Diamond abrasive particle wear prediction method based on finite element dynamic scribing simulation

Abstract

The invention provides a diamond abrasive particle abrasion prediction method based on finite element dynamic scribing simulation. According to the method, stress data and temperature data obtained in the abrasive particle dynamic scribing process are fitted and loaded to abrasive particles for calculation and prediction of abrasive particle abrasion. The method comprises the steps that the geometric size of abrasive particles is defined according to actual machining conditions, and modeling software is used for conducting parametric modeling; a workpiece model is established in finite element simulation software, and workpiece and abrasive particle material attribute endowing, assembling work, analysis step setting, grid division, contact setting and the like are sequentially completed; single diamond abrasive particle scribing simulation is finished, and stress data, abrasive particle temperature distribution data and the like are obtained in the scribing process through post-processing; mathematical software is used to fit scribing time-stress data and scribe time-temperature data into a polynomial; and the obtained stress and temperature data are loaded on the abrasive particles in the form of an equation to predict the wear area and the wear amount of the abrasive particles. Combined dynamic simulation of single abrasive particle scribing and abrasion evolution and abrasion loss prediction of the diamond abrasive particle scribing process are carried out by combining modeling software, a finite element simulation analysis technology and mathematical software.

Description

technical field [0001] The invention relates to a finite element prediction method, in particular to a diamond abrasive wear prediction method based on finite element dynamic marking simulation. Background technique [0002] Silicon carbide ceramics have many excellent properties (high hardness, oxidation resistance, strong acid and alkali resistance, low thermal expansion coefficient and high thermal conductivity, etc.), and have been widely used in aerospace, machinery industry, electronics and other fields in recent years , has become an irreplaceable material in the industrial field. However, due to the high hardness and high wear resistance of SiC ceramics, the main machining methods are grinding, grinding and polishing. Among them, diamond grinding wheel grinding has the highest efficiency and is an important means of processing SiC ceramics. [0003] The grinding process of the workpiece by the diamond grinding wheel is the process of micro-cutting the workpiece by t...

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Problems solved by technology

[0008] In view of the problems existing in the background technology, the present invention aims to propose a method that can combine a variety of software in different fields to simulate the process of abrasive scribing and abrasive wear. It can use software in different fields to accurately complete the entire simulation process. Different parts (modeling-simulation-data processing-re-simulation) can make up for the defects of the current use of a single finite element software for a certain part of the work, and describe the wear evolution of silicon carbide ceramics and diamond abrasive grains for a single abrasive grain Regular research provides theoretical basis and simulation technical support

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