Flame-retarding type resin prepolymer, resin composition using same, prepreg and laminated board

Abstract

The invention discloses a flame-retarding type resin prepolymer. The flame-retarding type resin prepolymer is prepared at least by prepolymerization of bismaleimide resin and amine compound. Comparedwith the prior art, the flame-retarding type resin prepolymer adopts the amine compound containing DOPO or DPPO as a bismaleimide resin modifier, and on the basis of no influence on the property of the bismaleimide resin, phosphorus-containing groups can be well guided into a crosslinking network structure of the bismaleimide resin, therefore, nitrogen element and phosphorus element in one crosslinking network structure generate synergistic flame retardance, the phosphorus content needed by flame retardance of the solid substance to reach UL94V-0 can be reduced, no addition of other flame-retarding agent is needed, and the solid substance with excellent halogen-free flame retardance, high heat resistance, high glass transition temperature, high modulus retention rate under high temperatureand excellent toughness and heat expansion coefficient simultaneously is obtained.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a flame-retardant resin prepolymer and a resin composition, a prepreg and a laminate prepared by using the same. Background technique [0002] In recent years, with the continuous development of mobile Internet technology, multi-functionality, portability, and thinness have continuously become the pursuit goals of electronic products, which means that more components are loaded in electronic products, and more printed circuits use high-density interconnection. Technology (HDI) and the thickness of the printed circuit board is thinner. Therefore, higher requirements are put forward for the base material of the printed circuit board-copper clad laminate, and it is required to have the performance similar to the package substrate, which is the rising trend in the industry. Class packaging materials require copper clad laminates to have high heat resistance, high glass t...

AI Technical Summary

Problems solved by technology

[0006] For example, the patent CN102276837A discloses the technical scheme of adding phosphorus-containing compounds (phosphazenes) to the double-horse resin system. Although it is possible to obtain cured products that do not contain halogens and have good flame-retardant properties, these flame-retardants do not have It forms a better cross-linked network structure with the bismaleimide resin system. Under the high temperature curing conditions (often higher than 200°C) of the bismaleimide resin, the unreacted phosphazenes are similar to "sweating". The way of floating on the surface of the substrate not only affects the heat resistance of the sheet, but also affects the bonding force between the sheet and the copper foil

[0007] For example, the patent JP2012153896 discloses the technical solution of adding phosphorus-containing epoxy resin to the double-horse resin system. This technical solution can also meet the requirements of halogen-free flame retardancy, but the presence of phosphorus-containing epoxy resin greatly reduces the Glass transition temperature, heat resistance and modulus retention at high temperature

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