Sticking glue for diamond wire silicon slice and preparation method

Abstract

The invention discloses a sticking glue for a diamond wire silicon slice and a preparation method. The sticking glue comprises a component A and a component B; the component A includes glycidyl estertype epoxy resin, general bisphenol A epoxy resin, glycidyl ether, filler, defoaming agent, anti-settling agent and coupling reagent; the component B includes modified polythiol, self-prepared m-xylylenediamine prepolymer, accelerant, filler, defoaming agent and anti-settling agent. On the basis of the prior art, the invention modifies the last generation sticking glue and provides the sticking glue for the diamond wire silicon slice and the preparation method thereof. Boiling degumming without acid can be completed without adding degumming factors; the boiling degumming temperature is 10 DEGC lower than the present one; electrical conductivity of solution in cooling water or degumming water is reduced; normal working of cooling water circulation system is guaranteed; the service life ofmachine is prolonged; production efficiency of factory is guaranteed and potential safety hazard of easiness in causing machine failure is solved.

Description

technical field [0001] The invention relates to the field of silicon chip cutting materials. More specifically, the present invention relates to a diamond wire silicon slice sticky glue and a preparation method thereof. Background technique [0002] In the prior art, the sticky glue of the previous generation, see the published patent CN109321185A, although it can solve the problem of degumming without adding acid and boiling, and the degumming temperature is also low, which can guarantee certain silicon chip cutting requirements, but, in use At the same time, new problems were discovered. The degumming water and cooling water used by the existing silicon wafer cutting manufacturers are in the same water circulation system, and the water will be recycled. , the degumming factor in the sticky glue will partially dissolve into the cooling water or the water used for degumming, which will greatly increase the conductivity of the cooling water or the water used for degumming, w...

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Problems solved by technology

[0002] In the prior art, the sticky glue of the previous generation, see the published patent CN109321185A, although it can solve the problem of degumming without adding acid and boiling, and the degumming temperature is also low, which can guarantee certain silicon chip cutting requirements, but, in use At the same time, new problems were discovered. The degumming water and cooling water used by the existing silicon wafer cutting manufacturers are in the same water circulation system, and the water will be recycled. , the degumming factor in the sticky glue will partially dissolve into the cooling water or the water used for degumming, which will greatly increase the conductivity of the cooling water or the water used for degumming, which will easily damage the cooling water circulation system or even cause a shutdown failure, which greatly affects the Production efficiency even has potential safety hazards, so a stick glue is needed, which can achieve the effect of boiling degumming without adding acid without adding degumming factor, and maintain or lower than the existing boiling degumming temperature to prevent silicon wafers from being degummed. Fragmentation or oxidation due to excessive temperature difference during degumming or cooling, affecting product yield

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