A kind of plasma deposition device and deposition method

A plasma and deposition device technology, applied in metal material coating process, coating, gaseous chemical plating and other directions, can solve the problem of high power supply voltage, achieve the effects of small dielectric loss, uniform discharge and good insulation performance
CN109778146BActive Publication Date: 2021-11-19INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
Publication Date
2021-11-19

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Abstract

The invention belongs to the technical field of plasma discharge, and in particular relates to a plasma deposition device and a deposition method. The device comprises at least one plasma exciter, a plasma precursor preparer, a thin film output device and a thin film collecting device; the plasma exciter includes several electrodes, a blocking medium, and a gap; the outer surface of the electrode has several protrusions, and the electrode The exterior is clad with a barrier medium. By arranging several protrusions on the electrode, the device can increase the local electric field in the vicinity of the protrusions, increase the applied voltage in this area, thereby reducing the breakdown voltage of the gap, reducing the minimum excitation voltage for the device to work normally and maintaining the dielectric barrier discharge. The required working voltage; during the discharge process, some protrusions will be gasified and ionized, so that the surface of the electrode will be restored to be flat and the discharge will be more uniform. In addition, the thin film deposited by using the device is uniform, dense, high in dielectric constant, low in dielectric loss, and good in insulation performance.
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Description

technical field

[0001] The invention belongs to the technical field of plasma discharge, and in particular relates to a plasma deposition device and a deposition method. Background technique

[0002] With the development of polymer manufacturing process, polymer dielectric films such as polytetrafluoroethylene film, polyimide film and polypropylene film are widely used in the fields of electronics and electricity due to their extremely high energy density. Due to the unsatisfactory dielectric constant of polymer films, how to improve the dielectric properties of polymer films has become one of the hot topics of research by scholars.

[0003] At present, the common method to improve the dielectric properties of polymer films is to mix high dielectric constant materials into the polymers, but this method has many defects such as the need for high temperature and high pressure equipment, high cost, and low efficiency in the preparation process. Plasma modification technology h...

Claims

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