Silicon material cleaning method

A silicon material and pickling technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low silicon material purity, low cleanliness, affecting product performance, etc., to achieve high silicon yield and cleanliness The effect of high degree and product performance improvement

Active Publication Date: 2018-12-18
江苏京尚圆电气集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Common particulate impurities include silicon nitride powder, dust, and fine sand; organic impurities exist in various forms on silicon materials, such as human skin oil, anti-rust oil, lubricating oil, rosin, wax, etc.; metal pollutants It exists on the silicon material in three surface forms of van der Waals attraction, covalent bond and electron transfer, which has a great impact on the minority carrier lifetime of the silicon ingot and will reduce the minority carrier lifetime
The cleanliness of silicon materials directly affects the performance of products using silicon materials as raw materials, such as solar cells; traditional silicon materials are mainly cleaned by pickling, but the acidic process is only good for cleaning metal pollutants, and for sticky Organic matter such as oil stains and fingerprints attached to the surface of polysilicon materials cannot be removed, nor can impurities such as boron and phosphorus with large segregation coefficients be removed
It can be seen that the traditional polysilicon material cleaning method has a low degree of cleanliness. The low degree of cleanliness and the low purity of the cleaned silicon material have seriously affected the performance of products using silicon material as raw material.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Silicon material cleaning method comprises the steps:

[0044] a. Grinding: Grinding the surface of the silicon material raw material to remove obvious metal oxides and other attachments on the surface of the silicon material; grinding includes primary grinding and secondary grinding; the primary grinding is polished by a special shot blasting machine; the secondary grinding is The product polished by a special shot blasting machine is manually polished again by an angle grinder. Remove obvious metal oxides and other attachments on the surface of silicon materials;

[0045] b. pickling: the product of step a is quickly immersed in the pickling mixed solution for pickling corrosion, the pickling time is 50s, and the pickling mixed solution is a mixed solution of concentrated nitric acid and mass percentage concentration of 10% hydrofluoric acid, wherein The mass ratio of the two is 5:1, and the metal pollutants on the silicon material are cleaned by pickling;

[0046] ...

Embodiment 2

[0052] Silicon material cleaning method comprises the steps:

[0053] a. Grinding: Grinding the surface of the silicon material raw material to remove obvious metal oxides and other attachments on the surface of the silicon material; grinding includes primary grinding and secondary grinding; the primary grinding is polished by a special shot blasting machine; the secondary grinding is The product polished by a special shot blasting machine is manually polished again by an angle grinder. Remove obvious metal oxides and other attachments on the surface of silicon materials;

[0054] b. pickling: the product of step a is quickly immersed in the pickling mixed solution for pickling corrosion, the pickling time is 50s, and the pickling mixed solution is a mixed solution of concentrated nitric acid and mass percentage concentration of 10% hydrofluoric acid, wherein The mass ratio of the two is 5:1, and the metal pollutants on the silicon material are cleaned by pickling;

[0055] ...

Embodiment 3

[0061] Silicon material cleaning method comprises the steps:

[0062] a. Grinding: Grinding the surface of the silicon material raw material to remove obvious metal oxides and other attachments on the surface of the silicon material; grinding includes first-level grinding and second-level grinding; the first-level grinding is polished by a special shot blasting machine; the second-level grinding is The product polished by a special shot blasting machine is manually polished again by an angle grinder. Remove obvious metal oxides and other attachments on the surface of silicon materials;

[0063] b. pickling: the product of step a is quickly immersed in the pickling mixed solution for pickling corrosion, the pickling time is 60s, and the pickling mixed solution is a mixed solution of concentrated nitric acid and mass percentage concentration of 10% hydrofluoric acid, wherein The mass ratio of the two is 5:1, and the metal pollutants on the silicon material are cleaned by pickli...

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PUM

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Abstract

The invention discloses a silicon material cleaning method, belongs to the technical field of semiconductor silicon materials, and solves the problems that cleanness of a traditional silicon materialcleaning method is not high, the purity of a cleaned silicon material is not high, and the performance of a product using a silicon material as a raw material is seriously affected. The method mainlyincludes grinding, acid washing, alkali washing, cleaning, wet oxygen impurity removal, washing and drying and other operational processes. The invention has high cleanliness and high purity of the cleaned silicon material, and the high-purity silicon material greatly improves the performance of the product using the silicon material as a raw material. The silicon obtaining rate is high, the silicon material running away in the cleaning process can be recycled, the effects of low carbon, energy saving and environment protection are achieved, considerable economic and social benefits can be created for enterprises, and thus the silicon material cleaning method is of great significance in the technical field of semiconductor silicon material.

Description

technical field [0001] The invention belongs to the technical field of semiconductor silicon materials, and in particular relates to a method for cleaning silicon materials. Background technique [0002] The purpose of cleaning the silicon material is to make the surface of the silicon material clean and free from impurity pollution, so as to ensure the purity of the silicon material, ensure the quality of the silicon material, and prevent pollutants from affecting the quality of products that use silicon material as raw material. According to the causes of pollutants, they can be roughly divided into particulate impurities, organic impurities, metal pollutants and other impurities with large segregation coefficients. Common particulate impurities include silicon nitride powder, dust, and fine sand; organic impurities exist in various forms on silicon materials, such as human skin oil, anti-rust oil, lubricating oil, rosin, wax, etc.; metal pollutants It exists on the silic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02052
Inventor 吴泊岸
Owner 江苏京尚圆电气集团有限公司
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