resulting in a sharp decline in the reserves of fossil fuels in the earth's crust, and the world's energy crisis has become increasingly prominent. The research and development of new clean energy is imminent, such as solar energy, wind energy, water energy, nuclear energy and so on. Compared with water energy, wind energy, nuclear energy, etc., solar energy has no emission and noise when it is converted into other energy (mainly electric energy), ...

Claims

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Application Information

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IPC IPC(8): C22C13/02C22C1/03B23K35/26B23K35/14
CPCC22C13/02B23K35/0222B23K35/262C22C1/03
Inventor 张敏慕二龙许桓瑞李静王刚
Owner XIAN UNIV OF TECH