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Double-layer coated metal powder as well as preparation method and application thereof

A metal powder, double-layer coating technology, which is applied in metal processing equipment, metal material coating technology, coating, etc., can solve the problems of affecting the conductivity of conductive paste, easy migration of silver ions, and decrease in conductivity. To achieve the effect of ensuring uniform density, good protection, and avoiding oxidation

Active Publication Date: 2018-11-30
宁波柔创纳米科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In terms of conductivity, metal powders have better conductivity; in terms of stability, precious metals are relatively stable but expensive; although silver is relatively cheap, silver ions are easy to migrate and cause a decrease in conductivity; common metal powders such as copper, Iron, aluminum, etc. have good conductivity, but are easily oxidized, which affects the conductivity of the conductive paste

Method used

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  • Double-layer coated metal powder as well as preparation method and application thereof
  • Double-layer coated metal powder as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] The present embodiment provides a kind of double-coated silver powder, and the surface of the silver powder is coated with TiO 2 cladding layer, TiO 2 The surface of the cladding layer is covered with a conductive carbon layer.

[0049] where TiO 2The thickness of the coating layer is 1-4nm, and the thickness of the conductive carbon layer is 1-50nm.

[0050] The present embodiment also provides the preparation method of the above-mentioned double-coated silver powder, comprising the steps of:

[0051] 1) Put the silver powder into a porous container with micropore size, place the porous container in the reaction chamber, evacuate the reaction chamber, and replace the nitrogen at least three times to remove the oxygen and water between the particles or in the pores to avoid residual react with the precursor gas; the temperature of the reaction chamber is raised to 25°C, and the pressure of the reaction chamber is maintained at 100torr;

[0052] 2) Rotate the porous ...

Embodiment 2

[0061] This embodiment provides a double-coated copper powder, the surface of the copper powder is coated with AlF 3 cladding layer, AlF 3 The surface of the cladding layer is covered with a conductive carbon layer.

[0062] where AlF 3 The thickness of the coating layer is 1-4nm, and the thickness of the conductive carbon layer is 1-50nm.

[0063] The present embodiment also provides a method for preparing the above-mentioned double-coated copper powder, comprising the following steps:

[0064] 1) Put the copper powder into a porous container with micropore size, place the porous container in the reaction chamber, evacuate the reaction chamber and replace the nitrogen at least three times, remove the oxygen and water between the particles or in the pores, and avoid The residue reacts with the precursor gas; the temperature of the reaction chamber is raised to 350°C, and the pressure of the reaction chamber is maintained at 10torr;

[0065] 2) The argon fluidization method...

Embodiment 3

[0074] This embodiment provides a double-coated aluminum powder. The surface of the aluminum powder is coated with a TiN coating layer, and the surface of the TiN coating layer is coated with a conductive carbon layer.

[0075] Wherein the thickness of the TiN cladding layer is 1-50 nm, and the thickness of the conductive carbon layer is 1-50 nm.

[0076] This embodiment also provides a method for preparing the above-mentioned double-coated aluminum powder, comprising the following steps:

[0077] 1) Put the aluminum powder into a porous container with micropore size, place the porous container in the reaction chamber, evacuate the reaction chamber and replace the nitrogen at least three times, remove the oxygen and water between the particles or in the pores, and avoid The residue reacts with the precursor gas; the temperature of the reaction chamber is raised to 150°C, and the pressure of the reaction chamber is maintained at 10torr;

[0078] 2) The argon fluidization metho...

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Abstract

The invention belongs to the technical field of composite materials, and particularly relates to double-layer coated metal powder. The surface of the metal powder is coated with an inorganic coating layer; and the surface of the inorganic coating layer is coated with an electric conduction carbon layer. The invention further provides a preparation method of the double-layer coated metal powder. The preparation method comprises the following steps: 1, placing the metal powder in a porous container, vacuumizing a reaction chamber and replacing nitrogen; 2, dispersing the metal powder; 3, adopting ALD to form the inorganic coating layer on the surface of the metal powder; 4, adopting MLD to form an organic coating layer on the surface of the inorganic coating layer; and 5, after carbonizationin vacuum, carrying out carbonization on the organic coating layer to form the electric conduction carbon layer, and then carrying out thermal treatment to obtain the double-layer coated metal powder. The invention further provides application of the double-layer coated metal powder. The double-layer coated metal powder is used as the electric conduction ingredient of electric conduction slurry.According to the double-layer coated metal powder, inorganic-organic double-layer coating is formed on the surface of the metal powder, so that the metal powder is prevented from being oxidized, and the electrical conductivity of the electric conduction slurry is not affected.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and in particular relates to a double-coated metal powder and its preparation method and application. Background technique [0002] Conductive paste is mainly used in the manufacture of thick film integrated circuits, sensitive components, capacitors, batteries, wiring boards, electromagnetic shielding and other fields, and is the key material for packaging, electrodes and interconnection. The conductive components in the conductive paste are generally composed of graphite powder, gold, silver, copper, palladium, platinum, and ruthenium powder. In terms of electrical conductivity, metal powders have better electrical conductivity; in terms of stability, noble metals are relatively stable but expensive; although silver is relatively cheap, silver ions are easy to migrate and lead to a decrease in conductivity; common metal powders such as copper, Iron, aluminum, etc. have better condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C16/06C23C16/22C23C16/455C23C16/56H01B1/16H01B1/22
CPCH01B1/16H01B1/22C23C16/06C23C16/22C23C16/455C23C16/45553C23C16/45555C23C16/56B22F1/16
Inventor 解明
Owner 宁波柔创纳米科技有限公司
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