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Detachable layer-forming composition and detachable layer

A technology of peeling layer and composition, applied in the direction of coating, film/sheet adhesive, pressure-sensitive film/sheet, etc., can solve the problems of difficult peeling of resin substrate, damage by peeling layer, etc., and achieve good reproducibility , the effect of improving yield and simplifying manufacturing process

Pending Publication Date: 2019-01-11
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the methods disclosed in Patent Documents 1 to 4, especially the method disclosed in Patent Document 4, there is a problem that in order to transmit laser light, it is necessary to Use a substrate with high light transmittance; laser irradiation with a relatively large energy is required to allow it to pass through the substrate and release hydrogen contained in amorphous silicon; sometimes damage the peeled layer due to laser irradiation
[0010] However, when a conventional polymer is heated to a temperature higher than Tg, it is known that the adhesiveness is improved (for example, refer to Patent Document 6), and the adhesiveness between the peeling layer and the resin substrate is improved after the heat treatment. It becomes difficult to peel the resin substrate from the base

Method used

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  • Detachable layer-forming composition and detachable layer
  • Detachable layer-forming composition and detachable layer
  • Detachable layer-forming composition and detachable layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0140] The following examples are given to illustrate the present invention in more detail, but the present invention is not limited to these examples.

[0141] [1] Abbreviation of compound

[0142] p-PDA: p-phenylenediamine

[0143] BPDA: 3,3’,4,4’-Biphenyltetracarboxylic dianhydride

[0144] PMDA: pyromellitic dianhydride

[0145] NMP: N-methyl-2-pyrrolidone

[0146] BCS: Butyl Cellosolve

[0147] [2] Determination method of weight average molecular weight and molecular weight distribution

[0148] The weight-average molecular weight (hereinafter abbreviated as Mw) and molecular weight distribution of the polymer were measured using a GPC device manufactured by JASCO Corporation (columns: KD801 and KD805 manufactured by Shodex; eluent: dimethylformamide / LiBr·H 2 O(29.6mM) / H 3 PO 4 (29.6 mM) / THF (0.1 wt %); flow rate: 1.0 mL / min; column temperature: 40° C.; Mw: standard polystyrene conversion value).

[0149] [3] Synthesis of polymer

[0150] Polyamic acid was synthe...

Synthetic example S1

[0152]

[0153] 3.218 g (30 mmol) of p-PDA was dissolved in 88.2 g of NMP. BPDA8.581g (29mmol) was added to the obtained solution, and it was made to react at 23 degreeC under nitrogen atmosphere for 24 hours. The Mw of the obtained polymer was 107,300, and the molecular weight distribution was 4.6.

Synthetic example L1

[0154]

[0155] 0.89 g (8.3 mmol) of p-PDA was dissolved in 26.4 g of NMP. BPDA2.70g (9.2mmol) was added to the obtained solution, and it was made to react at 23 degreeC under nitrogen atmosphere for 24 hours. Then, 0.17 g (1.8 mmol) of aniline was added, and it was made to react further for 24 hours. The Mw of the obtained polymer was 78,200, and the molecular weight distribution was 3.7.

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PUM

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Abstract

Provided is a detachable layer-forming composition which, for example, contains an organic solvent and a polyamic acid, both ends of which are derived from tetracarboxylic acid and sealed with an aromatic monoamine, such as the polyamic acid represented by this formula. (In the formula, X represents a tetravalent aromatic group, Y represents a divalent aromatic group, R1-R5 each independently represent a hydrogen atom, a C1-10 alkyl group, or a C6-20 aryl group, and m is a natural number.)

Description

technical field [0001] The present invention relates to a composition for forming a release layer and a release layer. Background technique [0002] In recent years, in addition to properties such as thinning and lightening, electronic devices have been required to be given functions such as being able to bend. From this point of view, it is required to use a lightweight flexible plastic substrate instead of the conventional heavy, fragile, and inflexible glass substrate. [0003] In particular, development of an active matrix type full-color TFT display panel using a lightweight flexible plastic substrate (hereinafter referred to as a resin substrate) is required for next-generation displays. [0004] Therefore, researches on the manufacturing methods of various electronic devices using resin films as substrates have begun, and for next-generation displays, researches on processes that can be transferred to existing equipment for manufacturing TFT display panels are underw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08K5/3415C09D7/40C09D179/08
CPCC09D179/08C08K5/3415C09D7/40C08G73/1017C08G73/1067C09D7/20C09J7/401C09J7/38C08G73/1032
Inventor 江原和也进藤和也
Owner NISSAN CHEM IND LTD
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