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Preparation method and application of a photosensitive silicone resin containing polyurethane bridged polysilsesquioxane

A polysilsesquioxane and polyurethane bridging technology, which is applied in semiconductor devices, electrical components, circuits, etc., can solve unsatisfactory problems, such as the large difference in the solubility parameters of polysiloxane and polyurethane, and achieve Good flexibility and air tightness, good bonding effect

Active Publication Date: 2021-04-23
HANGZHOU NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large difference in the solubility parameters of polysiloxane and polyurethane, the results of simple blending, in-situ polymerization, and formation of interpenetrating network polymers are not satisfactory.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] (1) Add 3-isocyanatopropyltrimethoxysilane (41.056 g, 0.2mol) for about 0.5h, after the dropwise addition, react at 30°C for 4h to prepare 132.056g of acetone solution of coupling agent with polyurethane segment.

[0038] (2) Add dropwise a mixed solution of 108 g of dioxane, 10.8 g of distilled water and 0.66 g of potassium carbonate to the coupling agent with polyurethane segments obtained in (1) at 20°C, and after 2 hours of dripping, Seal it, and stir the hydrolysis-condensation reaction at 20°C for 24 h, then filter to remove potassium carbonate, and evaporate to dryness under reduced pressure to obtain 52.256 g of hydroxyl-terminated polysilsesquioxane containing polyurethane bridge.

[0039] (3) In a 2L dry and clean three-necked flask, add 52.256g of hydroxyl-terminated polysilsesquioxane containing polyurethane bridge and 27.93g of methacryloxypropyltrimethoxysilane obtained in (2), 93.05g Dimethyldimethoxysilane, 136.2 g methyltrimethoxysilane and 300 g tolue...

Embodiment 2

[0043] (1) To a clean three-neck flask containing PTMG-2000 (200 g, 0.1 mol) and 125 g tetrahydrofuran dehydrated under reduced pressure at 105°C for 2 hours, add 3-isocyanatopropyltriethoxy dropwise at 60°C Silane (49.4 g, 0.2 mol) was used for about 0.5 h. After the dropwise addition was completed, it was reacted at 60°C for 2 h, and then tetrahydrofuran was distilled off under reduced pressure to prepare 374.4 g of a tetrahydrofuran solution of a coupling agent with a polyurethane segment.

[0044] (2) Add a mixed solution of 1080g of dioxane, 10.8g of distilled water and 5.457g of sodium carbonate dropwise to the coupling agent with polyurethane segment obtained in (1) at 0°C, and seal it after 2 hours. , and stirred the hydrolysis-condensation reaction at 0° C. for 72 hours, then filtered to remove sodium carbonate, and evaporated to dryness under reduced pressure to obtain 235.6 g of hydroxyl-terminated polysilsesquioxane containing polyurethane bridges.

[0045] (3) In ...

Embodiment 3

[0049] (1) Add PTMG-1000 (50 g, 0.05 mol), PTMG-1800 (90 g, 0.05 mol), 355 g of dichloromethane and 200 g of petroleum ether to a clean three-necked flask that has been dehydrated under reduced pressure at 105 °C for 2 hours. , add 3-isocyanatopropyltrimethoxysilane (20.528 g, 0.1mol) and 3-isocyanatopropyltriethoxysilane (24.7 g, 0.1mol) dropwise at 40°C for about 0.5h, and the addition is complete After reacting at 40°C for 6 hours, 740.2 g of a solution of a coupling agent with polyurethane segments was obtained.

[0050] (2) Add a mixed solution of 100g of dioxane, 432g of distilled water and 5.457g of potassium hydroxide dropwise to the coupling agent with polyurethane segment obtained in (1) at 20°C, and after 1.5 hours of dripping, Seal it, and stir the hydrolysis-condensation reaction at 20°C for 48 hours, then filter to remove potassium hydroxide, and evaporate to dryness under reduced pressure to obtain 171.4 g of hydroxyl-terminated polysilsesquioxane containing pol...

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Abstract

The invention relates to the field of organic polymer materials. In order to solve the problems existing in the existing UV curing silicone materials, the invention proposes a method for preparing a photosensitive silicone resin containing polyurethane bridged polysilsesquioxane and its Used in the application of UV curing molded LED packaging, after the reaction of polytetramethylene ether glycol (PTMG) and trifunctional alkoxysilane with isocyanate groups, under the action of a catalyst, the hydrolysis reaction prepares polyurethane bridges linked hydroxyl-terminated polysilsesquioxane. Then, using the obtained polysilsesquioxanes containing polyurethane bridges as raw materials, UV-curable silicone resins containing polyurethane bridged polysilsesquioxanes are respectively prepared through cohydrolysis and condensation reactions. In the photosensitive silicone resin material, the polyurethane bridging segment is obtained by reacting PTMG as a raw material, and the cured product obtained after UV curing has a hardness of 60-80 Shore A, has good flexibility and excellent air tightness, and is compatible with LED The stand is well bonded.

Description

technical field [0001] The invention relates to the field of organic macromolecular materials, in particular to a UV curing molding LED packaging silicone resin containing polyurethane bridged polysilsesquioxane segments and a preparation method thereof. Background technique [0002] Usually, the LED package is packaged by dispensing the package material, and then heat-cured and molded to realize the package, which has a long production cycle and high energy consumption. The advent of ultraviolet (UV) curing LED packaging materials, after dispensing, the packaging materials can be completely cured by UV irradiation for a few minutes or even tens of seconds, realizing the packaging of LED lighting devices, which greatly reduces energy consumption and improves Productivity. However, the heat resistance and mechanical properties of existing UV-curable silicone materials need to be improved. [0003] Additionally, molded silicone possesses properties that allow it to be used t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/458C08L83/10H01L33/56
CPCC08G77/458C08L83/10H01L33/56
Inventor 杨雄发来国桥罗蒙贤李泽郝超伟
Owner HANGZHOU NORMAL UNIVERSITY