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Methods for preparing 2.5D copper circuit on flexible substrate and device thereof

A technology of flexible substrates and circuits, applied in printed circuit parts, conductive pattern formation, electrical connection printed components, etc., can solve the problems of not conforming to the concept of environmental protection, limited adhesion strength, and inability to complete circuit preparation in one step, so as to achieve reduction The effect of time and personnel cost, saving processing time and saving personnel expenditure cost

Active Publication Date: 2019-05-21
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, as a common method for processing circuit patterns on glass, the indium tin oxide spraying method had disadvantages such as low conductivity, high cost, and limitations on material size; similarly, the electronic printing method also had many disadvantages: low conductivity, Adhesion strength is limited
[0003] Disadvantages of the existing technology: laser-induced liquid deposition, which is also one of the mainstream methods for preparing circuits, usually combines laser etching and electroless plating, and cannot complete circuit preparation in one step. The chemical liquid composition contains toxic reagents such as formaldehyde, which is not environmentally friendly. idea
The steps are scattered and need to be manually transferred to different equipment for operation, and only planar circuit structures can be prepared

Method used

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  • Methods for preparing 2.5D copper circuit on flexible substrate and device thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The present invention prepares the structure of the laser processing device of 2.5D copper circuit as figure 1 shown. The device includes a laser 1 , an X-Y vibrating mirror 2 , a spin coating heater 3 , a syringe 4 and a stage 5 . A spin-coating heater 3 is placed on the stage 5, and a turntable with a height d is provided inside the spin-coating heater 3 to place the flexible substrate. The computer controls the syringe 4 to drop a certain quality of CuO NP ink onto the surface of the flexible substrate. Finally, a rotating shaft is set under the turntable, and the rotating shaft drives the turntable to rotate; realizing the spreading of CuO NP ink on the flexible substrate. The turntable is made of thermal resistance material (iron chromium aluminum, nickel chromium, constantan or pure nickel). It has a heating function when it is powered on. The computer performs temperature control and adjustment to realize the heating and drying of the CuO ink coating. After the...

Embodiment 2

[0032] 1. Pressurize and control the syringe to drop 1ml of CuO NP ink on the polyimide plastic substrate, and the substrate size is 25×75×1mm (length×width×height).

[0033] 2. The spin coating heater has both vacuum adsorption and heating functions. The spin coating parameters are set to 2500rpm and the time is 30s. The thickness of the CuO NP ink coating after spin coating was 12 μm; the heating parameters of the spin coating heater were set at 50 °C, and the coating was heated and dried for 30 min.

[0034] 3. The laser is a near-infrared nanosecond fiber laser with a wavelength λ=1064nm. The height d is known, the laser is focused so that the spot is at the focus position, the laser parameter frequency is f=500KHz, the pulse width d=50ns, the power P=0.15W, and the speed v≤30mm / s. The computer sets the trajectory of the vibrating mirror for laser scanning.

[0035] 4. Repeat step 2, the computer controls the dynamic axis of the laser to increase the position of the galv...

Embodiment 3

[0038] According to the method of Example 2, 2.5D Cu circuits with thicknesses of 120 μm, 240 μm, 480 μm, 600 μm, 720 μm, 840 μm, 960 μm, 1080 μm and 1200 μm were respectively prepared on the polyimide substrate.

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Abstract

The invention belongs to the technical field of electronic information and discloses methods for preparing a 2.5D copper circuit on a flexible substrate and a device thereof. A method comprises the steps of pressurizing an injector, and controlling the injector to drop CuO NP ink on a base material; setting parameters of a spin coating heater, carrying out spin coating to obtain a single layer ofCuO NP ink coating, and carrying out heating and drying; setting the parameters of a laser and a galvanometer motion track, and carrying out laser scanning; and repeating the spin coating and heatingstep, controlling a position of an X-Y galvanometer to be raised for 12mum relative to an object stage by a computer, controlling the X-Y galvanometer to carry out the laser scanning along an originally set track according to the same parameters, and realizing processing of the 2.5D copper circuit on the flexible substrate. According to the methods and the device, manufacturing of the copper circuit is no longer limited by a 2D plane pattern, and 2.5D copper pattern preparation in a thickness direction also can be realized. Manual operation and sample transfer are avoided. The copper circuit is prepared at one step through utilization of a production line. Time and personnel cost are greatly reduced. The methods and the device have economic benefits.

Description

technical field [0001] The invention belongs to the technical field of electronic information, and more specifically relates to a method and a device for preparing a 2.5D copper circuit on a flexible substrate. Background technique [0002] Silicon-based devices have dominated the microelectronics industry for the past few decades. However, for the development of portable and wearable electronic devices, there is an increasing interest in fabricating electronic devices based on flexible substrates (e.g., plastics, etc.). These flexible electronic devices are also driven by emerging markets such as consumer electronics and the Internet of Things. Recent studies on flexible, stretchable, and wearable electronic devices have demonstrated their great development potential for a wide range of applications. Such as batteries, sensors, lighting devices, displays, robotics and automation devices, energy storage devices, the integration of inorganic nanomaterials on flexible substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10H05K1/11H05K1/02
Inventor 谢小柱李苗妮龙江游李俭国
Owner GUANGDONG UNIV OF TECH