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Preparation method of transparent metal mesh conductive thin film

A technology of conductive film and transparent metal, which is applied in metal processing equipment, cable/conductor manufacturing, conductive layer on insulating carrier, etc., can solve the problems of uneven edge of metal grid, easy fracture cost, etc., to increase production cost, The effect of reducing machine life and increasing processing time

Inactive Publication Date: 2019-08-02
DALIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In view of the above deficiencies, the present invention provides a method for preparing a transparent metal grid conductive film, the film prepared by this method can solve the problems of uneven metal grid edges, easy breakage and high cost

Method used

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  • Preparation method of transparent metal mesh conductive thin film
  • Preparation method of transparent metal mesh conductive thin film
  • Preparation method of transparent metal mesh conductive thin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Edit the square metal grid pattern in the fiber laser control software, the line width is 76 μm, the scanning speed is 200 mm / s, the scanning distance is 0.04 mm, and the laser power is 80%. Place a metal copper foil with a thickness of 10 μm on the laser processing platform, adjust Position the focal length and carry out laser processing to obtain a metal grid; immerse the obtained metal copper grid into a PCB etchant (sodium persulfate aqueous solution with a mass concentration of 20%) to further corrode and modify to achieve the desired effect, and this product is obtained. The product picture is as follows figure 2 shown.

Embodiment 2

[0039] Edit the square metal grid pattern in the fiber laser control software, the line width is 100 μm, the scanning speed is 400 mm / s, the scanning distance is 0.02 mm, and the laser power is 60%; place a metal copper foil with a thickness of 10 μm on the laser processing platform, adjust Position the focal length and carry out laser processing to obtain a metal grid; immerse the obtained metal copper grid into a PCB etchant (sodium persulfate aqueous solution with a mass concentration of 20%) to further corrode and modify to achieve the desired effect, and this product is obtained. The product picture is as follows Figure 4 shown.

Embodiment 3

[0041] Edit the square metal grid pattern in the fiber laser control software, the line width is 30μm, the scanning speed is 200mm / s, the scanning distance is 0.03mm, and the laser power is 75%. Place the metal iron foil with a thickness of 30μm on the laser processing platform, adjust Position the focal length and perform laser processing to obtain a metal grid; immerse the obtained metal grid in a PCB etchant (sodium persulfate aqueous solution with a mass concentration of 30%) for further corrosion modification to achieve the desired effect and obtain this product.

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Abstract

The invention relates to a preparation method of a transparent metal mesh conductive thin film, and belongs to the technical field of transparent conductive thin films. The preparation method comprises the following steps that firstly, a metal mesh pattern is edited in an optical fiber laser control software, then the surface sweeping speed, the surface sweeping distance, the line width and the laser power are set in the software, finally, a certain thickness of metal foil is used to be ablated to obtain the metal mesh, the metal mesh is immersed into a PCB corrosive to be further corroded toobtain the final product. The preparation method has the advantages that the specific data range of manufacturing of the metal mesh is provided, the product metal mesh obtained in the range is best ineffect and is relatively low in cost.

Description

technical field [0001] The invention discloses a method for preparing a transparent metal grid conductive film, which belongs to the technical field of transparent conductive films. Background technique [0002] Metal mesh technology uses metal materials such as silver and copper to grow on plastic films such as glass or PET to form conductive metal mesh patterns, which combine optical transparency and conductivity, and are widely used in optoelectronic devices. Such as touch screens, liquid crystal displays, light emitting diodes and solar cells. [0003] At present, the main methods for preparing metal grids are: laser sintering method, inkjet printing writing method, grain boundary printing template method, photolithography method, nanoimprinting method, etc. Its main process is as follows: [0004] Laser sintering method: powder laying - laser sintering - removal of excess unsintered powder - metal mesh [0005] Inkjet printing and writing: software design-modulation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/70H01B5/14H01B13/00
CPCB23K26/38B23K26/702H01B5/14H01B13/00
Inventor 惠宇孙旭东李智毕孝国刘旭东那兆霖王兴安
Owner DALIAN UNIV
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