Copper alloy and application thereof

A technology of copper alloy and copper foil, which is applied in the field of copper alloy and its application, can solve the problems affecting the development of copper ornaments, poor toughness and strength, poor performance, etc., achieve high decorative application value, reduce agglomeration, and disperse Improved effect

Inactive Publication Date: 2019-02-01
RENARD FLUID INTELLIGENCE TECH JIANGSU LTD BY SHARE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, most of the copper ornaments in the prior art have poor performance, or are easy to change color and lose luster, or poor toughness and strength can easily cause ornaments to break, which has seriously affected the development of copper ornaments.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The parameters of the induction plasma powder spheroidization device are set as follows: the flow rate of the plasma generating gas is 30L / min, the protective layer gas is hydrogen, the flow rate is 80 L / min, the pressure of the synthesis chamber is 50kPa, the plasma power is 30kW, the powder delivery rate is 2kg / h, and the powder enters The location is in the middle of the high temperature zone, and the flow rate of powder feeding gas is 8 L / min.

[0047] The following copper alloy raw materials are used in weight percentage: 0.15% gold, 0.6% zinc, 1.0% magnesium, 1.0% nickel, 0.6% nano-aluminum, 0.6% nano-cobalt, and 96.05% copper.

[0048] The following steps are used to prepare decorative copper foil:

[0049] (1) Weigh gold powder, zinc powder, magnesium powder, nickel powder, nano-aluminum powder, nano-cobalt powder and copper powder by weight percentage, and set aside;

[0050] (2) Using an induction plasma powder spheroidization device, the raw material powder ...

Embodiment 2

[0057] The parameters of the induction plasma powder spheroidization device are set as follows: the plasma generating gas flow rate is 60L / min, the protective layer gas is hydrogen, the flow rate is 400 L / min, the synthesis chamber pressure is 150kPa, the plasma power is 150kW, the powder delivery rate is 15kg / h, and the powder enters The location is in the middle of the high temperature zone, and the powder feeding gas flow rate is 20 L / min.

[0058] The following copper alloy raw materials are used in weight percentage: 0.3% gold, 0.7% zinc, 1.5% magnesium, 1.5% nickel, 0.7% nano-aluminum, 0.7% nano-cobalt, and 94.6% copper.

[0059] The following steps are used to prepare decorative copper foil:

[0060] (1) Weigh gold powder, zinc powder, magnesium powder, nickel powder, nano-aluminum powder, nano-cobalt powder and copper powder by weight percentage, and set aside;

[0061] (2) Using an induction plasma powder spheroidization device, the raw material powder weighed in ste...

Embodiment 3

[0068] The parameters of the induction plasma powder spheroidization device are set as follows: the flow rate of the plasma generating gas is 30L / min, the protective layer gas is hydrogen, the flow rate is 80 L / min, the pressure of the synthesis chamber is 50kPa, the plasma power is 30kW, the powder delivery rate is 2kg / h, and the powder enters The location is in the middle of the high temperature zone, and the flow rate of powder feeding gas is 8 L / min.

[0069] The following copper alloy raw materials are used in weight percentage: 0.5% gold, 1.0% zinc, 2.0% magnesium, 2.0% nickel, 1.0% nano-aluminum, 1.0% nano-cobalt, and 92.5% copper.

[0070] The following steps are used to prepare decorative copper foil:

[0071] (1) Weigh gold powder, zinc powder, magnesium powder, nickel powder, nano-aluminum powder, nano-cobalt powder and copper powder by weight percentage, and set aside;

[0072] (2) Using an induction plasma powder spheroidization device, the raw material powder we...

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Abstract

The invention discloses a copper alloy and an application thereof. Other functional alloy components are mixed in copper raw materials, so that the glossiness, the oxidation resistance, the toughnessand the strength of the whole copper alloy are improved, the copper alloy has a wider application space, and the copper alloy is applied to the preparation of a decorative copper foil. In the preparation process, the raw materials are subjected to plasma spheroidizing, so that the raw materials are changed from a polygon to a spherical shape, the dispersity is greatly improved, the agglomeration phenomenon of raw material powder is reduced, the uniform distribution of the raw material powder in the smelting process is guaranteed, crystal grains are fine and organized, and the performance of the alloy is ensured; and the heating and cooling rates of the smelting process, namely the cooling process, are controlled again, so that the alloy components are uniform and free of segregation, the uniform performance of the prepared copper alloy decorative foil is ensured, and the copper alloy has higher decoration application value.

Description

technical field [0001] The invention relates to the technical field of alloy materials, in particular to a copper alloy and its application. Background technique [0002] Copper alloy (copperalloy) is an alloy composed of pure copper as the base and adding one or several other elements. It is mainly used to make electrical equipment such as generators, busbars, cables, switchgear, transformers, heat exchangers, pipes, and solar heating devices. Heat conduction equipment such as flat plate collectors. However, with the improvement of people's living standards, more and more ornaments are decorated with copper to enhance the texture of the ornaments. [0003] However, most of the copper ornaments in the prior art have poor performance, or are easy to change color and lose luster, or poor toughness and strength easily cause ornaments to break, which seriously affects the development of copper ornaments. [0004] Therefore, it is an urgent problem to be solved by those skill...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/02B22F1/00
CPCC22C1/02C22C9/00B22F1/065B22F1/142
Inventor 孙招辉唐清权黄胜华
Owner RENARD FLUID INTELLIGENCE TECH JIANGSU LTD BY SHARE LTD
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