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Environment-friendly heat-conductive flame-retardant PC/ABS alloy material and preparation method thereof

An alloy material and environment-friendly technology, which is applied in the field of environment-friendly heat-conducting and flame-retardant PC/ABS alloy materials and its preparation, can solve the problem that PC/ABS alloy materials cannot have both heat-conducting and flame-retardant properties, and achieve low cost and excellent performance. Thermal conductivity, easy molding effect

Inactive Publication Date: 2019-03-08
RES INST OF ZHEJIANG UNIV TAIZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the technical problem that the current PC / ABS alloy material cannot have both excellent thermal conductivity and flame retardancy

Method used

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  • Environment-friendly heat-conductive flame-retardant PC/ABS alloy material and preparation method thereof
  • Environment-friendly heat-conductive flame-retardant PC/ABS alloy material and preparation method thereof
  • Environment-friendly heat-conductive flame-retardant PC/ABS alloy material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) The raw materials are configured according to the following mass parts: 40 parts of PC resin, 30 parts of ABS resin, 5 parts of ABS-g-MAH compatibilizer, 5 parts of talc (particle size 180nm, density 2.75g / cm3), coupling agent (Titanate) 1 part, aluminum nitride 10 parts, antimony trioxide 5 parts, polysiloxane 2 parts, plasticizer (polytrimethylene adipate) 2 parts.

[0026] (2) Dry PC resin at 90°C for 3 hours, ABS resin at 80°C for 3 hours, and talcum powder at 80°C for 3 hours.

[0027] (3) Dry the aluminum nitride at 100°C for 3 hours, add it to the epoxy resin-isopropanol methyl ether solution (epoxy resin:isopropanol methyl ether mass ratio = 1:2), at 50°C Ultrasonic oscillation was used to disperse for 5 hours, filtered, washed with alcohol, and vacuum-dried at 50° C. for 5 hours.

[0028] (4) Mechanically stir the dried talc powder and titanate for 10 min at a stirring rate of 3000 rpm.

[0029] (5) Mechanically stir the mixture in step (4) with PC resin,...

Embodiment 2

[0034] (1) The raw materials are configured according to the following mass parts: 30 parts of PC resin, 30 parts of ABS resin, 5 parts of SAN-g-MAH compatibilizer, 10 parts of silicon dioxide, 1 part of coupling agent (methoxysilane), 15 parts of aluminum nitride, 5 parts of potassium diphenyl sulfone sulfonate, 2 parts of polysiloxane, 2 parts of plasticizer (polytrimethylene adipate).

[0035] (2) Dry PC resin at 90°C for 3 hours, and dry ABS resin at 80°C for 3 hours.

[0036] (3) Dry the aluminum nitride at 100°C for 3 hours, add it to the epoxy resin-isopropanol methyl ether solution (epoxy resin:isopropanol methyl ether mass ratio = 1:2), at 50°C Ultrasonic oscillation was used to disperse for 5 hours, filtered, washed with alcohol, and vacuum-dried at 50° C. for 5 hours.

[0037] (4) Mechanically stir the silica and methoxysilane for 10 min at a stirring rate of 3000 rpm.

[0038] (5) The mixture in step (4) and PC resin, ABS resin, SAN-g-MAH, potassium diphenyl sulf...

Embodiment 3

[0043] (1) The raw materials are configured according to the following mass parts: 30 parts of PC resin, 30 parts of ABS resin, 5 parts of SAN-g-GMA compatibilizer, 5 parts of high rubber powder, 10 parts of calcium carbonate, coupling agent (titanate ) 1 part, aluminum nitride 10 parts, antimony trioxide 5 parts, polysiloxane 2 parts, plasticizer (epoxy soybean oil) 2 parts.

[0044] (2) Dry PC resin at 90°C for 3 hours, ABS resin at 80°C for 3 hours, and calcium carbonate at 80°C for 3 hours.

[0045] (3) Dry the aluminum nitride at 100°C for 3 hours, add it to the epoxy resin-isopropanol methyl ether solution (epoxy resin:isopropanol methyl ether mass ratio = 1:2), at 50°C Ultrasonic oscillation was used to disperse for 5 hours, filtered, washed with alcohol, and vacuum-dried at 50° C. for 5 hours.

[0046] (4) Mechanically stir the dried talc powder and titanate for 10 min at a stirring rate of 3000 rpm.

[0047] (5) Stir the mixture in step (4) with PC resin, ABS resin,...

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Abstract

The invention discloses an environment-friendly heat-conductive flame-retardant PC / ABS alloy material and a preparation method thereof. The environment-friendly heat-conductive flame-retardant PC / ABSalloy material comprises the raw materials of a PC resin, an ABS resin, a compatilizer, a reinforcing filler, a coupling agent, a polyester plasticizer, a thermal conductive agent, high rubber powder,a flame retardant and a synergistic flame retardant; the obtained alloy material has good thermal conductivity, heat resistance and flame retardant performance; and at the same time, a halogen-free flame retardant is selected, so that the material is environmentally friendly and free of pollution.

Description

technical field [0001] The invention relates to a polymer composite material and a preparation method thereof, in particular to an environment-friendly heat-conducting and flame-retardant PC / ABS alloy material and a preparation method thereof. Background technique [0002] PC / ABS alloy material has the advantages of both PC resin and ABS resin. It not only has the heat resistance, dimensional stability and mechanical properties of PC resin, but also has the excellent characteristics of ABS resin for easy molding and processing. Therefore, it is widely used in the machinery industry and automobile industry. , Electronic and electrical industry, instrumentation industry and construction industry and other fields have a wide range of applications. [0003] In order to broaden the application range of PC / ABS alloy materials, in many application scenarios, it is often necessary to modify them in terms of flame retardancy or heat conduction. For example, a flame-retardant PC / ABS c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L55/02C08L83/04C08K9/04C08K3/28C08K3/22C08K5/42C08K9/06C08K3/34C08K3/36C08K3/26C09K5/14
CPCC08K2003/265C08K2003/282C08L55/02C08L69/00C08L2201/02C08L2205/035C09K5/14C08L83/04C08K9/04C08K3/28C08K3/2279C08K5/42C08K9/06C08K3/34C08K3/36C08K3/26
Inventor 丁伟伟聂祝平周伯昕
Owner RES INST OF ZHEJIANG UNIV TAIZHOU