Mask plate and manufacturing method thereof

Abstract

A mask plate and its manufacturing method, the mask plate includes: a substrate, including a first surface and a second surface opposite to the first surface, the substrate has a plurality of openings through the substrate, the substrate can use Patterning by semiconductor etching process; the sacrificial layer on the first surface, the sacrificial layer has a plurality of openings; the mask pattern layer on the sacrificial layer, the mask pattern layer includes adjacent pattern areas and shielding areas, the pattern area There is at least one through hole through the mask pattern layer, the opening and the hole expose the pattern area, and each pattern area corresponds to the opening and the hole; the mask pattern layer has an annular protrusion protruding into the opening, and the annular protrusion fit the side walls of the opening. The mask plate of the present invention is made by semiconductor technology, which can improve the quality of the mask plate and the accuracy of the through hole, and is beneficial to reduce the size of the through hole and the thickness of the mask pattern layer, and can also prevent the mask pattern Layers and substrates are shifted, and masks are of higher quality and accuracy.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a mask plate and a manufacturing method thereof. Background technique [0002] Physical vapor deposition (Physical Vapor Deposition, PVD) technology is mainly divided into two types: evaporation (Evaporation) process and sputtering (Sputtering) process. Among them, the evaporation process is the main way to form a functional film layer on the surface of the substrate. The evaporation process refers to heating and melting the evaporation source (such as metal, alloy or compound to be plated) in a vacuum evaporation machine (Vacuum Evaporator), so that It escapes in the form of molecules or atoms, and is deposited on the surface of the substrate to form a solid film or coating. [0003] At present, the evaporation process mainly adopts a metal mask (Metal Mask), and the metal mask has openings with a preset pattern. During the evaporation process, the metal mask is fixed...

AI Technical Summary

Problems solved by technology

[0004] At present, the metal mask plate of OLED (Organic Light-Emitting Diode, organic light-emitting display) is usually made of Invar alloy (INVAR, also known as Invar) with a thickness of 30 μm to 50 μm and is prepared by chemical etching. The surface of the alloy is coated with photoresist or photosensitive dry film, and the fine pattern of the mask plate is transferred to the photosensitive film by exposure, and finally a fine metal mask plate is made by means of development and chemical etching. Its precision is usually at the micron level, and generally the minimum can only be 25 μm to 40 μm, so the quality and accuracy of the metal mask made cannot well meet the requirements of the process

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