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A kind of high transparent low expansion polyimide film and its preparation method and application

A technology of polyimide film and polyimide resin, which is applied in the field of high transparency and low expansion polyimide film and its preparation, can solve the problem that high light transmittance and low thermal expansion coefficient of polyimide film cannot have both. problems, to meet the requirements of device processing technology, improve light transmittance, and achieve significant effects of thermal expansion.

Active Publication Date: 2020-05-01
INST OF CHEM CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned analysis, the present invention aims to provide a kind of highly transparent and low-expansion polyimide film and its preparation method and application, in order to solve the problem of high light transmittance and low thermal expansion of the polyimide film prepared by the existing doping method The problem of incompatibility of coefficients

Method used

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  • A kind of high transparent low expansion polyimide film and its preparation method and application
  • A kind of high transparent low expansion polyimide film and its preparation method and application
  • A kind of high transparent low expansion polyimide film and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0052] Embodiment 1, the preparation of polyimide hybrid film PIPH-5% (doping amount 5wt%)

[0053] (1) Synthetic polyimide resin

[0054] For the synthesis steps and conditions of the polyimide resin, refer to the relevant part of Comparative Example 1.

[0055] (2) Doped perhydropolysilazane

[0056] In a three-neck flask equipped with a mechanical stirrer and a thermometer, add a perhydropolysilazane / dichloromethane solution with a solid content of 20 wt%, vacuum and depressurize at 50°C, and slowly remove the solvent dichloromethane until a colorless Transparent viscous liquid or solid. Take the perhydropolysilazane and the polyimide resin prepared in step (1), and dissolve them in N-methylpyrrolidone (NMP) to obtain organic solutions with solid contents of 5 wt% and 20 wt%, respectively. Take 2.24 grams of the above-prepared perhydropolysilazane solution, slowly add it to 10.64 grams of polyimide solution, stir and mix rapidly at room temperature, and defoam under vacu...

Embodiment 2

[0059] Embodiment 2, the preparation of polyimide hybrid film PIPH-10% (doping amount 10wt%)

[0060] (1) Synthetic polyimide resin

[0061] For the synthesis steps and conditions of the polyimide resin, refer to the relevant part of Comparative Example 1.

[0062] (2) Doped perhydropolysilazane

[0063] In a three-neck flask equipped with a mechanical stirrer and a thermometer, add a perhydropolysilazane / dichloromethane solution with a solid content of 30% by weight, vacuum and reduce pressure at 40°C, and slowly remove the solvent dichloromethane until a colorless Transparent viscous liquid or solid. Take perhydropolysilazane and the polyimide resin prepared in step (1), and dissolve them in N,N-dimethylacetamide (DMAc) respectively to prepare organic solutions with solid contents of 5wt% and 15wt%. Take 5 grams of the above-prepared perhydropolysilazane solution, slowly add it to 15 grams of polyimide solution, stir and mix rapidly at room temperature, and defoam under v...

Embodiment 3

[0066] Embodiment 3, the preparation of polyimide hybrid film PIPH-15% (doping amount 15wt%)

[0067] (1) Synthetic polyimide resin

[0068] For the synthesis steps and conditions of the polyimide resin, refer to the relevant part of Comparative Example 1.

[0069] (2) Doped perhydropolysilazane

[0070] In a three-neck flask equipped with mechanical stirring and a thermometer, add a perhydropolysilazane / dichloromethane solution with a solid content of 15% by weight, vacuum and reduce pressure at 50°C, and slowly remove the solvent dichloromethane until a colorless Transparent viscous liquid or solid. Take the perhydropolysilazane and the polyimide resin prepared in step (1), and dissolve them in N-methylpyrrolidone (NMP) to obtain organic solutions with solid contents of 4 wt% and 25 wt%, respectively. Take 10 grams of the above-prepared perhydropolysilazane solution, slowly add it to 9.07 grams of polyimide solution, stir and mix rapidly at room temperature, and defoam un...

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Abstract

The invention relates to a high-transparence low-expansibility polyimide film as well as a preparation method and the application thereof, belongs to the technical field of polyimide films, and aims at solving the problem that a polyimide film prepared by the conventional doping method cannot have both high light transmittance and low thermal expansion coefficients. The preparation method comprises the following steps: uniformly mixing a polyimide resin solution and a perhydropolysilazane solution to obtain a perhydropolysilazane-doped polyimide resin solution; coating the surface of a base plate with the perhydropolysilazane-doped polyimide resin solution; hydrolyzing the perhydropolysilazane into silica; drying the film; curing to obtain the silica-doped polyimide hybrid film. The polyimide film prepared according to the abovementioned method is outstanding in optical performance, high in light transmittance rate of a visible area, and obviously low in thermal expansion coefficient;the polyimide film can be used as a flexible polymer base plate material to be applied to production of photoelectric devices.

Description

technical field [0001] The invention relates to the technical field of polyimide films, in particular to a highly transparent and low-expansion polyimide film and its preparation method and application. Background technique [0002] With the development of flexible optoelectronic technology, liquid crystal displays (LCDs), organic electroluminescent devices (OLEDs), solar cells, electronic tags and other devices are showing a development trend of flexibility, rollability and wearability. As one of the key materials for flexible optoelectronic devices, the optical properties and heat resistance of polymer substrate materials are facing new challenges. [0003] Traditional polyimide has excellent heat resistance, mechanical properties, insulation properties, etc., but the optical transmittance is insufficient and has a darker color, which cannot fully meet the requirements of flexible optoelectronic devices for polymer substrate materials. For this reason, a series of colorle...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K3/36C08J5/18
CPCC08J5/18C08J2379/08C08K3/36C08K2201/011
Inventor 范琳刘欢翟磊何民辉莫松
Owner INST OF CHEM CHINESE ACAD OF SCI
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