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Metal micro-pass heat exchanger and preparation method based on uv-liga technology

A UV-LIGA and micro-channel heat exchanger technology, applied in the field of metal micro-pass heat exchanger and preparation based on UV-LIGA technology, can solve the problems of inability to apply processing and forming, silicon-based etching can not be applied, etc., to achieve forming Stable process, good heat dissipation effect and good sealing reliability

Active Publication Date: 2020-04-28
CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the high-power components of electronic products are made of alloys with good stability and temperature matching, the silicon-based etching process cannot be applied to the processing and forming of such materials; channels, silicon etching and precision machining are not applicable

Method used

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  • Metal micro-pass heat exchanger and preparation method based on uv-liga technology
  • Metal micro-pass heat exchanger and preparation method based on uv-liga technology
  • Metal micro-pass heat exchanger and preparation method based on uv-liga technology

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preparation example Construction

[0037] to combine Image 6 , a kind of metal microchannel heat exchanger preparation method based on UV-LIGA technology of the present invention, comprises the following steps:

[0038] Step S0 , pretreating the metal substrate: processing the metal substrate so that the metal substrate has a flatness≯0.03 and a surface roughness≯Ra0.8; cleaning and drying.

[0039] Step S1, spin-coat the photoresist on the metal substrate to prepare a film of required thickness, and leave it to stand after each spin-coating to ensure the flatness.

[0040] Step S2, according to the layout and shape of the microchannel, a mask plate with a corresponding shape and pattern is set, an ultraviolet light source (UV) is used to expose the film covering the mask plate, and the exposed film is placed in a corresponding developing solution , until the pattern of the exposed area is completely revealed, and the metal substrate is completely exposed.

[0041] Step S3, performing copper electroforming o...

Embodiment

[0045] A method for preparing a metal microchannel heat exchanger based on UV-LIGA technology, comprising the following steps:

[0046] Step S0, pre-treat the copper substrate, mill the copper substrate and obtain the water retaining ring, the flatness of the copper plate is required to be ≯0.03, and the surface roughness is ≯Ra0.8; the front of the substrate is ground before gluing, and the sandpaper particle size is 2000# ; Then use a polishing pad to polish the ground substrate so that the surface roughness reaches the nanometer level, and stop polishing when it is mirror-bright; place the copper substrate in acetone and alcohol for ultrasonic cleaning for 15 minutes, wash and dry it with deionized water for later use .

[0047] Step S1, spin-coating photoresist on the red copper substrate: prepare a film with a total thickness of not less than 500 μm by three times of uniform coating and one exposure. The thickness of the sub-uniform glue is more than 200μm. For the third...

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Abstract

The invention discloses a UV-LIGA technology based metal micro channel heat exchanger and a preparation method. Photoresist spinning is performed on a metal substrate so that an adhesive film of the needed thickness is prepared; according to the layout and shape of a micro channel, a mask plate of a corresponding shape pattern is arranged, an ultraviolet source is adopted for covering the adhesivefilm of the mask plate for exposure treatment, the exposed adhesive film is arranged in a corresponding developing solution till the pattern at the exposure region is completely developed, and the metal substrate is exposed; electric copper casting molding is performed on the developed adhesive film graphic field; needed metal micro channels and reinforcing ribs are obtained on the metal substrate; the machined metal micro cover plate and the metal substrate are fixed after pre-loading; finally, the micro channel comprising the metal substrate, a metal cover plate and a plurality of sets of micrometer scales generated on the metal substrate is manufactured; according to the obtained metal micro channel heat exchanger, the surperficial area and the volume ratio of a cooling medium are increased, and the cooling efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of micromachining, in particular to a metal microfluidic heat exchanger based on UV-LIGA technology and a preparation method thereof. Background technique [0002] The reliability of electronic equipment is very sensitive to temperature conditions. Any well-designed electronic equipment will fail or fail under the action of long-term overheating and uneven thermal stress. The famous 10°C rule points out that when the temperature of electronic devices increases by 10°C at the level of 70-80°C, the reliability will drop by 50%. With the use of wide bandgap power chips, electronic equipment is developing towards high performance, high speed, and high-density integration, and its heat flux may reach the kilowatt level in the future. [0003] With the continuous maturity and development of MEMS technology, miniaturized heat exchange devices have been greatly improved and expanded in terms of heat dissipation per...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D21/00F28F21/08
CPCF28D21/00F28D2021/0028F28F21/089
Inventor 吕辉周华王仁彻严战非沈涛
Owner CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST