Three-dimensional double-sided silicon micro-strip detector and preparation method thereof
A detector and double-sided technology, which is applied in the field of three-dimensional double-sided silicon microstripe detector and its preparation, can solve the problem that high-position resolution detectors are easily broken down, detector sensitivity is limited, and single-sided etching dead zone It can reduce the risk of breakdown, distribute the internal electric field uniformly, and simplify the electronics.
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Embodiment 1
[0032] 3D double-sided silicon microstrip detectors, such as Figure 1~3 As shown, it includes an upper detection unit, a lower detection unit and an intermediate semiconductor substrate 7; the upper detection unit is etched on the upper part of the intermediate semiconductor substrate 7, the lower detection unit is etched on the lower part of the intermediate semiconductor substrate 7, and the upper detection unit is composed of the upper semiconductor substrate 1. The upper groove electrode 2 and the upper central electrode 3 are composed. The upper groove electrode 2 is a cuboid, and a plurality of parallel upper semiconductor substrates 1 are uniformly embedded in it. The upper semiconductor substrate 1 is embedded with an upper central electrode 3. The electrode interval between the trench electrode 2 and the upper central electrode 3 is r t , that is, the distance between the upper trench electrode 2 and the upper central electrode 3 is r t (The upper groove electrode 2...
Embodiment 2
[0034] The difference from Example 1 is that the doping concentration of the upper trench electrode 2 and the lower trench electrode 5 in this embodiment is 25×10 18 cm -3 The p-type heavily doped silicon substrate; the upper central electrode 3 and the lower central electrode 6 have a doping concentration of 25×10 18 cm -3 n-type heavily doped silicon substrate.
Embodiment 3
[0036] The difference from Examples 1-2 is that the doping concentration of the upper trench electrode 2 and the lower trench electrode 5 in this embodiment is 5×10 19 cm -3 The p-type heavily doped silicon substrate; the upper central electrode 3 and the lower central electrode 6 have a doping concentration of 5×10 19 cm -3 n-type heavily doped silicon substrate.
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