Direct-writing preparation method of high-flexibility organic electrode

An organic electrode and highly flexible technology, applied in the direction of additive manufacturing, manufacturing tools, manufacturing auxiliary devices, etc., can solve the problems of affecting electrode stability, affecting conductivity, and complicated operation, so as to save raw material costs, not easy to peel off and loose, Electrode Dimensionally Precise Effect

Active Publication Date: 2019-01-04
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] All of the above methods can prepare electrodes, but there are common problems such as expensive raw materials, poor dimensional accuracy, and complicated operations.
And most of them use metal materials as conductive materials, and the compatibility of metal materials with polymer, inorganic and other film matrix materials is poor
Under the action of externa...

Method used

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  • Direct-writing preparation method of high-flexibility organic electrode
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  • Direct-writing preparation method of high-flexibility organic electrode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Use Soildworks software to build a 20mm×20mm×0.5mm film electrode 3D model, and use Cura software to slice the established 3D model. The slice parameters are: layer thickness 0.01 mm, number of printing layers is 50 layers, and the needle tip moving speed is set at 30 mm / s, the trajectory is woven with non-woven fabric. Weigh 0.6 g of conductive polyaniline and dissolve it in 8.1 g of N-methylformamide, seal and ultrasonically disperse for 3 h, weigh 0.4 g of polyvinylidene fluoride and 0.9 g of acetone, add to the above PANI solution and seal for 3 h to prepare a mixture containing 6wt%PANI, 4wt%PVDF and 9wt% acetone printing ink; draw 3 mL of printing ink with a syringe, and assemble the needle; connect the positive pole of the high-voltage DC power supply to the needle, connect the negative pole of the high-voltage DC power supply to the copper plate at the bottom of the base plate, and fix the needle tube , after adjusting the distance between the needle and the bo...

Embodiment 2

[0033] Use Soildworks software to build a 3D model of a circular thin-film electrode with a diameter of 20 mm and a thickness of 1 mm. Use Cura software to slice the established 3D model. The slice parameters are: layer thickness 0.01 mm, number of printing layers is 100 layers, and needle tip movement is set. The speed is 30mm / s, and the motion trajectory is set as concentric circles. Weigh 1.5 g conductive polyaniline and dissolve in 6.8 g N-methylformamide (DMF), seal and ultrasonically disperse for 3 h, weigh 0.8 g polyvinylidene fluoride and 0.9 g acetone into the above PANI solution and seal for 3 h, Prepare printing ink containing 15wt% PANI, 8wt% PVDF and 9wt% acetone; draw 3 mL of printing ink with a syringe, assemble a needle, connect the positive pole of the high-voltage DC power supply to the needle, and connect the negative pole of the high-voltage DC power supply to the copper plate at the bottom of the bottom plate. Fix the needle tube, adjust the distance betwe...

Embodiment 3

[0035] Use Soildworks software to build a 3D model of a circular thin-film electrode with a diameter of 20 mm and a thickness of 1 mm. Use Cura software to slice the established 3D model. The slice parameters are: layer thickness 0.01 mm, number of printing layers is 100 layers, and needle tip movement is set. The speed is 30mm / s, and the motion trajectory is set as concentric circles. Weigh 1.0 g of conductive polyaniline and dissolve it in 7.5 g of N-methylformamide (DMF), seal and ultrasonically disperse for 3 h, weigh 0.6 g of polyvinylidene fluoride and 0.9 g of acetone into the above PANI solution and seal for 3 h. , prepared as printing ink containing 10wt% PANI, 6wt% PVDF and 9wt% acetone; draw 3 mL of printing ink with a syringe, assemble a needle, connect the positive pole of the high-voltage DC power supply to the needle, and connect the negative pole of the high-voltage DC power supply to the copper plate at the bottom of the bottom plate . After fixing the needle...

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Abstract

The invention belongs to the field of preparation of piezoelectric thin film materials and relates to a direct-writing preparation method of a high-flexibility organic electrode. The method comprisesthe specific steps that firstly, a piezoelectric thin film 3D model is established and cut into a slice; then, multi-wall carbon nanotubes are weighed and mixed with an N-methylformamide solution, themixed solution is subjected to ultrasonic dispersion to be uniform, and a precursor solution is obtained; polyaniline, polyvinylidene fluoride and acetone are added, sealing and ultrasonic dissolvingare conducted until complete dissolution is achieved, and writing ink is obtained; finally, a writing process and technology are set, a writing program is started, and the organic electrode is obtained. According to the direct-writing preparation method of the organic electrode, on the basis of guaranteeing smooth printing, the high-conductivity and high-flexibility organic electrode can be obtained; through flexible design for a writing trajectory, shapes and patterns which cannot be obtained by a traditional technology are directly written, the writing trajectory program is controllable, the electrode size is more accurate, and the application prospect is wide.

Description

technical field [0001] The invention belongs to the field of electrode material preparation, and in particular relates to a preparation method of a direct-writing highly flexible organic electrode. Background technique [0002] With the extensive application of flexible sensors and capacitors in the field of artificial intelligence, electrodes, as a necessary component for the transmission of electrical signals, have also ushered in vigorous development. At present, the commonly used methods for preparing electrodes suitable for highly flexible smart thin film devices include physical vapor deposition methods such as sputtering, evaporation, chemical vapor deposition, sol-gel spin coating, hydrothermal methods, and screen printing. [0003] Sputtering deposition is to use the method of deposition or adsorption to prepare sputtered target atoms on the substrate to form thin film electrodes. The evaporative deposition preparation process is to directly evaporate and sublimate...

Claims

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Application Information

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IPC IPC(8): B29C64/112B29C64/30C09D11/16B33Y10/00B33Y30/00
CPCB29C64/112B29C64/30B33Y10/00B33Y30/00C09D11/16
Inventor 陈彩凤钱继龙廖林晨蔡飞翔王安东
Owner JIANGSU UNIV
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