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FPC electromagnetic shielding film with polyimide film as insulating layer and preparation method thereof

A technology of polyimide film and electromagnetic shielding film, which is applied in the direction of magnetic field/electric field shielding, coating, electrical components, etc., can solve the problems of large film thickness, metal layer cracks, poor weather resistance, etc., and achieve improved weather resistance , the effect of improving the service life

Active Publication Date: 2018-12-11
SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the electromagnetic shielding film has the following problems: (1) The insulating layer of the electromagnetic shielding film for FPC mostly uses ink or paint, but the ink or paint is easy to age and has poor weather resistance, especially in the environment of high temperature and high humidity in the south The service life of electronic products is greatly affected
Polyimide (abbreviated as PI) is the king of materials, but due to technical limitations, the thickness of the film is relatively large, and the flexibility is not good, so it cannot be used as an electromagnetic wave shielding film for electronic products.
(2) The shielding layer of the electromagnetic shielding film adopts a metal shielding layer or a conductive layer. In the subsequent complex high-temperature and high-pressure operation process of FPC, the metal layer is prone to cracks, oxidation, etc., which will reduce the shielding performance. , and even lose the shielding performance, and at the same time, it is easy to bubble and delaminate in the subsequent reflow soldering process
(3) The shielding film made of ordinary conductive adhesive is difficult to meet the needs of the FPC industry because of its low conductivity, poor continuous conduction, and poor shielding performance.

Method used

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  • FPC electromagnetic shielding film with polyimide film as insulating layer and preparation method thereof
  • FPC electromagnetic shielding film with polyimide film as insulating layer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] The manufacturing process adopted by the preparation of the FPC electromagnetic shielding film with polyimide film as insulating layer of the present invention is as follows.

[0048] The first step is to prepare the black polyimide precursor, the coating of reflective electromagnetic shielding coating and the coating of absorbing electromagnetic shielding coating, which can be prepared in the following order, but its protection scope is not limited to the following A1, A2, A3 order of.

[0049] A1, prepare black polyimide precursor;

[0050] (1) Add 4,4'-diaminodiphenyl ether (ODA for short) into the solvent of dimethylformamide (DMF for short), so that the final total solid content is less than 20%. After dissolving, cool to -10℃~ 5°C, add 4,4-biphenyl ether dianhydride (ODPA for short), pyromellitic dianhydride (PMDA for short), biphenyltetracarboxylic dianhydride (BPDA for short), 3,3'-(m- Phenyl) diether dianhydride (referred to as RsDPA), 3,3',4,4'---benzophenon...

Embodiment 2

[0070] In this embodiment, the manufacturing process of the FPC electromagnetic shielding film with polyimide film as the insulating layer is basically the same as in Example 1, except that the components and proportions of the reflective shielding coating in A2 and A3 are:

[0071] The proportioning of each raw material that makes acrylic resin III in A2 is different, and the addition amount of acrylic acid, acrylonitrile, butyl acrylate, hydroxyethyl acrylate is respectively 7,35,20,20 parts; Raw material ratio is different, bisphenol F type epoxy resin replaces bisphenol A type epoxy resin, the addition amount of acrylic resin III, bisphenol F type epoxy resin, dicyandiamide, diaminodiphenyl sulfone are 50, 10 respectively , 5, 5 copies.

[0072] Take flaky silver-coated copper powder (Mitsui Metal 1100YP, ball mill, 400 mesh sieve for use; or Fukuda Metal, 10% Agcoat Cu-HWQ 5 μm, use directly), and obtain an activated shielding slurry after ultrasonic activation of the act...

Embodiment 3

[0076] The manufacturing process of the novel composite electromagnetic shielding film for FPC in this embodiment is basically the same as in Embodiment 1, except that the composition ratio of the coating in A2 and A3 is:

[0077] The proportioning of each raw material that makes acrylic resin III in A2 is different, and the addition amount of acrylic acid, acrylonitrile, butyl acrylate, hydroxyethyl acrylate is respectively 15,50,30,30 parts; Raw material ratio is different, novolac epoxy resin replaces bisphenol A type epoxy resin, the addition amount of acrylic resin III, novolak epoxy resin, dicyandiamide, diaminodiphenyl sulfone is 70, 30, 10, 10 parts respectively.

[0078] Take flaky silver-coated copper powder with a thickness of 1-2 μm and a plane size of 3-9 μm (Mitsui Metal 1100YP, ball milled, sieved with 400 mesh for use; or Fukuda Metal, 10% Agcoat Cu-HWQ 5 μm, used directly), after The activator was ultrasonically activated for 24 hours to obtain an activated sh...

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PUM

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Abstract

The invention provides an FPC electromagnetic shielding film with a polyimide film as an insulating layer. The FPC electromagnetic shielding film comprises a PI insulating layer, a reflection type shielding coating layer and an absorption type shielding coating layer, wherein the reflection type shielding coating layer is coated to the PI insulating layer, the absorption type shielding coating layer is coated to the reflection type shielding coating layer, and a layer of release type protection film layer is arranged on the absorption type electromagnetic shielding coating layer. The inventionprovides the FPC electromagnetic shielding film with the polyimide film as the insulating layer and a preparation method thereof. The FPC electromagnetic shielding film has the advantages of better weather resistance, flexibility, bending resistance, product flatness and shielding effect.

Description

technical field [0001] The invention relates to the technical field of electromagnetic shielding, in particular to an FPC electromagnetic shielding film with a polyimide film as an insulating layer and a preparation method thereof. Background technique [0002] Printed circuit board (FPC for short) is an indispensable material in electronic products. It is widely used in computers and their peripheral equipment, communication products and consumer electronics products. As the demand for consumer electronics continues to grow, for printed circuit boards Board requirements are also increasing day by day. [0003] In the prior art, the electromagnetic shielding film has the following problems: (1) The insulating layer of the electromagnetic shielding film for FPC mostly uses ink or paint, but the ink or paint is easy to age and has poor weather resistance, especially in the environment of high temperature and high humidity in the south The service life of electronic products i...

Claims

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Application Information

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IPC IPC(8): C08J7/04C08J5/18C09D5/32C09D5/33C09D133/20C09D163/00C09D179/04C09D7/62C09D7/61C09D175/06H05K9/00C08L79/08
CPCC08J5/18C08J7/042C08J2379/08C08K2003/385C09D5/004C09D5/32C09D7/61C09D7/62C09D7/70C09D133/20C09D175/06H05K9/0081C08L63/00C08K9/10C08K7/00C08K3/40C08K3/08C08L79/04C08K3/04C08K3/22
Inventor 刘仁成谢文波王绍亮洪腾万彩兵
Owner SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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