Novel special backing plate for photovoltaic diamond wire cutting

Abstract

The invention relates to the technical field of a special backing plate for diamond wire cutting silicon wafers in the photovoltaic industry, in particular to a novel special backing plate for photovoltaic diamond wire cutting. The backing plate is prepared from, by weight, 75-95 parts of ABS resin, 5-25 parts of PMMA resin, 5-15 parts of PC resin and/or PBT resin, 1-10 parts of a compatilizer, 1-10 parts of polyvinyl pyrrolidone, 1-10 parts of an adjuvant and 1-5 parts of an adhesion modifier. The backing plate has the advantages that the specific gravity is small, the consumption of manpoweris reduced, the production efficiency is improved, the backing plate does not adhere to diamond wires, the consumption of the diamond wires is reduced, and silicon materials and ABS/PMMA/PC plastic plates are conveniently recovered. By using the backing plate, obvious benefits of reducing the energy consumption and the cost and improving the production efficiency can be brought.

Description

technical field [0001] The invention relates to the technical field of a special backing plate for diamond wire cutting of silicon wafers in the photovoltaic industry, in particular to a new special backing plate for diamond wire cutting of photovoltaics. Background technique [0002] In the field of solar photovoltaic power generation, when processing silicon ingots to form silicon wafers, it is necessary to slice through diamond wires and use resin board auxiliary materials to bond silicon ingots. After cutting, the silicon wafers need to be degummed and cleaned, and the silicon wafers and resin plate to separate. In the silicon wafer cutting process, the backing plate is an indispensable cutting auxiliary material and plays an important role in diamond wire cutting silicon wafers. [0003] In the prior art, most of the resin backing boards used for diamond wire cutting are polyester resin boards, epoxy resins, phenolic resins, polyurethane foam boards, etc. Among them, p...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, most of the resin backing boards used for diamond wire cutting are polyester resin boards, epoxy resins, phenolic resins, polyurethane foam boards, etc. Among them, polyester resin boards generally need to add carbonic acid during the manufacturing process. Calcium, alumina and other fillers, compared with inorganic glass plates, polyester resin plates can reduce the probability of disconnection, but silicon powder, aluminum powder, calcium powder particles will still adhere to the diamond wire, affecting cutting efficiency and increasing At the same time, there are many pores on the surface of the polyester resin board, and the distribution of hardness and strength is uneven, which greatly reduces the cutting efficiency of the silicon wafer; the material of the polyurethane foam board is relatively uniform, and its hardness and toughness are lower than that of the polyester resin board. Better, but the manufacturing cost of polyurethane foam board is higher, the cells are more difficult to control, and the production loss rate is higher

It is also worth noting that the above-mentioned polyester resin board and polyurethane foam board are thermosetting plastics. After the silicon rods are cut, the polyester resin board and polyurethane foam board cannot be recycled and can only be landfilled or incinerated as solid waste. processing, not environmentally friendly

Moreover, the above-mentioned backing plate has a specific gravity during use, which is 1.5-2.0g / cm 3 , prone to problems such as breakage, broken wires, sticky wires, and inconvenient recycling of silicon materials and backing plates. These problems are becoming more and more difficult to meet the development trend of photovoltaic industry to reduce costs and improve production efficiency.