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Modified maleimide resin composition and prepreg and laminate prepared therefrom

A technology of maleimide resin and maleimide, applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., can solve problems such as seepage, affecting the comprehensive performance of the board, and low viscosity

Active Publication Date: 2018-12-21
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high molecular weight siloxanes have poor compatibility with compounds such as epoxy resins, and the adhesion force drops significantly; low molecular weight siloxanes have little or no reactivity due to their low viscosity. Very prone to bleeding during curing
[0006] JP2016028163 discloses a resin composition comprising maleimide compound, silicone compound, amine compound and thermosetting resin; but in this reaction, maleimide compound, silicone compound, amine compound and thermosetting resin are mixed simultaneously When preparing the resin composition, the silicone oil with epoxy groups will migrate out of the board due to reactivity and viscosity problems when used directly, thus affecting the overall performance of the board

Method used

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  • Modified maleimide resin composition and prepreg and laminate prepared therefrom
  • Modified maleimide resin composition and prepreg and laminate prepared therefrom
  • Modified maleimide resin composition and prepreg and laminate prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0139] Add 100g of solvent N,N-dimethylformamide, 60 parts of bis(4-maleimidephenyl)methane, and 20 parts of diaminodiphenylmethane into a 500ml four-necked flask with a reflux device, at 110°C The maleimide-modified aromatic amine was prepared by reacting for 120 minutes, and then 20 parts of a diepoxide-terminated siloxane compound (X-22-163A, manufactured by Shin-Etsu Chemical) was added, and the reaction was continued at 110° C. for 120 minutes to obtain Epoxy siloxane modified maleimide prepolymer Y 1 .

[0140] The double bond in the above-mentioned maleimide compound and the amino equivalent ratio in the aromatic amine compound are 0.83;

[0141] The equivalent ratio of the epoxy group in the epoxy group-terminated silicone oil compound to the amino group in the aromatic amine compound is 0.05.

Synthetic example 2

[0143] In a 500m1 four-necked flask with a reflux device, add 100g of solvent propylene glycol methyl ether, 50 parts of 2,2-bis[4-(4-maleimidephenoxy-phenyl]propane (BMI-80, Japan KI group ), 20 parts of 3,3'-diethyl-4,4'-diaminodiphenylmethane (KARAYARDA-A, manufactured by Nippon Kayaku), reacted at 110°C for 240min to prepare maleimide modified Aromatic amine, then add 30 parts of epoxy-terminated siloxane compound (X-22-163A, manufactured by Shin-Etsu Chemical Co., Ltd.), and continue the reaction at 110°C for 240min to obtain epoxysiloxane-modified maleimide Prepolymer Y 2 .

[0144] The double bond in the above-mentioned maleimide compound and the amino equivalent ratio in the aromatic amine compound are 0.55;

[0145] The equivalent ratio of the epoxy group in the above-mentioned diepoxy group-terminated silicone oil compound to the amino group in the aromatic amine compound is 0.09.

Synthetic example 3

[0147]Add 100 g of solvent propylene glycol methyl ether in the 500 ml four-necked flask with reflux device, 55 parts of biphenyl novolac type polyfunctional bismaleimide resins (MIR-3000, manufactured by Nippon Kayaku), 2,2-bis[4- 25 parts of (4-aminophenoxy)phenyl]propane were reacted at 110°C for 240min to obtain maleimide-modified aromatic amines, and then the diepoxy-terminated siloxane compound (X-22- 163B, manufactured by Shin-Etsu Chemical) 20 parts, continue to react at 110°C for 240min to obtain epoxysiloxane-modified maleimide prepolymer Y 3 .

[0148] The double bond in the above-mentioned maleimide compound and the amino equivalent ratio in the aromatic amine compound are 1.64;

[0149] The equivalent ratio of the epoxy group in the epoxy group-terminated silicone oil compound to the amino group in the aromatic amine compound is 0.09.

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Abstract

The invention provides a modified maleimide resin composition, which is prepared from epoxy siloxane-modified maleimide prepolymer, thermosetting resin, and inorganic filler; maleimide compound and aromatic amine compound react in advance, so that maleimide-modified aromatic amine compound is prepared, epoxy siloxane is then added into the maleimide-modified aromatic amine compound to react, and thereby the epoxy siloxane-modified maleimide prepolymer is obtained. The invention further provides a prepreg prepared from the modified maleimide resin composition and a laminate prepared by laminating the prepregs. The modified maleimide resin composition and the prepreg and the laminate prepared therefrom which are provided by the invention have the advantages of low thermal expansibility, highbinding property, high heat resistance, excellent reactivity, low moisture absorption rate and high flame-retardant property, can be applied in the field of IC (integrated circuit) packages, such asCSP (Chip Scale Package), PoP and SIP (System in Package), and have a broad application prospect.

Description

technical field [0001] The technical field of electronic materials of the present invention particularly provides a modified maleimide resin composition and a prepreg and a laminate prepared therefrom. Background technique [0002] The continuous development of miniaturization and multi-functionalization of electronic products and the continuous improvement of operating speed require the continuous improvement of chip integration and chip packaging technology. ) put forward higher requirements. If the CTE difference between the semiconductor element and the substrate is too large, the difference in CTE will easily cause the substrate to warp under heated conditions, resulting in serious problems such as poor connection between the semiconductor element and the substrate and between the substrate and the PCB. Therefore, the substrate material requires a lower X / Y axis CTE. [0003] At present, the main ways to reduce the X / Y axis CTE are the use of high aromatic density res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L63/00C08L79/04C08L61/34C08L71/00C08K7/14B32B15/088
CPCB32B15/088B32B2307/306B32B2307/3065C08L79/04C08L79/08C08L2201/02C08L2201/08C08L2203/20C08L2205/03C08L63/00C08K7/14C08L61/34C08L71/00
Inventor 黄荣辉戴善凯谌香秀崔春梅
Owner SHENGYI TECH SUZHOU
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