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A modified conductive filler, its preparation method and application

A conductive filler and modification technology, which is applied in the field of conductive filler preparation and modified conductive filler, can solve the problems of restricting the application of metal filler, increasing resistance, increasing current resistance, etc., and achieves the effects of low cost, improved electrical conductivity, and enhanced connection

Active Publication Date: 2021-02-26
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resistivity of the metal filler conductive adhesive has a great relationship with the morphology of the metal surface. Some organic lubricants will be added during the processing of the micron metal filler, which is conducive to the dispersion of the conductive filler in the polymer, reducing the viscosity of the conductive adhesive and It is convenient for the implementation of conductive adhesive, but this layer of lubricant is insulating, and its existence will make the contact between the fillers become metal-lubricant-metal, which increases the resistance of current passing through the conductive filler; at the same time, the conductive filler is stored Oxidation reactions inevitably occur during the process, resulting in the formation of an oxide layer on the surface of the conductive filler, which also increases the resistance when the current passes
These problems limit the application of metal fillers in the conductive field, so it is an urgent technical problem to develop a conductive adhesive with low cost, simple and effective method and excellent conductivity.

Method used

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  • A modified conductive filler, its preparation method and application
  • A modified conductive filler, its preparation method and application
  • A modified conductive filler, its preparation method and application

Examples

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preparation example Construction

[0044]Another aspect of the embodiments of the present invention provides a method for preparing a modified conductive filler, which includes: under any one or a combination of two or more of an inert atmosphere, a reducing atmosphere, and an air atmosphere, the micron-sized metal The powder is subjected to high-temperature short-time heat treatment, so that at least part of the metal oxide on the surface of the micron-sized metal powder is thermally decomposed, and small-sized metal particles with a particle size of 20-400nm are generated in situ and at least part of the organic lubricant is ablated and removed. In addition, the temperature of the high-temperature short-time heat treatment is 600-800°C, and the time is 5-10s.

[0045] Wherein, as one of the more preferred embodiments, the preparation method may specifically include:

[0046] Raise the temperature of the chemical vapor deposition quartz tube furnace to 600-800°C, then place 2.5g of micron-sized metal powder in...

Embodiment 1

[0078] 1) Preparation of modified conductive filler:

[0079] In terms of parts by mass, raise the temperature of the chemical vapor deposition quartz tube furnace to 600°C, then place 2.5g of silver-coated copper powder in the quartz boat, and quickly place it in the high temperature zone of the 1.5-inch quartz tube with an iron hook Carry out rapid heat treatment for 5s to modify the silver-coated copper powder filler.

[0080] 2) Preparation of conductive adhesive

[0081] Mix epoxy resin, curing agent, accelerator and modified silver-coated copper powder etc. by the following parts by weight:

[0082] Epoxy 828 100 parts

[0083] 20 parts of curing agent methyl hexahydrophthalic anhydride

[0084] Accelerator 1-cyano-2-ethyl-4 methylimidazole 1~2 parts

[0085] Modified silver-coated copper powder 8μm 555 parts

[0086] Thinner acetone 50~100 parts

[0087] Additive TNPP 2~10 parts

[0088] Stir for 30 minutes until evenly mixed to obtain a modified silver-coated co...

Embodiment 2

[0103] 1) Preparation of modified conductive filler

[0104] The temperature of the chemical vapor deposition quartz tube furnace was raised to 700°C, and 555 parts of silver powder was placed in a quartz boat in parts by mass, and quickly placed in the high temperature zone of a 1.5-inch quartz tube with an iron hook for rapid heat treatment for 7s. Silver-clad copper powder filler.

[0105] 2) Preparation of conductive adhesive

[0106] It mainly consists of the following steps:

[0107] Mix high-elastic polyurethane, modified silver powder, etc. according to the following parts by weight:

[0108] PU 100 parts

[0109] Solvent DMF 300 parts

[0110] Modified silver powder 2μm 555 parts

[0111] Thinner acetone 50~100 parts

[0112] Additive TNNP 2~10 parts

[0113] Stir evenly and stir for 30 minutes to obtain a modified silver powder / PU conductive adhesive. Use two adhesive tapes on the surface of the clean glass slide, form a groove in the middle, and then evenly sc...

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Abstract

The invention discloses a modified conductive filler, its preparation method and application. The modified conductive filler includes micron-sized metal powder, at least part of the organic lubricant on the surface of the micron-sized metal powder is removed and at least part of the metal oxide is converted into small-sized metal particles generated in situ. The preparation method includes: performing heat treatment on the micron-sized metal powder at high temperature for a short time, so that at least part of the metal oxide on the surface of the micron-sized metal powder is thermally decomposed, and small-sized metal particles are generated in situ and at least part of the organic lubricant is destroyed. Ablation removal, the temperature of the high-temperature short-time heat treatment is 600-800°C, and the time is 5-10s. The present invention thermally decomposes the oxides on the surface of the micron-sized metal powder into small-sized metal particles through high-temperature short-time heat treatment, and fills the gap between the fillers. At the same time, the organic lubricant is partially removed by ablation, which can effectively improve the conductive filler The connection relationship, thereby greatly improving the conductivity of conductive fillers and conductive adhesives.

Description

technical field [0001] The invention relates to a conductive filler, in particular to a modified conductive filler with good electrical conductivity, its preparation method and application, and belongs to the technical field of conductive filler preparation. Background technique [0002] With the rapid development of the electronics industry, electronic devices tend to be miniaturized, miniaturized, and integrated, and the requirements for interconnect materials are getting higher and higher. Traditional interconnect materials (lead-containing solder) cannot meet this trend. Low resolution, high implementation temperature (200°C), great damage to the environment, etc. As a new type of conductive connection material, conductive adhesive is mainly composed of resin matrix, conductive particles, dispersing additives and auxiliary agents, etc. It is an adhesive with certain conductive properties after curing or drying. After curing, these adhesives form the molecular skeleton s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J11/04C09J163/00C09J175/04C09J11/06
CPCC08K3/08C08K9/00C08K9/02C08K2003/0806C08K2003/085C09J11/04C09J11/06C09J163/00C09J175/04C09J2203/326C09J2301/314
Inventor 姚亚刚卢会芬李朝威
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI