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A kind of nano silver powder, preparation method, silver paste and application

A nano silver powder, silver powder technology, applied in nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve problems such as affecting product performance, affecting separation, etc., to prevent particle growth, easy cleaning, particle size small diameter effect

Active Publication Date: 2021-12-21
CHENZHOU CITY JINGUI SILVER IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] It can be seen from the above literature that in order to obtain rod-shaped silver powder, polyethylene glycol-600, a high molecular weight reducing agent, needs to be used, and its pH value is 4, but the existence of high molecular weight reducing agent will affect the subsequent separation and ultimately affect the product. Properties during low temperature sintering

Method used

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  • A kind of nano silver powder, preparation method, silver paste and application
  • A kind of nano silver powder, preparation method, silver paste and application
  • A kind of nano silver powder, preparation method, silver paste and application

Examples

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Effect test

Embodiment 1

[0036] (1) with silver nitrate (AgNO 3 ) as raw material under constant temperature stirring conditions, take appropriate amount of pure water to dissolve AgNO 3 , configure AgNO 3 solution, the concentration is 0.5mol / L. And the silver nitrate dissolution process was carried out at a constant temperature of 40°C, and the stirring speed was 1000r / min.

[0037] (2) under constant temperature stirring condition, take benzyltrimethylammonium bromide as dispersant, take dispersant according to 40% of silver powder output (quality), and dissolve in the AgNO of step (1) configuration 3 solution, the reaction solution A was obtained after stirring evenly. And the temperature of the dispersant dissolution process is 40°C, and the stirring speed is 1000r / min.

[0038] (3) Under the condition of constant temperature and stirring, triethanolamine was used as the reducing agent, and an appropriate amount of pure water was taken to dissolve the reducing agent at a concentration of 2 mo...

Embodiment 2

[0049] Compared with Example 1, the present Example 2 differs in that the dispersant is tetramethylammonium hydroxide, the reducing agent is ethylene glycol, the accelerator is hydrogen peroxide, and other parts are the same as Example 1.

[0050] The nano-silver powder particle that embodiment 2 prepares is uniform, all presents spindle shape (length-to-diameter ratio is about 2.67:1), and the average length of major axis is about 80nm, and the length of minor axis is about 30nm, and the diameter of major axis is the diameter of minor axis. 2.67 times of that, there are obvious boundaries between particles, and the dispersibility is good. The nano-silver powder started to sinter at 210°C, sintered in a large area at 232.45°C, and sintered at 280°C. It shows that the sintering temperature of nano-silver powder is far lower than the melting temperature (961°C) of metallic silver. The metal content of this nano-silver powder is 95.43%, containing 4.57% organic components, but be...

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Abstract

The invention belongs to the technical field of nanomaterials, and in particular relates to a nano silver powder, a preparation method, a silver paste and an application. The particle size is 30-60nm, the aspect ratio is 2:1-4:1, the nano-silver powder is sintered and conductive in the range of 210-260°C, and the weight of residual carbon is less than 1.5% of the weight of the original nano-silver powder. The nano-silver powder is in the form of a spindle Body shape, good dispersibility, uniform particle size distribution, no carbon residue when sintered at low temperature.

Description

technical field [0001] The invention belongs to the technical field of nano-materials, and in particular relates to a nano-silver powder, a preparation method, a silver paste and an application. Background technique [0002] With the gradual development of electronic equipment in the direction of small size, light weight, low cost, multiple functions, and high reliability, low-temperature sintered silver paste technology is used as an interface connection material to replace traditional solder, lead-free solder, thermal conductive adhesive, and conductive adhesive. The new connecting material has a very important influence on the development of electronic devices and circuits. [0003] There are many advantages in applying nano-silver powder to low-temperature connection technology. Compared with traditional tin-lead solder and lead-free solder, silver has better thermal conductivity and electrical conductivity. The particle size of nano-silver powder is small, and the sint...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/00B22F9/24H01B1/02B82Y30/00B82Y40/00
CPCB22F9/24H01B1/02B82Y30/00B82Y40/00B22F1/0553B22F1/054
Inventor 田宁郴李环覃小龙谭霖
Owner CHENZHOU CITY JINGUI SILVER IND CO LTD
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