Combined magnetic field and lining bias voltage conical pipe composite vacuum deposition method
A technology of vacuum deposition and conical tube, applied in vacuum evaporation plating, ion implantation plating, coating, etc., can solve the problems of film composition pollution, large particle defects, low film deposition efficiency, etc., to ensure uniformity, The effect of improving utilization efficiency
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specific Embodiment approach 1
[0025] Specific implementation mode one: the following combination Figure 1-4 Describe this embodiment. In this embodiment, a vacuum deposition method in which a combined magnetic field is compounded with a lined bias conical tube includes a bias power supply (1), an arc power supply (2), and an arc ion plating target source (3). , high-power pulsed magnetron sputtering power supply (4), high-power pulsed magnetron sputtering target source (5), bias power supply waveform oscilloscope (6), high-power pulsed magnetron sputtering power supply waveform oscilloscope (7), waveform Synchronous matching device (8), movable coil device (9), movable coil device power supply (10), rheostat device (11), multi-stage magnetic field device (12), multi-stage magnetic field device power supply (13), lining bias cone Shaped tube device (14), lining bias power supply (15), sample stage (16) and vacuum chamber (17);
[0026] In this device:
[0027]The workpiece to be processed is placed on th...
specific Embodiment approach 2
[0044] Specific Embodiment 2: The difference between this embodiment and Embodiment 1 is that a vacuum deposition method in which a combined magnetic field is combined with a lined bias conical tube is connected, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply ( 5) Adjust the multi-stage magnetic field device (12), turn on the lining bias power supply (15) to adjust the bias voltage of the lining bias conical tube device (14), turn on the movable coil device power supply (10) and adjust the movable coil device (9 ), adjust the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously, and the high-power pulse magnetron sputtering power supply (4) The period of the output pulse is an integer multiple of the output pulse of the bias power supply (1), such as Figure 4 As shown...
specific Embodiment approach 3
[0045] Embodiment 3: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum deposition method in which the lined bias conical tube is compounded, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply ( 5) Adjust the multi-stage magnetic field device (12), turn on the lining bias power supply (15) to adjust the bias voltage of the lining bias conical tube device (14), turn on the movable coil device power supply (10) and adjust the movable coil device (9 ), adjust the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously, and the high-power pulse magnetron sputtering power supply (4) Output high-power pulse and bias power supply (1) The phase of the output bias pulse waveform is adjustable, such as Figure 4 As shown...
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