Environment-friendly heat-conductive flame-retardant PC/ABS alloy material and preparation method thereof
An alloy material and environment-friendly technology, which is applied in the field of environment-friendly heat-conducting and flame-retardant PC/ABS alloy materials and its preparation, can solve the problem that PC/ABS alloy materials cannot have both heat-conducting and flame-retardant properties, and achieve low cost and excellent performance. Thermal conductivity, easy molding effect
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Embodiment 1
[0025] (1) The raw materials are configured according to the following mass parts: 40 parts of PC resin, 30 parts of ABS resin, 5 parts of ABS-g-MAH compatibilizer, 5 parts of talc (particle size 180nm, density 2.75g / cm3), coupling agent (Titanate) 1 part, aluminum nitride 10 parts, antimony trioxide 5 parts, polysiloxane 2 parts, plasticizer (polytrimethylene adipate) 2 parts.
[0026] (2) Dry PC resin at 90°C for 3 hours, ABS resin at 80°C for 3 hours, and talcum powder at 80°C for 3 hours.
[0027] (3) Dry the aluminum nitride at 100°C for 3 hours, add it to the epoxy resin-isopropanol methyl ether solution (epoxy resin:isopropanol methyl ether mass ratio = 1:2), at 50°C Ultrasonic oscillation was used to disperse for 5 hours, filtered, washed with alcohol, and vacuum-dried at 50° C. for 5 hours.
[0028] (4) Mechanically stir the dried talc powder and titanate for 10 min at a stirring rate of 3000 rpm.
[0029] (5) Mechanically stir the mixture in step (4) with PC resin,...
Embodiment 2
[0034] (1) The raw materials are configured according to the following mass parts: 30 parts of PC resin, 30 parts of ABS resin, 5 parts of SAN-g-MAH compatibilizer, 10 parts of silicon dioxide, 1 part of coupling agent (methoxysilane), 15 parts of aluminum nitride, 5 parts of potassium diphenyl sulfone sulfonate, 2 parts of polysiloxane, 2 parts of plasticizer (polytrimethylene adipate).
[0035] (2) Dry PC resin at 90°C for 3 hours, and dry ABS resin at 80°C for 3 hours.
[0036] (3) Dry the aluminum nitride at 100°C for 3 hours, add it to the epoxy resin-isopropanol methyl ether solution (epoxy resin:isopropanol methyl ether mass ratio = 1:2), at 50°C Ultrasonic oscillation was used to disperse for 5 hours, filtered, washed with alcohol, and vacuum-dried at 50° C. for 5 hours.
[0037] (4) Mechanically stir the silica and methoxysilane for 10 min at a stirring rate of 3000 rpm.
[0038] (5) The mixture in step (4) and PC resin, ABS resin, SAN-g-MAH, potassium diphenyl sulf...
Embodiment 3
[0043] (1) The raw materials are configured according to the following mass parts: 30 parts of PC resin, 30 parts of ABS resin, 5 parts of SAN-g-GMA compatibilizer, 5 parts of high rubber powder, 10 parts of calcium carbonate, coupling agent (titanate ) 1 part, aluminum nitride 10 parts, antimony trioxide 5 parts, polysiloxane 2 parts, plasticizer (epoxy soybean oil) 2 parts.
[0044] (2) Dry PC resin at 90°C for 3 hours, ABS resin at 80°C for 3 hours, and calcium carbonate at 80°C for 3 hours.
[0045] (3) Dry the aluminum nitride at 100°C for 3 hours, add it to the epoxy resin-isopropanol methyl ether solution (epoxy resin:isopropanol methyl ether mass ratio = 1:2), at 50°C Ultrasonic oscillation was used to disperse for 5 hours, filtered, washed with alcohol, and vacuum-dried at 50° C. for 5 hours.
[0046] (4) Mechanically stir the dried talc powder and titanate for 10 min at a stirring rate of 3000 rpm.
[0047] (5) Stir the mixture in step (4) with PC resin, ABS resin,...
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