Palladium/ceramic composite film

A ceramic composite and composite thin film technology, applied in ion implantation plating, metal material coating process, coating and other directions, can solve the problems of palladium film failure, pinhole defects, grain growth and coarsening of palladium film, etc. The effect of reducing thermal expansion mismatch, improving high temperature structural stability, increasing the difficulty of high temperature grain growth and coarsening

Inactive Publication Date: 2019-07-02
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the palladium film is kept at 300-450°C for a long time under working conditions, which will cause the grain growth and coarsening of the palladium film, and then form pinhole defects in the palladium film layer, resulting in the failure of the palladium film.

Method used

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  • Palladium/ceramic composite film
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  • Palladium/ceramic composite film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Preparation of Pd / Alumina Composite Thin Films on Porous Alumina

[0020] Palladium / alumina composite films were prepared on 3-inch porous alumina sheets. Metal palladium and alumina targets are used, metal palladium is powered by DC power supply, alumina is powered by radio frequency power supply, and Ar is used as the starting gas. When the back vacuum is better than 2×10 - 4 After Pa, clean with Ar plasma bombardment for 15 min in the sputtering chamber. The palladium / alumina composite thin film was obtained by sputtering the palladium target and the alumina target at the same time. for 2 hours. The thickness of the palladium / aluminum oxide composite thin film is 2.5 micrometers, and the volume content of metal palladium is 95%.

[0021] The prepared palladium / alumina composite film was kept in a hydrogen atmosphere at 700°C for 72 hours. The composite film had no defects such as pinholes and cracks, and the helium leakage rate was better than 10 -9 Pa·m 3 / ...

Embodiment 2

[0023] Preparation of Pd-Cu / ZrO Composite Thin Films on Porous Stainless Steel

[0024] A palladium-copper / alumina composite film was prepared on a 3-inch porous stainless steel sheet, and the copper content in the palladium-copper alloy was 40wt%. Palladium-copper alloy (copper content 40wt%) and alumina target material are used, the palladium-copper alloy is powered by a DC power supply, the alumina is powered by a radio frequency power supply, and Ar is used as a glow gas. When the back vacuum is better than 2×10 -4 After Pa, clean with Ar plasma bombardment for 15 min in the sputtering chamber. The palladium-copper / alumina composite film was obtained by sputtering palladium-copper and alumina targets at the same time. The sputtering chamber pressure was 0.85Pa, the target base distance was 100mm, the palladium-copper sputtering power was 250W, and the alumina sputtering power was 150W. The deposition time was 5 hours. The thickness of the palladium-copper / aluminum oxi...

Embodiment 3

[0027] Preparation of Pd-Ag / CrO Composite Thin Films on Porous Glass

[0028] A palladium-silver / chromium oxide composite film was prepared on a 3-inch porous glass sheet, and the silver content in the palladium-silver alloy was 23wt%. Palladium-silver alloy (silver content 40wt%) and chromium oxide target material are used, the palladium-silver alloy is powered by a DC power supply, the chromium oxide is powered by a radio frequency power supply, and Ar is used as an initiating gas. When the back vacuum is better than 2×10 -4 After Pa, clean with Ar plasma bombardment for 15 min in the sputtering chamber. The palladium-silver / chromium oxide composite film was obtained by sputtering palladium-silver and chromium oxide targets at the same time. The sputtering chamber pressure was 0.85Pa, the target base distance was 100mm, the sputtering power of palladium-silver was 100W, and the sputtering power of chromium oxide was 250W. The deposition time was 5 hours. The thickness o...

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Abstract

The invention discloses a palladium/ceramic composite film. The composite film is loaded on a porous carrier. The composite film is formed by combining metal palladium or a palladium alloy and ceramics, wherein the volume of the palladium or the palladium alloy accounts for 30%-99%. The composite film is prepared through a physical vapor deposition method. A magnetron sputtering method is preferably adopted for preparing, and the composite film is obtained through sputtering of a palladium or palladium alloy target and a ceramic target at the same time. Through combining of a palladium film and the ceramics, on one hand, ceramic particles are dispersed and distributed in the continuous palladium or palladium alloy, the function of pinning is achieved for the palladium grain boundary, and palladium grain high-temperature grain growth and roughening difficulty is increased; and on the other hand, through introduction of the ceramics, the function of adjusting the palladium film heat expansion coefficient can be achieved, palladium film and ceramics or glass heat expansion mismatching is reduced, and the high-temperature structure stability of the palladium film is improved.

Description

technical field [0001] The invention relates to a palladium / ceramic composite thin film, which belongs to the field of inorganic membrane materials and applications. Background technique [0002] Palladium and its alloys have high hydrogen permeation selectivity and are widely used in the fields of catalytic membrane reaction, hydrogen separation and purification. Traditional palladium components for catalytic membrane reaction, hydrogen separation and purification use cold-drawn pure palladium tubes and palladium alloy membrane tubes. The process is simple, and the membrane tubes are compact and reliable, but the membrane tubes are thick, high in cost and low in efficiency. The currently developed porous carrier palladium membrane technology loads palladium or palladium alloy membrane on the surface of the porous carrier. On the premise of ensuring the overall mechanical strength of the device, the thickness and cost of the palladium membrane are reduced, and the hydrogen p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/16C23C14/18
CPCC23C14/165C23C14/185C23C14/352
Inventor 李帅吕琴丽何迪张华王树茂蒋利军
Owner GRIMAT ENG INST CO LTD
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