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Trapezoidal organosilicone polymer as well as preparation method and application thereof and LED package adhesive

A technology of LED encapsulation and silicone, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of difficulty in controlling the degree of polymerization, difficulty in complete sealing, and limited heat resistance, etc., and achieve good application Foreground, good cold and heat impact, the effect of appropriate hardness

Active Publication Date: 2019-07-02
北京科化新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Cao Xinyu et al. (CN104045831A) disclose a kind of siloxane bridging ladder polysiloxane and its preparation method, which has the characteristics of excellent heat resistance, good mechanical properties, etc., but it has the following problems: general capping The structure of the agent (monofunctional silane) is single, which limits its heat resistance, and the end capping is not easy to complete, and the degree of polymerization is also difficult to control, which limits its application.

Method used

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  • Trapezoidal organosilicone polymer as well as preparation method and application thereof and LED package adhesive
  • Trapezoidal organosilicone polymer as well as preparation method and application thereof and LED package adhesive
  • Trapezoidal organosilicone polymer as well as preparation method and application thereof and LED package adhesive

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0071] This preparation example is used to illustrate the ladder-shaped organosilicon polymer provided by the present invention.

[0072] (1) Under the protection of dry nitrogen, add 59.5g phenyltrimethoxysilane (0.3mol) and 32.4g diphenylsilica into a three-necked flask equipped with mechanical stirring, constant pressure dropping funnel and reflux condenser. Alcohol (0.15 mol) and 90 g of DMA, stir well and place at -15°C, add 0.1 g of DBU, and react for 8 hours to obtain intermediate 1 (monomer).

[0073] (2) At the same time, add 17.2g methylvinyldimethoxysilane (0.12mol) and 13g diphenyl into another three-necked flask equipped with dry nitrogen protection, mechanical stirring, constant pressure dropping funnel and reflux condenser. Silicone diol (0.06 mol) and 15 g of DMA were stirred uniformly and placed at 0° C., 0.6 g of DBN was added, and the intermediate 2 (blocking agent) was obtained after 24 hours of reaction.

[0074] (3) Mix the obtained Intermediate 2 with Intermed...

preparation example 2

[0080] This preparation example is used to illustrate the ladder-shaped organosilicon polymer provided by the present invention.

[0081] (1) Under the protection of dry nitrogen, add 59.5g phenyltrimethoxysilane (0.3mol) and 32.4g diphenylsilica into a three-necked flask equipped with mechanical stirring, constant pressure dropping funnel and reflux condenser. Alcohol (0.15 mol) and 90 g of DMF are stirred uniformly and placed at -15° C., 0.1 g of DBN is added, and the intermediate 1 (monomer) is obtained after 8 hours of reaction.

[0082] (2) At the same time, add 40.3g methyldiethoxysilane (0.3mol) and 32.4g diphenyl into another three-necked flask equipped with dry nitrogen protection, mechanical stirring, constant pressure dropping funnel and reflux condenser. Silicon diol (0.15 mol) and 30 g of DMA were stirred evenly and placed at -20° C., 1.5 g of dibutylamine was added, and the intermediate 2 (blocking agent) was obtained after 8 hours of reaction.

[0083] (3) Mix the obt...

preparation example 3

[0086] This preparation example is used to illustrate the ladder-shaped organosilicon polymer provided by the present invention.

[0087] (1) Under the protection of dry nitrogen, add 59.5g phenyltrimethoxysilane (0.3mol) and 32.4g diphenylsilica into a three-necked flask equipped with mechanical stirring, constant pressure dropping funnel and reflux condenser. Alcohol (0.15 mol) and 90 g of ethylene glycol methyl ether are stirred uniformly and placed at -15° C., 0.1 g of triethylenetetramine is added, and the intermediate 1 (monomer) is obtained after reaction for 10 hours.

[0088] (2) At the same time, add 13.9g of 3-methacryloxypropylmethyldimethoxy into another three-necked flask equipped with dry nitrogen protection, mechanical stirring, constant pressure dropping funnel and reflux condenser. Silane (0.06mol), 6.5g diphenylsiliconediol (0.03mol) and 10g tetrahydrofuran, stir well and place at 30℃, add 0.2g potassium tert-butoxide, react for 10h to obtain intermediate 2 (bloc...

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Abstract

The invention relates to the field of LED packaging, and discloses a trapezoidal organosilicone polymer as well as a preparation method and application thereof and an LED package adhesive. The trapezoidal organosilicone polymer has a structure represented by a formula (I) shown in the description, wherein m1 to m5 are independently 1 to 5; n, p and q are independently 0 to 100, and n, p and q arenot 0 at the same time; R1, R2, R1', R2', R1'', R2'', R1''', R2''', R1'''' and R2'''' are independently C2-C25 alkyl or aryl; and R3-R16 are independently hydrogen, hydroxy, alkenyl, acyloxy, epoxy, thiol, thiocyano, an isocyanate group, phenyl, acryloxy, epoxy alkoxy, C1-C3 alkyl and derived groups of the C1-C3 alkyl. The package material prepared from the trapezoidal organosilicone polymer provided by the invention has suitable hardness, high-temperature resistance, high sulfuration resistance, high moisture resistance and good hot and cold shock, and has good application prospects.

Description

Technical field [0001] The invention relates to the field of LED packaging, in particular to a trapezoidal organic silicon polymer, a preparation method and application thereof, and an LED packaging glue. Background technique [0002] LED (Light Emitting Diode) lamps have the advantages of high efficiency, energy saving, and environmental protection, and their prospects in the lighting market have attracted attention from various countries. With the continuous improvement of LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved, and there are higher requirements for the performance of packaging materials. High-power and high-performance packaging materials have become a development trend. At present, there is a big gap between domestic research on high-power and high-performance LED packaging materials compared with foreign countries, and packaging companies cannot meet the use requirements. Therefore, they can only rely on import...

Claims

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Application Information

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IPC IPC(8): C08G77/44C08G77/06C08G77/14C08G77/20C09J183/07C09J183/04C09J183/06C09J11/06
CPCC08G77/44C08G77/06C08G77/14C08G77/20C09J183/04C09J183/06C09J11/06C08G77/80C08K5/1345
Inventor 张琛王聪王锐李海亮张榕本方世璧
Owner 北京科化新材料科技有限公司
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