Method for preparing copper-graphene compound plating layer, chemical plating solution and plating solution preparation method

A technology of graphene composite and chemical plating solution, which is applied in the field of chemical plating, can solve the problems of easy agglomeration of Gr or GO, direct decomposition of the plating solution, and reduced stability of the plating solution, and achieves the advantages of easy operation, low cost and improved performance Effect
CN109252147AInactive Publication Date: 2019-01-22SHENZHEN RES INST OF WUHAN UNIVERISTY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN RES INST OF WUHAN UNIVERISTY
Publication Date
2019-01-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a method for preparing a copper-graphene compound plating layer, a chemical plating solution and a plating solution preparation method. Hydrophilic graphene oxide and a proper amount of complexing agent, stabilizer, reductant and the like are added into chemical plating solution, and a Cu-Gr compound chemical plating layer is formed on the surface of a workpiece. The invention can be used for solving the technical problem of poor workpiece surface corrosion resistance in the prior art. The method disclosed by the invention has the simpleness in operation and high repeatability, the form and the excellent performance of Gr can be kept, a wild phase function is realized in the compound plating layer so as to greatly improve plating layer performance, and the method hasa wide application prospect in fields including corrosion resistance, electronics, automobiles, chemical engineering, oceaneering, military projects and the like.
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Description

technical field

[0001] The invention belongs to the technical field of electroless plating, and in particular relates to a method for preparing a copper-graphene composite coating, an electroless plating solution and a method for preparing the plating solution. Background technique

[0002] Electroless Plating, also known as Electroless Plating or Autocatalytic Plating, is a new type of metal surface treatment technology. It refers to the method of reducing the metal ions in the solution to deposit metal on the surface of the substrate with catalytic activity and forming a dense coating under the condition of no external current, according to the principle of redox reaction, and using a suitable reducing agent. The main difference between chemical deposition (or electroless plating) and electrodeposition (electroplating) is that the electrons of chemical deposition come from the reducing agent, while the electrons of electrodeposition come from an external power supply. Com...

Claims

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