A kind of high-k thin film mos structure and its preparation and detection method
A MOS structure and thin film technology, applied in the field of microelectronics, can solve the problems of unsatisfactory performance such as conduction band offset and high temperature stability, unable to meet the needs of high-end integrated circuits, small forbidden band width, etc., and achieve easy mass production. , the effect of high band gap and low dielectric constant
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[0036] According to a preferred embodiment of the present invention, the oxygen-containing gas includes oxygen and an inert gas.
[0037] In a further preferred embodiment, the flow ratio of the inert gas to oxygen is (20-40):10, preferably (25-35):10, more preferably 30:10.
[0038] In a further preferred embodiment, the inert gas is argon.
[0039] According to a preferred embodiment of the present invention, the MOS structure further includes metal electrodes sputtered on the upper layer of the film and the lower layer of the substrate.
[0040] In a further preferred embodiment, the metal electrode is selected from one or more of gold, silver and palladium electrodes.
[0041] In a further preferred embodiment, the metal electrode is a gold electrode.
[0042] In a second aspect, the present invention provides a method for preparing a high-k thin film MOS structure, the method comprising the following steps:
[0043] Step 1, cleaning the substrate and pretreating the ta...
Embodiment 1
[0141] (1) Cut out a silicon wafer with a size of about 15mm×15mm for cleaning, dry it with nitrogen gas and quickly put it into the magnetron sputtering coating equipment (JCP500 high-vacuum multi-target magnetron sputtering coating equipment produced by Beijing Techno Technology Co., Ltd.) and fix it on the base plate of the chamber; take the gadolinium target and titanium target polished by fine sandpaper, install them on the target position, close the chamber door, and evacuate to 7×10 -4 Below Pa.
[0142] (2) When the target baffle is closed, 40 sccm of argon gas is introduced, and the power of the radio frequency power supply where the gadolinium target and the titanium target are located is adjusted to 80W, and pre-sputtering is performed to further clean the surface of the target material, and the radio frequency power supply is turned off after 20 minutes.
[0143] (3) Adjust the RF power of the gadolinium target to 20W, the RF power of the titanium target to 20W, an...
Embodiment 2
[0147] (1) Clean the quartz glass ultrasonically with acetone, dry it with nitrogen, and quickly put it on the base plate of the magnetron sputtering coating equipment (JCP500 high-vacuum multi-target magnetron sputtering coating equipment produced by Beijing Techno Technology Co., Ltd.) And fix it; take the gadolinium target and titanium target polished by fine sandpaper, install them on the target position, close the cavity door, and evacuate to 7×10 -4 Below Pa.
[0148] (2) When the target baffle is closed, 40 sccm of argon gas is introduced, and the power of the radio frequency power supply where the gadolinium target and the titanium target are located is adjusted to 80W, and pre-sputtering is performed to further clean the surface of the target material, and the radio frequency power supply is turned off after 20 minutes.
[0149] (3) Adjust the RF power of the gadolinium target to 20W, the RF power of the titanium target to 20W, and the ratio of argon and oxygen to 30:...
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Abstract
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