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Alloy bonding wire for chip LED packaging and manufacturing method thereof

A technology of LED packaging and alloy bonding, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of unsatisfactory high temperature resistance, expensive bonding wires, and low qualification rate of devices, so as to improve bonding strength and Corrosion resistance, high qualified rate of finished products, high quality effect

Active Publication Date: 2019-10-29
河南大仑电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of the existing bonding wires such as high price, poor stability, easy oxidation of the surface, low qualified rate of devices, unsatisfactory high temperature resistance, low bonding strength and narrow application range. Alloy bonding wire for chip LED packaging and manufacturing method thereof

Method used

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  • Alloy bonding wire for chip LED packaging and manufacturing method thereof

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Embodiment 1

[0024] The alloy bonding wire for chip LED packaging proposed by the present invention uses a silver-based alloy as a matrix, and the silver-based alloy includes the following raw materials in parts by weight: 54 parts of silver, 1.4 parts of calcium, 0.3 part of samarium, 0.5 part of cerium; the surface of the substrate is coated with a protective layer, the protective layer is electroplated by a modified plating solution, and the thickness is 0.3 μm; the formula of the modified plating solution includes: palladium chloride 20g / L, 2,4-dichloroquinazoline 12g / L, 1-dodecyl imidazole 6ml / L, chitosan 2g / L, sodium dodecylbenzenesulfonate 40g / L, fumaric acid 23ml / L ;

[0025] The modified plating solution is prepared by the following method: adding chitosan to fumaric acid, ultrasonically dispersing at 40°C for 25 minutes, then adding 2,4-dichloroquinazoline and 1-dodecylimidazole, Stir at 55°C for 2 hours, then cool, add sodium dodecylbenzenesulfonate and palladium chloride in s...

Embodiment 2

[0035] The alloy bonding wire for chip LED packaging proposed by the present invention, the alloy bonding wire for chip LED packaging uses a silver-based alloy as a matrix, and the silver-based alloy includes the following raw materials in parts by weight: 60 parts of silver, 2.2 parts of calcium, 0.4 part of samarium and 0.7 part of cerium; the surface of the substrate is coated with a protective layer, and the protective layer is formed by electroplating with a modified plating solution with a thickness of 0.4 μm; the formula of the modified plating solution includes: palladium chloride 25g / L, 2,4-dichloroquinazoline 14g / L, 1-dodecyl imidazole 7ml / L, chitosan 3g / L, sodium dodecylbenzenesulfonate 50g / L, fumaric acid 26ml / L ;

[0036] The modified plating solution is prepared by the following method: adding chitosan to fumaric acid, ultrasonically dispersing at 45° C. for 20 minutes, then adding 2,4-dichloroquinazoline and 1-dodecylimidazole, Stir at 60°C for 1.5h, then cool...

Embodiment 3

[0046] The alloy bonding wire for chip LED packaging proposed by the present invention, the alloy bonding wire for chip LED packaging uses a silver-based alloy as a matrix, and the silver-based alloy includes the following raw materials in parts by weight: 65 parts of silver, 2.8 parts of calcium, 0.6 part of samarium, 0.8 part of cerium; the surface of the substrate is coated with a protective layer, and the protective layer is formed by electroplating with a modified plating solution with a thickness of 0.5 μm; the formula of the modified plating solution includes: palladium chloride 30g / L, 2,4-dichloroquinazoline 16g / L, 1-dodecyl imidazole 8ml / L, chitosan 4g / L, sodium dodecylbenzenesulfonate 60g / L, fumaric acid 28ml / L ;

[0047] The modified plating solution is prepared by the following method: adding chitosan to fumaric acid, ultrasonically dispersing at 50° C. for 15 minutes, then adding 2,4-dichloroquinazoline and 1-dodecylimidazole, Stir at 65°C for 1 hour, then cool,...

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Abstract

The invention provides an alloy bonding wire for wafer LED packaging and a manufacturing method thereof. The alloy bonding wire for wafer LED packaging takes silver-based alloy as a base body, and thesilver-based alloy comprises the following raw materials of silver, calcium, samarium and cerium; a protective layer is plated on the surface of the base body, and the protective layer is formed by electroplating through a modified plating solution; and the modified plating solution comprises palladium chloride, 2,4-phenanthroline, 1-dodecyl imidazole, chitosan, sodium dodecyl benzene sulfonate and fumaric acid. The manufacturing method of the alloy bonding wire for wafer LED packaging comprises the following steps that S1, smelting of the silver-based alloy is carried out; S2, continuous casting is carried out on the silver-based alloy; S3, drawing is carried out on a silver-based alloy rod; S4, intermediate heat treatment is carried out on the silver-based alloy wire; S5, surface cleaning is carried out on the silver-based alloy wire; S6, the protective layer is plated on the surface of the silver-based alloy wire; and S7, fine drawing is carried out. The alloy bonding wire is highin quality, good in stability, not prone to oxidize, high in device yield and wide in application range.

Description

technical field [0001] The invention relates to the technical field of alloy bonding wires, in particular to an alloy bonding wire for chip LED packaging and a manufacturing method thereof. Background technique [0002] Wire bonding is a method of using thin metal wires, using heat, pressure, and ultrasonic energy to tightly weld the metal wires and substrate pads to achieve electrical interconnection between chips and substrates and information exchange between chips. It is commonly used in the field of microelectronics. packaging material. The early bonding wires were mostly made of pure gold, but with the increasing scarcity of gold resources, the price of gold continues to rise, and the production cost of pure gold bonding wires is relatively high. In contrast, the price of pure silver wires is relatively low, and the electrical Excellent performance and good stability, so it is a good substitute for pure gold bonding wires, but pure silver wires often appear oxidized a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/06C22C1/02C22F1/14C22F1/02C25D3/50H01L33/62
CPCC22C1/02C22C5/06C22F1/02C22F1/14C25D3/50H01L33/62H01L2933/0066
Inventor 贺龙彪
Owner 河南大仑电子科技有限公司
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