Sensitive thin film in thin film pressure sensor and manufacturing method and application thereof
A thin-film pressure and sensitive thin-film technology, which is applied in the measurement of the property force of the piezoelectric resistance material, the measurement of the fluid pressure by changing the ohmic resistance, the instrument, etc., can solve the problems of poor corrosion resistance, thin film shedding, large resistance temperature, etc. Coefficient and other issues, to achieve the effect of large strain factor, lower temperature coefficient of resistance, and high sheet resistance
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Embodiment 1
[0053] The present embodiment provides a kind of sensitive thin film in thin film pressure sensor, and its material is (Ni 0.8 Cr 0.2 ) 0.85 Ta 0.1 N 0.05 .
[0054] The above-mentioned sensitive film in the present embodiment adopts following method to prepare: (1) adopts radio frequency magnetron sputtering method to bombard Ni 0.8 Cr 0.2 target and Ta target, while sputtering, pass Ar gas and N into the reaction chamber 2 The mixed gas, control N 2 The flow rate is 5 sccm, the Ar flow rate is 100 sccm, and the background vacuum is 2×10 -4 , the deposition power is 300W, the deposition time is 2000s, the deposition temperature is 100°C, and the deposition pressure is 0.6Pa. According to the test results of secondary ion mass spectrometry (SIMS), it was confirmed that (Ni 0.8 Cr 0.2 ) 0.85 Ta 0.1 N 0.05 precursor film. (2) will (Ni 0.8 Cr 0.2 ) 0.85 Ta 0.1 N 0.05 Precursor film in N 2 Under the atmosphere, control the heating rate of 10°C / min to raise the ...
Embodiment 2
[0061] The present embodiment provides a kind of sensitive thin film in thin film pressure sensor, and its material is (Ni 0.8 Cr 0.2 ) 0.8 Ta 0.1 N 0.1 .
[0062] The above-mentioned sensitive film in the present embodiment adopts following method to prepare: (1) adopts radio frequency magnetron sputtering method to bombard Ni 0.8 Cr 0.2 target and Ta target, while sputtering, pass Ar gas and N into the reaction chamber 2 The mixed gas, control N 2 The flow rate is 28sccm, the Ar flow rate is 92sccm, and the background vacuum is 2×10 -4 , the deposition power is 100W, the deposition time is 2000s, the deposition temperature is 100°C, and the deposition pressure is 3Pa. According to the test results of secondary ion mass spectrometry (SIMS), it was confirmed that (Ni 0.8 Cr 0.2 ) 0.8 Ta 0.1 N 0.1 precursor film. (2) will (Ni 0.8 Cr 0.2 ) 0.8 Ta 0.1 N 0.1 Precursor film in N 2 Under the atmosphere, the temperature was raised to 900° C. at a controlled rate o...
Embodiment 3
[0068] The present embodiment provides a kind of sensitive thin film in thin film pressure sensor, and its material is (Ni 0.5 Cr 0.5 ) 0.75 Ta 0.12 N 0.13 .
[0069] The above-mentioned sensitive film in the present embodiment adopts following method to prepare: (1) adopts radio frequency magnetron sputtering method to bombard Ni 0.5 Cr 0.5 target and Ta target, while sputtering, pass Ar gas and N into the reaction chamber 2 The mixed gas, control N 2 The flow rate is 10sccm, the Ar flow rate is 70sccm, and the background vacuum is 5×10 -5 , the deposition power is 200W, the deposition time is 1000s, the deposition temperature is 300°C, and the deposition pressure is 3Pa. According to the test results of secondary ion mass spectrometry (SIMS), it was confirmed that (Ni 0.5 Cr 0.5 ) 0.75 Ta 0.12 N 0.13 precursor film. (2) will (Ni 0.5 Cr 0.5 ) 0.75 Ta 0.12 N 0.13 Precursor film in N 2 Under the atmosphere, control the heating rate of 30°C / min to raise the t...
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