Polydopamine modified fluororesin mixture, prepreg prepared from polydopamine modified fluororesin mixture and copper-clad plate

Abstract

The invention relates to a polydopamine (PDA) modified fluororesin mixture, a prepreg prepared from the polydopamine modified fluororesin mixture and a copper-clad plate. The surface of an inorganic filler is modified with amino, and then PDA is connected to the surface of the inorganic filler through chemical bonds through a reaction of the amino and dopamine. By modifying glass fiber cloth withthe PDA, on one hand, the compatibility between the inorganic filler and fluororesin is improved, and the dispersity of the inorganic filler in the fluororesin matrix is promoted; on the other hand, the interaction between the inorganic filler, the fluororesin, the glass fiber cloth and copper foil is enhanced. Furthermore, the high-frequency copper-clad plate prepared from the prepreg, a film andcopper foil is good in thermal-mechanical property, dielectric property, combination property stability and uniformity, especially, the copper foil peel strength is very high, and the requirements ofthe high-frequency communication field for various combination properties of a substrate material can be met.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a polydopamine-modified fluorine-containing resin mixture and a prepreg and a copper-clad board prepared therefrom. Background technique [0002] At present, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. CCL is one of the key materials in the information electronics industry. It has been widely used in communication base stations, satellites, vending machines, computers, mobile phones and even gradually emerging wearable devices, driverless cars, drones and intelligent robots. field. [0003] So far, such as US patents US3136680, US4335180, US4849284, US5024871, US5922453, US2539329, US4623505, US4647508, US4886699 and Chinese patents CN2014103766915, CN201010180034, etc. have developed a variety of methods for preparing copper-clad laminates containing fluori...

AI Technical Summary

Problems solved by technology

However, fluorine-containing resins generally cannot chemically react with coupling agents, so it is difficult to form chemical bonds between the fluorine-containing resin matrix and inorganic fillers, glass fiber cloth or copper foil

In addition, the interaction between the common alkane chain at one end of the commonly used coupling agent and the fluorine-containing polymer chain is also very weak.

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