Low melting point lead-free solder alloy for photovoltaic welding ribbon, and preparation method thereof
A lead-free solder and photovoltaic ribbon technology, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems that lead does not conform to the concept of environmental protection, easily causes various diseases, and invades the human body. To achieve the effects of excellent wetting performance and spreading performance, simple preparation method and good electrical conductivity
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[0021] The present invention also provides a method for preparing a low-melting-point lead-free solder alloy for photovoltaic soldering strips, which is characterized in that the specific steps are as follows:
[0022] Step 1: Weigh Sn 50%-55%, Bi 40%-45%, Sb 1%-5%, X 0.1%-1% by mass percentage, the X is In or Ga, and the mass of the above components The sum of the percentages is 100%;
[0023] Step 2: preparing a Sn-Sb master alloy ingot;
[0024] Since the Sb element in the alloy composition belongs to the category of high melting point, in order to solve the problem of serious burning loss of low melting point elements in the process of pure metal smelting, it is necessary to take measures of intermediate alloys in the smelting process.
[0025] The specific preparation method of step 2 is: take part of the Sn and all the Sb weighed in step 1 and place them in a crucible, heat up to 750°C, and after they are all melted, stir with a tungsten rod for 5 minutes, then cool to ...
Embodiment 1
[0036] A method for preparing a low-melting-point lead-free solder alloy for a photovoltaic ribbon, the specific steps are as follows:
[0037] Step 1: Weigh Sn52%, Bi 45%, Sb 2%, In 1% respectively by mass percentage, and the sum of the mass percentages of the above components is 100%;
[0038]Step 2: Take part of the Sn and all the Sb weighed in step 1 and place them in a crucible, heat up to 750°C, and stir with a tungsten rod for 5 minutes after they are all melted, then cool to 400°C and keep warm for 30 minutes. Stir once every 5 minutes with a tungsten rod. During the smelting process, KCl+LiCl molten salt with a mass ratio of 1.25:1 is used for protection, and finally cast into a Sn-Sb master alloy ingot for use; wherein, in the prepared Sn-Sb master alloy ingot It consists of the following components in terms of mass percentage: Sn93%, Sb7%, and the sum of the mass percentages of the above components is 100%.
[0039] The specific preparation method of step 3 is: usi...
Embodiment 2
[0042] A method for preparing a low-melting-point lead-free solder alloy for a photovoltaic ribbon, the specific steps are as follows:
[0043] Step 1: Weigh Sn 55%, Bi 43.9%, Sb 1%, In 0.1% respectively by mass percentage, and the sum of the mass percentages of the above components is 100%;
[0044] Step 2: Take part of the Sn and all the Sb weighed in step 1 and place them in a crucible, heat up to 750°C, and stir with a tungsten rod for 5 minutes after they are all melted, then cool to 400°C and keep warm for 30 minutes. Stir once every 5 minutes with a tungsten rod. During the smelting process, KCl+LiCl molten salt with a mass ratio of 1.25:1 is used for protection, and finally cast into a Sn-Sb master alloy ingot for use; wherein, in the prepared Sn-Sb master alloy ingot It consists of the following components in terms of mass percentage: Sn93%, Sb7%, and the sum of the mass percentages of the above components is 100%.
[0045] The specific preparation method of step 3 i...
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Abstract
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