Preparation method of high-temperature serving welding point based on tin-filled foamy copper

A technology of high-temperature service and foam copper, which is applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of electromigration reliability, long welding time, reliability problems, etc., and achieve shortened preparation cycle, short welding time, damage reduction effect

Inactive Publication Date: 2018-09-28
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

The method of transient liquid phase diffusion is only suitable for narrow welds, and the welding time is very long. The resulting weld composition IMC is generally a hard and brittle phase, which is very likely to cause reliability problems in the future service process.
[0006] The low-temperature sintering connection technology of nano-metal particle-based solder paste is a well-developed method for low-temperature interconnection to obtain high-temperature service welds, but the disadvantage of this method is that the cost of Ag is high, and the final weld composition is Ag, which is prone to electromigration at high temperatures and causes a decrease in reliability
[0007] It can be seen that the interconnection technologies that are widely used at present have relatively large limitations.

Method used

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  • Preparation method of high-temperature serving welding point based on tin-filled foamy copper
  • Preparation method of high-temperature serving welding point based on tin-filled foamy copper
  • Preparation method of high-temperature serving welding point based on tin-filled foamy copper

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Embodiment 1

[0040] Embodiment 1, reference figure 1 :

[0041] After a lot of experiments, we invented the welding method in which tin-filled foamed copper is used as the intermediate layer in the schematic diagram, so that solder joints that can be used for high temperature service can be obtained by welding at a lower temperature and less pressure for a short time.

Embodiment 2

[0042] Embodiment 2, refer to figure 2 and image 3 :

[0043] according to figure 1 Welding method, to obtain figure 2 Solder joint structure ( image 3 Enlarged picture of the inside of the solder joint). The method specifically includes the following steps (using a dealloying corrosion method to obtain a foamed copper sheet, stencil printing SAC305 solder paste on both sides of the foamed copper sheet, heating and pressurizing welding and obtaining high-temperature serviceable solder joints as an example):

[0044] (1), Cu with a size of 10mm*10mm*0.2mm 40 Al 60 The alloy flakes were placed in dilute hydrochloric acid solution (10wt.%), and selectively corroded in a water bath environment at 80°C for 12 hours until no obvious bubbles were formed on the surface of the alloy flakes, and a copper foam sheet with a pore size of about 300nm was obtained.

[0045] (2), use distilled water to repeatedly rinse the foamed copper sheet obtained in step (1), then use filter p...

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Abstract

The invention provides a preparation method of a high-temperature serving welding point based on tin-filled foamy copper, wherein the foamy copper has a three-dimensional porous structure and is prepared by adopting a dealloying corrosion method; brazing filler metal is bought; and the overall process is a heating and pressurizing welding process. Each welding point can be obtained in a welding way within a short time (5 min) under a low-temperature (230 DEG C) and low-pressure (3-5 MPa) condition; moreover the obtained mutually-connected welding points serve under a high temperature and can keep relatively good reliability; and each welding point is good in mechanical properties, good in electric conductivity and heat conductivity and widely applied to various high-temperature welding fields.

Description

technical field [0001] The invention belongs to the interdisciplinary field of material processing engineering and material physics and chemistry, and relates to a method for preparing high-temperature service solder joints based on tin-filled foamed copper. Background technique [0002] At present, due to the rapid development of electronic products in the three directions of multi-function, miniaturization and high power, traditional power devices can no longer maintain high reliability in harsh service environments. Power devices made of the third-generation semiconductor material SiC can work stably at a temperature of up to 600°C. In order not to damage other sensitive components in the system, how to realize the connection between the chip and the substrate at a lower temperature and in a shorter time? It has become an urgent problem to be solved that the point can withstand very high service temperature. [0003] At present, the chip bonding methods suitable for high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/20B23K103/12
CPCB23K1/0008B23K1/20B23K1/203B23K1/206
Inventor 陈宏涛苏悦
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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