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Polyether-based polymer compositions and sheets

A polymer and composition technology, applied in the field of polyether polymer composition, can solve the problems of insufficient electrical conductivity, agglomeration of conductive fillers, deterioration of dispersibility, etc., and achieve excellent long-term stability

Active Publication Date: 2021-05-14
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a method of improving the heat dissipation performance of thermally conductive sheets and thermally conductive greases, the usual method is to increase the thermal conductivity of these, but there is the following problem: when a large amount of thermally conductive filler is filled in the polymer to improve thermal conductivity, The dispersibility of the thermally conductive filler in the thermally conductive sheet or thermally conductive grease will deteriorate; Condensation, it will become unable to exert sufficient thermal conductivity
In this regard, there is a problem that when a large amount of conductive filler is filled in the polymer in order to improve the conductivity, the dispersibility of the conductive filler in the conductive paste or conductive ink will deteriorate; or, even in The dispersibility of the conductive filler is good at the beginning of use, but when used for a long time, the conductive fillers will coagulate with each other, and it will not be able to exhibit sufficient conductive performance
Moreover, such problems also occur in conductive sheets used for various conductive purposes.

Method used

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  • Polyether-based polymer compositions and sheets
  • Polyether-based polymer compositions and sheets
  • Polyether-based polymer compositions and sheets

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0079] Hereinafter, the present invention will be further described based on detailed examples, but the present invention is not limited to these examples. In addition, in the following, "parts" are based on weight unless otherwise specified. In addition, tests and evaluations are as follows.

[0080] (1) Number of repeating units, number-average molecular weight (Mn), and molecular weight distribution (Mw / Mn) of polyether-based polymers

[0081] The number-average molecular weight (Mn) and molecular weight distribution (Mw / Mn) of polyether-based polymers that do not contain cationic groups can be determined as polyphenylene by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent. The number average molecular weight (Mn) and molecular weight distribution (Mw / Mn) of the polyether polymer were measured in terms of ethylene. In addition, HLC-8320 (manufactured by Tosoh Corporation) was used as a measuring device, a column in which two TSKgelα-M (manufactured b...

manufacture example 1

[0099] (Synthesis of polyether polymer A)

[0100] Into a glass reactor equipped with a stirrer replaced with argon, 0.161 g of tetra-n-butylammonium bromide and 100 ml of toluene were added, followed by cooling to 0°C. Next, what dissolved 0.086 g of triethylaluminum (1.5 equivalent with respect to tetra-n-butylammonium bromide) in 10 ml of n-hexane was added, and it was made to react for 15 minutes, and the catalyst composition was obtained. 35.0 g of epichlorohydrin was added to the obtained catalyst composition, and the polymerization reaction was performed at 0 degreeC. After the polymerization reaction started, the viscosity of the solution gradually increased. After reacting for 12 hours, a small amount of water was injected into the polymerization reaction solution to stop the reaction. The obtained polymerization reaction solution was washed with a 0.1N aqueous hydrochloric acid solution to deash the catalyst residue, and after washing with ion-exchanged water, the ...

manufacture example 2

[0102] (Synthesis of Polyether Polymer B Containing an Imidazolium Structure)

[0103] 5.0 g of the polyether-based polymer A obtained in Production Example 1, 12.1 g of 1-methylimidazole, and 10.0 g of acetonitrile were added to a glass reactor equipped with a stirrer replaced with argon, and heated to 80°C. After making it react at 80 degreeC for 48 hours, it cooled to room temperature, and stopped reaction. After washing the obtained reactant with an equal weight mixed solution of toluene / methanol / water, the organic phase containing 1-methylimidazole and toluene was removed, and the aqueous phase was dried under reduced pressure at 50°C for 12 hours to obtain a light red solid 6.8g. For this solid, do 1 As a result of H-NMR measurement and elemental analysis, a part of the chlorine groups in the repeating unit of the polyether polymer A (polyepichlorohydrin) as the starting material was replaced by 1-methylimidazole having a chloride ion as a counter anion. Substituted b...

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Abstract

The present invention provides a polyether-based polymer composition containing 200 parts by weight or more of a metal-containing powder relative to 100 parts by weight of a polyether-based polymer containing epoxy monomer units. According to the present invention, it is possible to provide a polyether-based polymer composition capable of appropriately exhibiting various properties of metal-containing powders such as high thermal conductivity and high electrical conductivity, and having excellent long-term stability.

Description

technical field [0001] The present invention relates to a polyether-based polymer composition capable of properly exhibiting various properties of metal-containing powders such as high thermal conductivity and high electrical conductivity, and having excellent long-term stability, and to a polyether-based polymer composition using such a polyether-based polymer composition. A sheet made of a composition. Background technique [0002] Along with miniaturization and higher output of heat-generating electronic components such as semiconductor elements, the amount of heat per unit area generated by electronic components has become extremely large. On the other hand, an increase in temperature of heat-generating electronic components such as semiconductor elements leads to a decrease in performance, so cooling is required. Cooling of a heat-generating electronic component can be performed, for example, by providing a cooling member such as a metal heat sink next to such a heat-g...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/02C08K3/08C08K3/20C08K3/28H01B1/22
CPCC08K3/08H01B1/22C08K2201/001C08K2003/0806C08K2003/085C08K2003/385C08K2201/005C08K3/10C08K3/22C08L71/02C08K3/38C08K2003/2296C08K3/28C08K3/20
Inventor T·B·霍昂早野重孝太田圭祐
Owner ZEON CORP
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