The invention provides a high-reliability photoresist glass passivation chip and a processing method thereof, and belongs to the technical field of chip processing. The chip comprises a chip body andgrooves, wherein the grooves are uniformly formed in the chip body, protection layers are arranged in the grooves, each protection layer comprises a silicon atom thin film, an oxygen-doped poly-silicon thin film, a low silicon dioxide thin film, a glass passivation layer and an upper silicon dioxide thin film which are sequentially arranged on a surface of each groove, the glass passivation layeris not connected at the center of the groove, and a cutting line is arranged at a central line of the groove. The processing method comprises the steps of primary photoetching, groove corrosion, photoresist removing, cleaning, silicon atom thin film deposition, oxygen-doped poly-silicon thin film deposition, silicon dioxide thin film deposition, photoresist glass coating, secondary photoetching, photoresist glass sintering, silicon dioxide thin film deposition and post-processing. The chip fabricated by the processing method provided by the invention is high in reliability and long is servicelifetime and is difficult to get failure.