Silicon material cleaning method
A silicon material and pickling technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low silicon material purity, low cleanliness, affecting product performance, etc., to achieve high silicon yield and cleanliness The effect of high degree and product performance improvement
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Embodiment 1
[0043] Silicon material cleaning method comprises the steps:
[0044] a. Grinding: Grinding the surface of the silicon material raw material to remove obvious metal oxides and other attachments on the surface of the silicon material; grinding includes primary grinding and secondary grinding; the primary grinding is polished by a special shot blasting machine; the secondary grinding is The product polished by a special shot blasting machine is manually polished again by an angle grinder. Remove obvious metal oxides and other attachments on the surface of silicon materials;
[0045] b. pickling: the product of step a is quickly immersed in the pickling mixed solution for pickling corrosion, the pickling time is 50s, and the pickling mixed solution is a mixed solution of concentrated nitric acid and mass percentage concentration of 10% hydrofluoric acid, wherein The mass ratio of the two is 5:1, and the metal pollutants on the silicon material are cleaned by pickling;
[0046] ...
Embodiment 2
[0052] Silicon material cleaning method comprises the steps:
[0053] a. Grinding: Grinding the surface of the silicon material raw material to remove obvious metal oxides and other attachments on the surface of the silicon material; grinding includes primary grinding and secondary grinding; the primary grinding is polished by a special shot blasting machine; the secondary grinding is The product polished by a special shot blasting machine is manually polished again by an angle grinder. Remove obvious metal oxides and other attachments on the surface of silicon materials;
[0054] b. pickling: the product of step a is quickly immersed in the pickling mixed solution for pickling corrosion, the pickling time is 50s, and the pickling mixed solution is a mixed solution of concentrated nitric acid and mass percentage concentration of 10% hydrofluoric acid, wherein The mass ratio of the two is 5:1, and the metal pollutants on the silicon material are cleaned by pickling;
[0055] ...
Embodiment 3
[0061] Silicon material cleaning method comprises the steps:
[0062] a. Grinding: Grinding the surface of the silicon material raw material to remove obvious metal oxides and other attachments on the surface of the silicon material; grinding includes first-level grinding and second-level grinding; the first-level grinding is polished by a special shot blasting machine; the second-level grinding is The product polished by a special shot blasting machine is manually polished again by an angle grinder. Remove obvious metal oxides and other attachments on the surface of silicon materials;
[0063] b. pickling: the product of step a is quickly immersed in the pickling mixed solution for pickling corrosion, the pickling time is 60s, and the pickling mixed solution is a mixed solution of concentrated nitric acid and mass percentage concentration of 10% hydrofluoric acid, wherein The mass ratio of the two is 5:1, and the metal pollutants on the silicon material are cleaned by pickli...
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