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Water-based washing-free antibacterial mildew-proof soldering flux and preparation method thereof

An antibacterial and anti-mildew, flux technology, used in welding equipment, welding media, manufacturing tools, etc., can solve the problems that hinder the large-scale popularization and application of water-based flux, microorganisms affecting solderability and post-soldering reliability, circuit boards and Conveyor belt corrosion and other problems, to achieve the effect of improved dispersibility, good antibacterial effect, strong wettability and corrosion resistance

Inactive Publication Date: 2018-10-16
SUZHOU JIEDERUI PRECISION MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the water-based flux seriously hinders the large-scale application of water-based flux due to its serious corrosion on circuit boards and conveyor belts when using lead-free solder, and the growth of microorganisms affects solderability and post-soldering reliability.
The antibacterial effect of existing water-based fluxes is poor, and the antibacterial efficiency of fluxes added with nano-silver as an antibacterial substance is not high, so it is necessary to further develop antibacterial and anti-mildew fluxes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A water-based no-clean antibacterial and mildew-proof flux prepared from the following raw materials in parts by weight: 13 parts of dithiodibenzoic acid, 10 parts of itaconic acid, 10 parts of anthranilic acid, and 6 parts of isoamyl alcohol acetate , 7.5 parts of n-decyl alcohol, 3.5 parts of methyl tert-butyl ether, 4.5 parts of alkylphenol polyoxyethylene ether, 2 parts of N-dodecyl-N-methylglucamide, 3.5 parts of coconut acid diethanolamide , 3 parts of dipropylene glycol butyl ether, 3 parts of propylene glycol phenyl ether, 5.5 parts of modified nano-silver, 4 parts of antioxidant, 5 parts of corrosion inhibitor, and 14 parts of aqueous solution.

[0020] The antioxidant is 2,2'-methylenebis(4-methyl-6-tert-butylphenol).

[0021] The corrosion inhibitor is polyaspartic acid and sodium N-lauroyl sarcosinate with a mass ratio of 2:1.

[0022] The preparation method of the water-based no-cleaning antibacterial and mildew-proof flux of the present invention comprise...

Embodiment 2

[0027] A water-based no-clean antibacterial and mildew-proof flux prepared from the following raw materials in parts by weight: 10 parts of dithiodibenzoic acid, 7 parts of itaconic acid, 6 parts of anthranilic acid, and 4 parts of isoamyl alcohol , 5 parts of n-decyl alcohol, 2 parts of methyl tert-butyl ether, 3 parts of alkylphenol polyoxyethylene ether, 1 part of N-dodecyl-N-methylglucamide, 2 parts of coconut acid diethanolamide , 2 parts of dipropylene glycol butyl ether, 1 part of propylene glycol phenyl ether, 3 parts of modified nano-silver, 2 parts of antioxidant, 3 parts of corrosion inhibitor, and 10 parts of aqueous solution.

[0028] The antioxidant is dialkyl-p-phenylenediamine.

[0029] The corrosion inhibitor is polyaspartic acid and sodium N-lauroyl sarcosinate with a mass ratio of 1:1.

[0030] The preparation method of the water-based no-cleaning antibacterial and mildew-proof flux of the present invention comprises the following steps:

[0031] (1) Put d...

Embodiment 3

[0035] A water-based no-clean antibacterial and mildew-proof flux prepared from the following raw materials in parts by weight: 12 parts of dithiodibenzoic acid, 9 parts of itaconic acid, 8 parts of anthranilic acid, and 5 parts of isoamyl alcohol acetate , 6 parts of n-decyl alcohol, 3 parts of methyl tert-butyl ether, 4 parts of alkylphenol polyoxyethylene ether, 1.5 parts of N-dodecyl-N-methylglucamide, 3 parts of coconut acid diethanolamide , 2.5 parts of dipropylene glycol butyl ether, 2 parts of propylene glycol phenyl ether, 4 parts of modified nano-silver, 4 parts of antioxidant, 4 parts of corrosion inhibitor, and 12 parts of aqueous solution.

[0036] The antioxidant is 2,2'-methylenebis(4-methyl-6-tert-butylphenol).

[0037] The corrosion inhibitor is polyaspartic acid and sodium N-lauroyl sarcosinate with a mass ratio of 1.5:1.

[0038] The preparation method of the water-based no-cleaning antibacterial and mildew-proof flux of the present invention comprises the ...

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PUM

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Abstract

The invention provides a water-based washing-free antibacterial mildew-proof soldering flux and a preparation method of the water-based washing-free antibacterial mildew-proof soldering flux. The water-based washing-free antibacterial mildew-proof soldering flux is prepared from the following raw materials of by weight, 10-16 parts of dithiosalicylic acid, 7-13 parts of itaconic acid, 6-14 parts of o-aminobenzoic acid, 4-8 parts of isoamyl acetate, 5-10 parts of n-decanol, 2-5 parts of methyl tert-butyl ether, 3-6 parts of alkylphenol polyoxyethylene ether, 1-3 parts of N-dodecyl-N-methyl glucosamine, 2-5 parts of coconut oleic acid diethanolamide, 2-4 parts of dipropylene glycol butyl ether, 1-5 parts of propylene glycol phenyl ether, 3-8 parts of modified nano silver, 2-6 parts of an antioxidant, 3-7 parts of a corrosion inhibitor and 10-18 parts of a water solution. The prepared soldering flux has good antibacterial effect, high shear strength and strong wettability and corrosion resistance, so the soldering flux has wide application prospect as the water-based washing-free antibacterial mildew-proof soldering flux.

Description

technical field [0001] The invention belongs to the technical field of soldering flux, and in particular relates to a water-based no-cleaning antibacterial and mildew-proof soldering flux and a preparation method thereof. Background technique [0002] With the implementation of lead-free electronic products, the choice of flux in lead-free soldering projects has become an important issue. Traditional rosin-based fluxes are highly corrosive, and there are obvious residues on the substrate after soldering, resulting in poor insulation of the circuit board, poor contact, corrosion of electronic circuits and loose connection points, etc., thereby affecting the mechanical properties and electrical properties of the circuit board. performance. Most of the fluxes used in lead-free solders are improved on the basis of fluxes for leaded solders, and most of them contain halogens. Although the solderability is good, there are a large amount of halogen ions remaining after soldering, ...

Claims

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Application Information

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IPC IPC(8): B23K35/362B23K35/363B23K35/40
CPCB23K35/362B23K35/3612B23K35/40
Inventor 姚振红
Owner SUZHOU JIEDERUI PRECISION MACHINERY
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