Direct-writing preparation method of high-flexibility organic electrode

Abstract

The invention belongs to the field of preparation of piezoelectric thin film materials and relates to a direct-writing preparation method of a high-flexibility organic electrode. The method comprisesthe specific steps that firstly, a piezoelectric thin film 3D model is established and cut into a slice; then, multi-wall carbon nanotubes are weighed and mixed with an N-methylformamide solution, themixed solution is subjected to ultrasonic dispersion to be uniform, and a precursor solution is obtained; polyaniline, polyvinylidene fluoride and acetone are added, sealing and ultrasonic dissolvingare conducted until complete dissolution is achieved, and writing ink is obtained; finally, a writing process and technology are set, a writing program is started, and the organic electrode is obtained. According to the direct-writing preparation method of the organic electrode, on the basis of guaranteeing smooth printing, the high-conductivity and high-flexibility organic electrode can be obtained; through flexible design for a writing trajectory, shapes and patterns which cannot be obtained by a traditional technology are directly written, the writing trajectory program is controllable, the electrode size is more accurate, and the application prospect is wide.

Description

technical field [0001] The invention belongs to the field of electrode material preparation, and in particular relates to a preparation method of a direct-writing highly flexible organic electrode. Background technique [0002] With the extensive application of flexible sensors and capacitors in the field of artificial intelligence, electrodes, as a necessary component for the transmission of electrical signals, have also ushered in vigorous development. At present, the commonly used methods for preparing electrodes suitable for highly flexible smart thin film devices include physical vapor deposition methods such as sputtering, evaporation, chemical vapor deposition, sol-gel spin coating, hydrothermal methods, and screen printing. [0003] Sputtering deposition is to use the method of deposition or adsorption to prepare sputtered target atoms on the substrate to form thin film electrodes. The evaporative deposition preparation process is to directly evaporate and sublimate...

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Problems solved by technology

[0006] All of the above methods can prepare electrodes, but there are common problems such as expensive raw materials, poor dimensional accuracy, and complicated operations.

And most of them use metal materials as conductive materials, and the compatibility of metal materials with polymer, inorganic and other film matrix materials is poor

Under the action of external force, the deformation of the matrix will also lead to the deformation of the electrode. Even a metal electrode with excellent ductility may have microcracks inside the electrode, which increases the resistance and affects the conductivity. The gradual increase of micro-cracks leads to the final loosening of the electrode, which affects the stability of the electrode

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