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A kind of novel composite electromagnetic shielding film for FPC and preparation method thereof

An electromagnetic shielding film, a composite technology, applied in the fields of magnetic field/electric field shielding, crosstalk/noise/electromagnetic interference reduction (, circuit devices, etc.)

Active Publication Date: 2019-05-14
SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the electromagnetic shielding film has the following problems: (1) the insulating layer of the electromagnetic shielding film adopts ink, because the ink molecular weight is low, the filler ratio is high, and the crosslinking density is large, the ink is printed on the common carrier film, and the volume of the curing reaction Large shrinkage, due to the brittle and hard characteristics of the ink itself, will cause the electromagnetic shielding film produced with ink to be hard and brittle, and not resistant to bending; used in the FPC industry, resulting in the flexibility and bending resistance of the electromagnetic shielding film Poor stability and product flatness; when the carrier film is torn off, the ink is easy to adhere to the carrier film; the ink itself is relatively brittle and prone to micro-cracks, which leads to the infiltration of the liquid medicine during the subsequent processing of the FPC, resulting in the product being scrapped
(2) The shielding layer of the electromagnetic shielding film adopts a metal shielding layer or a conductive layer. In the subsequent complex high-temperature and high-pressure operation process of FPC, the metal layer is prone to cracks, oxidation, etc., which will reduce the shielding performance. , and even lose the shielding performance, and at the same time, it is easy to bubble and delaminate in the subsequent reflow soldering process
(3) The shielding film made of ordinary conductive adhesive is difficult to meet the needs of the FPC industry because of its low conductivity, poor continuous conduction, and poor shielding performance.

Method used

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  • A kind of novel composite electromagnetic shielding film for FPC and preparation method thereof
  • A kind of novel composite electromagnetic shielding film for FPC and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] The novel composite electromagnetic shielding film for FPC of the present invention uses acrylic paint for the preparation of the first insulating coating layer, the second insulating coating layer, the electromagnetic wave reflecting coating, and the electromagnetic wave absorbing coating, and the manufacturing process that can be adopted is as follows.

[0071] The first step is to prepare the first insulating coating layer, the second insulating coating layer, the electromagnetic wave reflecting coating, and the electromagnetic wave absorbing coating, which can be prepared in the following order, but the scope of protection is not limited to the following A1, A2, A3, A4 order of.

[0072] A1, preparing the first insulating coating layer coating;

[0073] (1) Take 7 parts of acrylic acid, 20 parts of methyl acrylate, 45 parts of acrylonitrile, 20 parts of butyl acrylate, and 7 parts of isobornyl acrylate to obtain acrylic resin I through emulsion polymerization, and a...

Embodiment 2

[0097] The manufacturing process of the novel composite electromagnetic shielding film for FPC in this embodiment is basically the same as that in Example 1, except that the first insulating coating layer coating in A1, the second insulating coating coating coating in A2 and the electromagnetic wave reflection coating in A3 The component ratio of the electromagnetic wave absorbing coating coating in the coating and A4:

[0098] The proportioning of each raw material that makes acrylic resin I in A1 is different, and the addition amount of acrylic acid, methyl acrylate, acrylonitrile, butyl acrylate, and isobornyl acrylate are respectively 3, 10, 30, 10, 5 parts; The amounts of pigment carbon black, titanium dioxide and silicon oxide added to the acrylic resin I were 10%, 3%, and 5% respectively.

[0099] The ratio of each raw material that makes acrylic resin II in A2 is different, and the addition amount of acrylic acid, ethyl acrylate, butyl methacrylate, acrylonitrile is re...

Embodiment 3

[0105] The manufacturing process of the novel composite electromagnetic shielding film for FPC of this embodiment is basically the same as that of Embodiment 1, except that the first insulating coating layer coating in A1, the second insulating coating coating coating in A2, and the electromagnetic wave reflection coating in A3 The component ratio of the electromagnetic wave absorbing coating coating in the coating and A4:

[0106] The ratios of the raw materials for the acrylic resin I obtained in A1 are different, and the additions of acrylic acid, methyl acrylate, acrylonitrile, butyl acrylate, and isobornyl acrylate are respectively 10, 30, 60, 30, and 10 parts; The amounts of pigment carbon black, titanium dioxide and silicon oxide added to the acrylic resin I were 20%, 10%, and 15% respectively.

[0107] The ratios of raw materials for the acrylic resin II obtained in A2 are different, and the addition amounts of acrylic acid, ethyl acrylate, butyl methacrylate, and acry...

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Abstract

The invention provides a novel FPC composite electromagnetic shielding film and a preparation method thereof. The method comprises the following steps: 1) preparing coating materials of a first insulation paint layer, a second insulation paint layer, an electromagnetic wave reflection coating layer and an electromagnetic wave absorbing coating layer; and 2) carrying out coating, wherein the firstinsulation paint layer is a wear-resisting coating, wear resistance being larger than 1000 times; the second insulation paint layer is a high-filling and high-toughness coating, bending resistance times being larger than 80000; the coating material of the electromagnetic wave reflection coating layer comprises reflection layer matrix resin and metal fillers, the metal fillers being flake silver-clad glass or flake silver-clad copper powders or leaf-like silver-clad copper powders or dendritic silver-clad copper powders; the ratio of the matrix resin and the metal fillers of the electromagneticwave reflection coating layer is 1:1.5-1:5; the electromagnetic wave absorbing coating layer comprises absorbing layer matrix resin and wave absorbing materials; the carrier film is a matte release film. The novel FPC composite electromagnetic shielding film has better flexibility, bending resistance, product flatness and shielding effect.

Description

technical field [0001] The invention relates to the technical field of electromagnetic shielding, in particular to a novel composite electromagnetic shielding film for FPC and a preparation method thereof. Background technique [0002] In the flexible printed circuit board (FPC) industry, with the upgrading of electronic devices such as smart phones and Ipads, the requirements for electromagnetic shielding are also getting higher and higher. Due to the processing technology and use requirements of FPC, the electromagnetic shielding film used on FPC must meet the following requirements: high temperature resistance (180°C, several hours, 270°C, short time), high pressure (12MPa), flexibility and bending resistance, 1000h constant temperature Constant humidity (85℃ temperature, 85% humidity), chemical resistance (acid, alkali, organic solvent), ultrasonic cleaning resistance. [0003] In the prior art, the electromagnetic shielding film has the following problems: (1) the insu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00H05K1/02C09D5/33C09D5/32C09D133/20C09D175/06C09D175/08C09D133/10C09D163/00C09D7/61
CPCC08K3/04C08K3/36C08K2003/2241C09D5/004C09D5/32C09D7/61C09D133/10C09D133/20C09D163/00C09D175/06C09D175/08H05K1/0216H05K9/0088
Inventor 刘仁成谢文波王绍亮洪腾郭磊
Owner SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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