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Signal transmission performance compensation method based on conversion interconnection structure between transmission lines

A technology of interconnection structure and signal transmission, which is applied in the direction of instruments, calculations, electrical digital data processing, etc., can solve the problems that affect the upgrading of the system, the importance of interconnection points, and the increase of the working frequency band, etc., so as to achieve improved signal transmission performance and good signal quality. Integrity, the effect of reducing signal reflection

Active Publication Date: 2020-11-24
XIDIAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, the increase in the working frequency band also makes the coupling effect of the interconnection process form on the transmission performance in the microwave circuit more prominent.
[0003] As an important part of the signal transmission path, the conversion and interconnection structure between transmission lines, in the case of low frequency band and low transmission speed in the past, the interconnection point only plays the role of electrical connection, which is equivalent to a short circuit, and the performance of the entire microwave circuit system only depends on the transistor The logical relationship between performance and its connection, the signal transmission performance has almost nothing to do with the interconnection point; with the continuous improvement of the speed of the integrated circuit, the signal enters the microwave and millimeter wave bands, and the wavelength will be close to the electrical length of the transmission line, the interconnection point must be paid attention to, its parasitic Effects (capacitance, inductance, resistance, and conductance) cause the impedance of the interconnection area to not match the characteristic impedance of the transmission line at both ends, causing reflection of electromagnetic waves, generating standing waves, causing errors in signal amplitude and phase, and causing delays in the transmission of signals at the interconnection , Amplitude attenuation, synchronous switching noise, signal reflection and crosstalk and other electromagnetic field microwave effects, which will cause signal / energy integrity problems in microwave components. These problems will seriously affect the performance of microwave components, restrict the improvement of receiving and transmitting functions, and even affect the entire system. Replacement

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  • Signal transmission performance compensation method based on conversion interconnection structure between transmission lines
  • Signal transmission performance compensation method based on conversion interconnection structure between transmission lines
  • Signal transmission performance compensation method based on conversion interconnection structure between transmission lines

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Embodiment Construction

[0045] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0046] refer to figure 1 , the present invention is a signal transmission performance compensation method based on a conversion and interconnection structure between transmission lines, and the specific steps are as follows:

[0047] Step 1, determine the geometric parameters and physical parameters of the conversion interconnection structure between transmission lines

[0048] refer to figure 2 As shown in the figure, in the high-frequency microwave component, a dielectric substrate 5 with a conversion and interconnection structure between transmission lines is provided. A microstrip line 3 is arranged on the dielectric substrate 5. The microstrip 3 and the lead 4 are connected by a gold strip 3, and the lead 4 is connected to the glass medium 1. According to The specific requirements for the interconnection of high-frequency microwave components ar...

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Abstract

The invention discloses a signal transmission performance compensation method based on an inter-transmission-line conversion interconnection structure. The method comprises the steps: determining geometric parameters and physical parameters of the inter-transmission-line conversion interconnection structure, carrying out the parametric representation, building an electromagnetic analysis model, and selecting a compensation mode. If the working frequency band is a broadband, the previous step is carried out, and if the working frequency band is a narrow band. The next step is carried out. The input impedance at the interconnection position is solved. An interconnection structure is converted between transmission lines based on a parallel single branch knot, and a compensation structure electromagnetic analysis model is established. A micro-strip linear transition line is introduced at the interconnecting part of the conversion gold strips between the transmission lines. A compensation structure electromagnetic analysis model is constructed. The size of a conversion interconnection compensation structure between transmission lines is determined. When the working frequency band is a narrow band, compensation structure parameters are outputted. When the working frequency band is a broadband, compensation structure parameters are outputted. According to the method, design optimization and electrical performance compensation of the conversion structure between the transmission lines in the microwave assembly can be guided rapidly. The development quality of microwave products isimproved.

Description

technical field [0001] The invention belongs to the technical field of microwave radio frequency circuits, and specifically relates to a signal transmission performance compensation method based on a conversion and interconnection structure between transmission lines, which can be used to guide the design of the conversion and interconnection structure between transmission lines in microwave components and the regulation and compensation of signal transmission performance. Background technique [0002] With the continuous development of intelligence, automation and informatization in the fields of communication, satellite, navigation, aerospace and radar, microwave components are required to not only have the advantages of high performance and multi-function, but also have the advantages of miniaturization, light weight and Short design cycle and other requirements. Therefore, very strict requirements are put forward for the assembly and interconnection of microwave devices ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/367G06F30/30
Inventor 王从思严粤飞田军周澄刘菁王艳刘少义王猛李锦涛赵慧敏张晓阳李刚
Owner XIDIAN UNIV