A kind of UV photocuring coating for aluminum-based copper-clad laminates

Abstract

The invention belongs to the technical field of UV photocurable coatings, and particularly relates to a UV photocurable coating used on an aluminum-based copper clad plate. The UV photocurable coatingis composed of, by mass, 20-40% of acrylic resin, 10-30% of active diluent, 10-20% of modified inorganic powder, 0.2-1% of dispersant, 0.5-4% of photoinitiator, 0.5-1% of flatting agent, 0.2-3% of adhesion promoter and the balance of solvent. Through UV photocuring, curing speed is high, energy consumption is low, energy conservation, environment protection and high efficiency are realized, and the UV photocurable coating has excellent adhesion on an aluminum-based material, high resistance to acid and alkali, corrosion and wear and good surface effect, so that production efficiency of the aluminum-based copper clad plate is improved; a modifier used for the modified inorganic powder contains fluorinated carbon chain, fluorine has ultralow surface energy and is less prone to being infected with pollutants like dust, water and oil, so that the UV photocurable coating has excellent resistance to acid, alkali and corrosion; after the modifier is grafted on the surface of the inorganic powder, big size is conducive to increasing distance among the inorganic powder, so that dispersion stability is further improved.

Description

technical field [0001] The invention belongs to the technical field of UV photocurable coatings, and in particular relates to a UV photocurable coating used for aluminum-based copper-clad laminates. Background technique [0002] Aluminum-based copper clad laminate, or aluminum substrate, is a metal-based copper-clad laminate with good heat dissipation function. It is a kind of raw material for aluminum-based printed circuit boards, and it is also widely used in LED lighting products. Generally, the aluminum-based single-sided board is composed of three layers, namely the circuit layer (copper foil), the insulating layer and the aluminum base layer. The production of the circuit layer is to etch the copper plate to form a printed circuit, which is used to realize the assembly and connection of the device. The main process is grinding plate-film-exposure-development-etching-film fading. Aluminum is a highly active metal, and it is easy to react with the acidic / alkaline soluti...

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Problems solved by technology

[0004] In order to solve the problem that the aluminum-based copper-clad laminate is easy to react with the acidic / alkaline solution used in the etching and stripping process to cause corrosion, the invention discloses a UV light-curing coating for aluminum-based copper-clad laminates, which can be cured by UV Light curing, fast curing speed, low energy consumption, energy saving, environmental protection and high efficiency, good adhesion on aluminum substrates, good acid and alkali resistance, corrosion resistance, wear resistance and other properties, improving the production efficiency of aluminum-based copper clad laminates

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