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A thermosetting resin composition, a bulk molding compound, and a molded product thereof

A technology of resin composition and bulk molding compound, applied in the field of bulk molding compound and its molded products, thermosetting resin composition, can solve the problems of high endothermic onset temperature, insufficient endothermicity and the like

Pending Publication Date: 2019-08-09
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these molded products have a high endothermic start temperature and insufficient heat absorption in the low temperature range.

Method used

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  • A thermosetting resin composition, a bulk molding compound, and a molded product thereof
  • A thermosetting resin composition, a bulk molding compound, and a molded product thereof

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0038] (Production example 1: Production of unsaturated polyester)

[0039] Add 540 parts by mass of propylene glycol, 280 parts by mass of isophthalic acid, and 510 parts by mass of maleic anhydride into a reaction vessel equipped with a thermometer, a stirrer, an inert gas inlet, and a recuperator. The temperature is raised to 220°C in a nitrogen atmosphere. It was allowed to react for 7 hours, and when the solid content acid value reached 25, it was cooled to 170°C, and then 0.13 parts by mass of hydroquinone was added to obtain an unsaturated polyester.

manufacture example 2

[0040] (Production example 2: Production of saturated polyester)

[0041] Add 320 parts by mass of diethylene glycol, 270 parts by mass of dipropylene glycol, 410 parts by mass of isophthalic acid, and 380 parts by mass of adipic acid into a reaction vessel equipped with a thermometer, a stirrer, an inert gas inlet, and a reflux cooler. The temperature was raised to 230°C in a nitrogen atmosphere, and the reaction was performed for 8 hours. When the solid content acid value reached 7, it was cooled to 170°C, and then 0.14 parts by mass of hydroquinone was added to obtain a saturated polyester.

Embodiment 1

[0042] (Example 1: Preparation of thermosetting resin composition (1))

[0043] 46 parts by mass of unsaturated polyester obtained in Production Example 1, 20 parts by mass of saturated polyester obtained in Production Example 2, 34 parts by mass of styrene, sodium bicarbonate (manufactured by Tokuyama Co., Ltd.; industrial grade, average particle size) Diameter 60μm) 105 parts by mass, calcium carbonate ("NS#100" manufactured by Nitto Fen Chemical Industry Co., Ltd.; average particle size 2.1μm) 110 parts by mass, aluminum hydroxide ("Higilite HC-32" manufactured by Showa Denko Co., Ltd.; Average particle size: 8μm) 120 parts by mass, release agent (zinc stearate; "SZ-2000" manufactured by Sakai Chemical Industry Co., Ltd.) 6 parts by mass, and curing agent (organic peroxide; "PERCURE" manufactured by NOF Corporation HO”) 1.5 parts by mass were mixed with a kneader for 8 minutes, and then 49.5 parts by mass of reinforcing material (glass fiber / chopped strands; "ECS404-6" manufac...

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PUM

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Abstract

The present invention provides a thermosetting resin composition, a bulk molding compound, and a molded product thereof, wherein the thermosetting resin composition has excellent kneading property andlow shrinkage when molded into a molded product, and a molded product having low heat absorption start temperature and excellent flame retardancy can be obtained. A thermally assimilable resin composition is used, characterized in that it comprises a thermally assimilable resin (A), a polymerizable monomer (B), an inorganic filler (C) containing sodium bicarbonate, and an organic peroxide (D).

Description

Technical field [0001] The present invention relates to a thermosetting resin composition, a mass molding compound and molded products thereof. Background technique [0002] Heat curing by adding low shrinkage agents, inhibitors, curing agents, fillers, mold release agents, reinforcing materials, etc. to thermosetting resins such as unsaturated polyester resins and vinyl ester resins and kneading them with a kneader The flexible resin composition has the advantages of electrical insulation, heat resistance, flame retardancy, high rigidity, dimensional stability, etc., so it is widely used for packaging (sealing materials) of electronic parts related to home appliances, automobiles, and the like. Among the above-mentioned thermosetting resin compositions, a bulk molding compound (Bulk Molding Compound; hereinafter abbreviated as "BMC") can be formed by extrusion molding, transfer molding, injection molding, etc. Method to make molded products. [0003] In recent years, the high ou...

Claims

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Application Information

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IPC IPC(8): C08L67/06C08L67/02C08K13/04C08K3/26C08K3/22C08K5/098C08K7/14C08G63/54C08G63/672
CPCC08L67/06C08G63/54C08G63/672C08K2003/2227C08K2003/265C08L2201/02C08L2203/20C08L67/02C08K13/04C08K3/26C08K3/22C08K5/098C08K7/14
Inventor 蒋建业柴田欧
Owner DIC CORP