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Electroless plating pretreatment composition and application thereof

A technology of composition and surface chemistry, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of large specific surface area of ​​particles, poor dispersion uniformity of diamond particles, poor deposition speed and deposition amount, etc.

Active Publication Date: 2021-07-30
GUANGDONG GUANGHUA SCI TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Existing palladium activation solution is mainly used for metal chemical deposition of circuit boards, hardware or metal decorations. The substrate to be plated is generally a plane or a metal circuit, and the specific surface area of ​​diamond particles is much larger than that of the above-mentioned plane. Experiments show that because of this huge difference, when using existing palladium activation solution in the pretreatment step (activation step) of diamond particle surface chemical plating, because the particle specific surface area is large, the initial stage of reaction is very violent, while existing palladium The formulation of the activation solution cannot always maintain the stability of the system and plating speed, resulting in poor dispersion uniformity of diamond particles in the activation solution, poor deposition rate and amount of palladium on the diamond surface, and ultimately leads to the compactness and thickness of the nickel coating. And the uniformity can not meet the industry requirements

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  • Electroless plating pretreatment composition and application thereof
  • Electroless plating pretreatment composition and application thereof
  • Electroless plating pretreatment composition and application thereof

Examples

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Effect test

preparation example Construction

[0032] Preparation of electroless plating pretreatment composition

[0033] The pretreatment composition of the present invention can be prepared according to conventional methods, and can be prepared according to the following method: weigh the compound that provides a sufficient amount of palladium ion source according to the required molar concentration, and dissolve it in the required In the hydrochloric acid aqueous solution with molar concentration, a sufficient amount of polycarboxylic acid ammonium salt and surfactant are sequentially dissolved in the above solution, and sodium hydroxide is used to adjust the pH value to ≤4, stirred evenly, and set to volume for later use.

[0034] The "ammonium polycarboxylic acid salt" in the present invention mainly refers to ammonium carboxylate salts containing multiple carboxyl groups in the molecular structure, such as ammonium salts of dicarboxylic acids, tricarboxylic acids or tetracarboxylic acids, preferably molecular Contai...

Embodiment 1-7

[0049] According to the concentration of each component in Table 1 and the preparation method of the aforementioned pretreatment composition, the composition of each example was prepared, and finally the volume was adjusted to 2 L for later use.

[0050] Table 1

[0051]

Embodiment 6、 Embodiment 8-11

[0053] According to the concentration of each component in Table 2 and the preparation method of the aforementioned pretreatment composition, the compositions of the following examples were prepared, and finally the volume was adjusted to 2 L for later use.

[0054] Table 2

[0055]

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Abstract

The invention relates to a composition for chemical plating pretreatment, which comprises a solvent and components with the following molar concentrations: palladium ion source 0.001-0.5 mol / L; polycarboxylic acid ammonium salt 0.005-2 mol / L; hydrochloric acid 0.05-5 mol / L ; Surfactant 0.001~0.5mol / L; The pH of the composition is less than or equal to 4. The composition of the present invention can be used for electroless plating pretreatment on the surface of particles, and the finally obtained plating layer has good uniformity, thickness and compactness.

Description

technical field [0001] The invention relates to the field of particle surface coating, in particular to a chemical plating pretreatment composition and application thereof. Background technique [0002] Electroless plating on the surface of particles can make the resulting particles combine the advantages of both the matrix and the metal. For example, metallized particles have good electrical conductivity, and adding them as fillers to plastic products can enable the products to obtain better antistatic and electromagnetic shielding functions. In addition, the mechanical strength of the particles coated on the surface will be greatly improved, and can be added to ceramics and wear-resistant materials as a good additive. Common particles are metal or non-metal oxides (such as SiO 2 , Al 2 o 3 , Fe 3 o 4 etc.), graphite, diamond, glass, etc. [0003] Due to its high strength and high hardness, diamond has always been used as the tool of choice for processing hard materi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/36
CPCC23C18/1879C23C18/36
Inventor 刘贤相李祥忠肖定军
Owner GUANGDONG GUANGHUA SCI TECH