Polydopamine modified fluororesin mixture, prepreg prepared from polydopamine modified fluororesin mixture and copper-clad plate

A technology of polydopamine and fluorine-containing resin, which is applied in the field of communication materials, can solve the problems of weak interaction between ordinary alkane chains and the formation of chemical bonds, etc., and achieve the effects of good industrial production base, uniform glue content, and comprehensive performance requirements

Active Publication Date: 2019-05-24
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, fluorine-containing resins generally cannot chemically react with coupling agents, so it is difficult to form chemical bonds between the fluorine-containing resin matrix and inorganic fille...

Method used

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  • Polydopamine modified fluororesin mixture, prepreg prepared from polydopamine modified fluororesin mixture and copper-clad plate

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Disperse 60 parts of silica (Xinyi Hongrun) and 20 parts of alumina (Zibo Hengbang) evenly in 500 parts of ethanol, slowly add 6 parts of 3-aminopropyltriethoxysilane (APS) dropwise, in 60 o After stirring and reacting at C for 6h, the product was prepared by filtration-ethanol washing-drying and other steps: APS modified SiO 2 / Al 2 o 3 Composite inorganic filler, denoted as "SiO 2 / Al 2 o 3 -NH 2 ". In the air atmosphere, the "SiO 2 / Al 2 o 3 -NH 2 "Stir in 600 parts of 1.0wt% dopamine Tris-HCl (pH = 8.6) buffer solution, soak for 30 minutes, take it out, then stir and soak in isopropanol for 20 minutes to remove weakly adhered PDA, and finally soak in In order to remove isopropanol in water, SiO with surface chemically bonded PDA was prepared. 2 / Al 2 o 3 Composite inorganic filler, denoted as "PDA@SiO 2 / Al 2 o 3 ". Soak the 1080 glass fiber cloth in 0.8wt% dopamine Tris-HCl (pH=8.6) buffer solution for 30 minutes, take it out, then soak it in isopro...

Embodiment 2

[0040] Disperse 70 parts of silicon oxide (Xinyi Hongrun) and 30 parts of aluminum oxide (Zibo Hengbang) evenly in 700 parts of ethanol, slowly add 7.5 parts of 3-aminopropyltriethoxysilane (APS) dropwise, in 60 o After stirring and reacting at C for 6h, the product was prepared by filtration-ethanol washing-drying and other steps: APS modified SiO 2 / Al 2 o 3 Composite inorganic filler, denoted as "SiO 2 / Al 2 o 3 -NH 2 ". In the air atmosphere, the "SiO 2 / Al 2 o 3 -NH 2 "Stir in 750 parts of 2.0wt% dopamine Tris-HCl (pH = 8.6) buffer solution, soak for 45 minutes, take it out, then stir and soak in isopropanol for 25 minutes to remove weakly adhered PDA, and finally soak in In order to remove isopropanol in water, SiO with surface chemically bonded PDA was prepared. 2 / Al 2 o 3 Composite inorganic filler, denoted as "PDA@SiO 2 / Al 2 o 3 ". Soak the 1080 glass fiber cloth in 0.8wt% dopamine Tris-HCl (pH=8.6) buffer solution for 30 minutes, take it out, then s...

Embodiment 3

[0042] Evenly disperse 70 parts of titanium oxide (Tianjin Zhongzheng Huamei Technology) and 20 parts of aluminum oxide (Zibo Hengbang) in 650 parts of ethanol, slowly add 6.7 parts of 3-aminopropyltriethoxysilane (APS) dropwise, at 60 o After stirring and reacting at C for 6h, the product was prepared by filtration-ethanol washing-drying and other steps: APS modified TiO 2 / Al 2 o 3 Composite inorganic filler, denoted as "TiO 2 / Al 2 o 3 -NH 2 ". In the air atmosphere, the "TiO 2 / Al 2 o 3 -NH 2 "Stir and soak in 500 parts of 1.5wt% dopamine Tris-HCl (pH=8.6) buffer solution for 35 minutes, take it out, then stir and soak in isopropanol for 20 minutes to remove weakly adhered PDA, and finally soak in In order to remove isopropanol in water, TiO with surface chemically bonded PDA was prepared. 2 / Al 2 o 3 Composite inorganic filler, denoted as "PDA@TiO 2 / Al 2 o 3 ". Soak the 1080 glass fiber cloth in 0.8wt% dopamine Tris-HCl (pH=8.6) buffer solution for 30 minu...

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Abstract

The invention relates to a polydopamine (PDA) modified fluororesin mixture, a prepreg prepared from the polydopamine modified fluororesin mixture and a copper-clad plate. The surface of an inorganic filler is modified with amino, and then PDA is connected to the surface of the inorganic filler through chemical bonds through a reaction of the amino and dopamine. By modifying glass fiber cloth withthe PDA, on one hand, the compatibility between the inorganic filler and fluororesin is improved, and the dispersity of the inorganic filler in the fluororesin matrix is promoted; on the other hand, the interaction between the inorganic filler, the fluororesin, the glass fiber cloth and copper foil is enhanced. Furthermore, the high-frequency copper-clad plate prepared from the prepreg, a film andcopper foil is good in thermal-mechanical property, dielectric property, combination property stability and uniformity, especially, the copper foil peel strength is very high, and the requirements ofthe high-frequency communication field for various combination properties of a substrate material can be met.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a polydopamine-modified fluorine-containing resin mixture and a prepreg and a copper-clad board prepared therefrom. Background technique [0002] At present, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. CCL is one of the key materials in the information electronics industry. It has been widely used in communication base stations, satellites, vending machines, computers, mobile phones and even gradually emerging wearable devices, driverless cars, drones and intelligent robots. field. [0003] So far, such as US patents US3136680, US4335180, US4849284, US5024871, US5922453, US2539329, US4623505, US4647508, US4886699 and Chinese patents CN2014103766915, CN201010180034, etc. have developed a variety of methods for preparing copper-clad laminates containing fluori...

Claims

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Application Information

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IPC IPC(8): C08L27/18C08L81/06C08K9/04C08K9/06C08K3/36C08K3/22C08K7/14B32B17/02B32B17/10B32B27/04B32B27/28B32B15/20B32B15/14B32B7/10B32B37/10B32B37/06
Inventor 俞卫忠顾书春俞丞冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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