Treatment method of oil stains on surface of silicon wafer for efficient N-type heterojunction batteries
A technology for the surface of heterojunction cells and silicon wafers, used in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of high surface cleanliness requirements of silicon wafers, high requirements of high-efficiency N-type monocrystalline silicon wafers, and poor appearance. Achieve the effect of improving battery conversion efficiency, improving battery yield, and increasing production revenue
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0022] This embodiment provides a method for treating oil stains on the surface of silicon wafers for high-efficiency N-type heterojunction cells, including the following steps:
[0023] S1: Insert the N-type monocrystalline silicon wafer into the heating equipment before cleaning and texturing;
[0024] S2: Heat the heating equipment to 500°C, and pass in a certain amount of protective gas, and the heating time is 1 minute;
[0025] S3: Take out the N-type single crystal silicon wafer after heating, cool down to room temperature, and then clean the N-type single crystal silicon wafer.
[0026] Further, in step S1, the heating equipment is a high temperature annealing furnace.
[0027] Further, in step S2, the protective gas is nitrogen.
[0028] Further, in step S3, when cleaning the N-type single crystal silicon wafer, first clean the N-type single crystal silicon wafer in an alkali solution environment at 70° C. for 2 minutes, take it out, and then wash the N-type single ...
Embodiment 2
[0030] This embodiment provides a method for treating oil stains on the surface of silicon wafers for high-efficiency N-type heterojunction cells, including the following steps:
[0031] S1: Insert the N-type monocrystalline silicon wafer into the heating equipment before cleaning and texturing;
[0032] S2: Heat the heating equipment to 800°C, and pass in a certain amount of protective gas, and the heating time is 12 minutes;
[0033] S3: Take out the N-type single crystal silicon wafer after heating, cool down to room temperature, and then clean the N-type single crystal silicon wafer.
[0034] Further, in step S1, the heating equipment is a high temperature annealing furnace.
[0035] Further, in step S2, the protective gas is nitrogen.
[0036] Further, in step S3, when cleaning the N-type single crystal silicon wafer, first clean the N-type single crystal silicon wafer in an alkali solution environment at 83°C for 6.5 minutes, take it out and then wash the N-type single...
Embodiment 3
[0038] This embodiment provides a method for treating oil stains on the surface of silicon wafers for high-efficiency N-type heterojunction cells, including the following steps:
[0039] S1: Insert the N-type monocrystalline silicon wafer into the heating equipment before cleaning and texturing;
[0040] S2: Heat the heating equipment to 1000°C, and pass in a certain amount of protective gas, and the heating time is 20 minutes;
[0041] S3: Take out the N-type single crystal silicon wafer after heating, cool down to room temperature, and then clean the N-type single crystal silicon wafer.
[0042] Further, in step S1, the heating equipment is a high temperature annealing furnace.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com