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Treatment agent for electroplating wastewater applied to circuit boards

A technology for electroplating wastewater and treatment agent, which is used in metallurgical wastewater treatment, water/sewage treatment, water/sludge/sewage treatment, etc. problem, to achieve the effect of fast processing speed, reducing waste of iron powder, and reducing the amount of use

Inactive Publication Date: 2018-11-20
如皋宏皓金属表面水处理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing treatment agent for electroplating wastewater used on circuit boards has low treatment efficiency and slow treatment reaction speed, and the content of heavy metals after treatment still cannot meet the discharge requirements, and a large amount of iron powder is wasted in the treatment process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] A treatment agent for electroplating wastewater applied to circuit boards, comprising the following components in parts by mass: 10 parts of sodium sulfide, 3 parts of ferrous sulfate, 5 parts of sodium metabisulfite, 15 parts of diatomaceous earth, 5 parts of iron powder, wheat bran 12 parts, 3 parts of shell powder, 3 parts of sodium hydroxide, 1 part of potassium hydroxide, 3 parts of disodium edetate.

Embodiment 2

[0013] A treatment agent for electroplating wastewater applied to circuit boards, comprising the following components in parts by mass: 20 parts of sodium sulfide, 8 parts of ferrous sulfate, 15 parts of sodium metabisulfite, 20 parts of diatomaceous earth, 15 parts of iron powder, wheat bran 18 parts, 8 parts of shell powder, 8 parts of sodium hydroxide, 5 parts of potassium hydroxide, 7 parts of disodium edetate.

Embodiment 3

[0015] A treatment agent for electroplating wastewater applied to circuit boards, comprising the following components in parts by mass: 15 parts of sodium sulfide, 6 parts of ferrous sulfate, 10 parts of sodium pyrosulfite, 18 parts of diatomaceous earth, 10 parts of iron powder, wheat bran 15 parts, 5 parts of shell powder, 5 parts of sodium hydroxide, 3 parts of potassium hydroxide, 5 parts of disodium edetate.

[0016] The treatment agent for electroplating wastewater applied to circuit boards of the present invention includes sodium sulfide, ferrous sulfate, sodium pyrosulfite, diatomaceous earth, iron powder, wheat bran, shell powder, sodium hydroxide, potassium hydroxide, ethylenediaminetetra Disodium acetate; Diatomaceous earth, shell powder, wheat bran and iron powder are used as flocculants to reduce the use of iron powder and reduce the waste of iron powder; this treatment agent has a strong ability to remove heavy metals, and the treatment speed is fast. meet emissi...

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PUM

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Abstract

The invention discloses a treatment agent for electroplating wastewater applied to circuit boards. The treatment agent is characterized by being prepared from the following components in parts by mass: 10-20 parts of sodium sulfide, 3-8 parts of ferrous sulfate, 5-15 parts of sodium pyrosulfite, 15-20 parts of diatomite, 5-15 parts of ferrous powder, 12-18 parts of wheat bran, 3-8 parts of shell powder, 3-8 parts of sodium hydroxide, 1-5 parts of potassium hydroxide and 3-7 parts of ethylene diamine tetraacetic acid (EDTA). The treatment agent for the electroplating wastewater applied to the circuit boards, which comprises the sodium sulfide, the ferrous sulfate, the sodium pyrosulfite, the diatomite, the ferrous powder, the wheat bran, the shell powder, the sodium hydroxide, the potassiumhydroxide and the EDTA, has the advantages that the diatomite, the shell powder, the wheat bran and the ferrous powder are taken as flocculating agents, thereby reducing the use amount and the wasteof the ferrous powder; and the treatment agent has strong ability of removing heavy metal and high speed in treatment, and the wastewater after treatment reaches the discharge requirements.

Description

technical field [0001] The technical field of electroplating wastewater treatment of the present invention particularly relates to a treatment agent for electroplating wastewater applied to circuit boards. Background technique [0002] In the electroplating process of printed circuit boards, the metal is electrolytically plated on the surface of the product, and a large amount of wastewater will be generated during the electroplating process. There are many types of highly toxic substances contained in the wastewater, which is very harmful. of. Untreated electroplating wastewater discharged into rivers and ponds and seeped into the ground will not only endanger the environment, but also pollute drinking water and industrial water. Electroplating wastewater contains heavy metal ions such as chromium, zinc, copper, cadmium, lead, nickel, and highly toxic sundries such as acid and alkali cyanide, and some are highly toxic substances that cause cancer and distortion. Electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F1/52C02F101/20C02F103/16
CPCC02F1/5236C02F1/5263C02F2101/20C02F2103/16
Inventor 赵力锋
Owner 如皋宏皓金属表面水处理有限公司