High-temperature ceramic adhesive and preparation method thereof

Abstract

The invention discloses a high-temperature ceramic adhesive and a preparation method thereof. Aluminum hydroxide and phosphoric acid are adopted as raw materials to prepare an aluminum phosphate adhesive, a mixture of nano silica powder, nano titanium dioxide powder, nano zirconium dioxide powder and nano silicon nitride powder is adopted as an additive, and the aluminum phosphate adhesive is mixed with the additive to prepare the high-temperature ceramic adhesive. The preparation method comprises the following steps: diluting phosphoric acid till the mass percentage is 65%, taking the 65wt% phosphoric acid, adding into a flask, carrying out water bath heating till 80-85 DEG C, adding aluminum hydroxide under a mechanical stirring condition, and continuously heating and stirring to obtainwhite paste viscous liquid, namely the aluminum phosphate adhesive; taking the aluminum phosphate adhesive, adding into the mixture of nano silica powder, nano titanium dioxide powder, nano zirconiumdioxide powder and nano silicon nitride powder according to a ratio, and blending to obtain the adhesive. The preparation method disclosed by the invention is feasible and convenient to operate, and aprepared product has the characteristics of being good in temperature resistance, simple in curing conditions and short in curing time.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a high-temperature ceramic adhesive and a preparation method thereof. Background technique [0002] Ceramic materials are indispensable materials in people's life, modern industry and aerospace fields. In practical applications, ceramic materials have been widely used for their unique high temperature resistance, wear resistance and thermal shock resistance. At present, countries all over the world are Vigorously research and develop ceramic materials. However, the hard and brittle properties of ceramic materials make the processing performance of ceramic materials poor, and they need to be combined with other materials in practical applications to be used. [0003] At present, there are many kinds of ceramic connection technologies, which can usually be divided into the following categories: mechanical connection, welding connection, diffusion connection, and adhesive connect...

AI Technical Summary

Problems solved by technology

Adhesives can be divided into organic adhesives, inorganic adhesives and organic-inorganic hybrid adhesives according to different chemical compositions; due to the high temperature requirements of the system in the field of aerospace sealing, the highest temperature resistance of organic adhesives is only It can reach 300°C, which is far from meeting the temperature requirements of the aerospace system; the commonly used inorganic adhesives are basically limited to high-alumina cement, acid-resistant cement, etc.; these materials are industrial mass-produced building materials and refractory materials, and are used in industrial equipment. There are quite a lot of bonding between parts, and the working conditions cannot meet the requirements of use. The curing process requires long-term maintenance, which is labor-intensive and time-consuming; in addition, the bonding strength and temperature resistance of these materials are also very limited.

Images