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A copper-clad method for ptfe-based pcb copper-clad laminates

A copper clad laminate and copper clad technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problem of signal transmission and high-frequency information transmission in the copper wire of the PCB board, which has a greater impact and is easy to fall off. Or foaming and other problems, to avoid direct contact, the production process is simple, and the cost is low.

Active Publication Date: 2021-01-05
NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] A very key technology in copper clad laminates is the lamination of prepreg and copper sheets. The conventional lamination copper clad method is very easy to cause the copper sheet to be not firmly attached, so that it is easy to fall off or bubble, which affects the signal transmission in the copper wire of the PCB board. Especially for the transmission of high-frequency information, it has a greater impact

Method used

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  • A copper-clad method for ptfe-based pcb copper-clad laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The specific implementation steps are as follows:

[0025] S1: Dip the cut glass fiber cloth into the PTFE emulsion, the solid content of the PTFE emulsion is 60%, the pH value is 9.5, the immersion time is 8 minutes, and then put it into an oven for drying at 250°C. The drying time is 18 minutes;

[0026] S2: Lay the PFA film of the same size on the upper and lower surfaces of the prepreg obtained in step S1. The thickness of the film is 50 microns. When laying the film, ensure that it is flat and wrinkle-free, and then put two pieces of copper foil of the same size on the upper and lower surfaces. the outermost layer of the two film surfaces;

[0027] S3: Put the stacked structure obtained in step S2 in a vacuum hot press machine for pressing. The pressing condition is that the vacuum degree is pumped to 2×10 -3 After mbar, the temperature starts to rise. The temperature rise process is to quickly rise to 150°C in 30 minutes, then rise to 320°C in 80 minutes, and th...

Embodiment 2

[0031] The specific implementation steps are as follows:

[0032] S1: Immerse the cut glass fiber cloth into PTFE emulsion, the solid content of PTFE emulsion is 55%, the pH value is 9.5, the soaking time is 10 minutes, and then put it into an oven for drying at 250°C. The drying time is 20 minutes;

[0033] S2: Lay the FEP film of the same size on the upper and lower surfaces of the prepreg obtained in step S1. The thickness of the film is 50 microns. When laying the film, ensure that it is flat and wrinkle-free, and then put two pieces of copper foil of the same size on the upper and lower surfaces. the outermost of the two surfaces;

[0034] S3: Put the stacked structure obtained in step S2 in a vacuum hot press for pressing. The pressing condition is that the vacuum degree is 1×10 -3 After mbar, start to heat up. The temperature rise process is to quickly rise to 150°C in 50 minutes, then rise to 340°C in 150 minutes, and then keep warm for 120 minutes. The process of pr...

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Abstract

The invention discloses a copper cladding method of a PTFE-based PCB copper-clad laminate. The copper cladding method comprises the following steps of flatly laying FEP or PEA membranes on the upper surface and the lower surface of a prepreg respectively, then putting the prepreg between an upper copper laminate and a lower copper laminate for alignment connection, and then putting two copper foils with the same size on the outermost layers of the surfaces of the upper membrane and the lower membrane; and then, putting a product in a hot press, pressing various layers with proper temperature,pressure and time to form the copper clad laminate, and enabling plates to be tightly bonded. In the copper cladding method provided by the invention, through stacking and hot pressing treatment of one piece of prepreg, two pieces of FEP or PEA membranes and two pieces of copper foils, the PTFE based PCB copper clad laminate, of which the adhesion strength between each copper sheet and the prepregis obviously improved, is obtained, and a foundation of the high-preformation requirements of 5G Era on a high-frequency copper clad laminate is laid.

Description

technical field [0001] The invention relates to a copper-clad method for a PTFE-based PCB copper-clad laminate, belonging to the field of preparation of PCB copper-clad laminates. Background technique [0002] Printed Circuit Board (PCB) is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. With the continuous progress of the development of electronic information technology, the high frequency of electronic equipment is a development trend, especially with the increasing development of wireless networks and satellite communications, information products are constantly moving towards high speed and high frequency. The development of a new generation of products requires high-frequency PCB boards, especially communication products such as satellite systems and mobile phone receiving base stations must use high-frequency circuit boards. With the rapid development of these applications in the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/04B32B27/12B32B27/30B32B27/32B32B15/20B32B37/06B32B37/10
CPCB32B5/02B32B15/20B32B27/12B32B27/30B32B27/308B32B27/322B32B37/06B32B37/1009B32B2260/021B32B2260/046B32B2262/101
Inventor 张军然张勇徐永兵冯澍畅王倩
Owner NANJING UNIV