Photosensitive solder resist material with short exposure time and preparation method thereof

A photosensitive solder mask, exposure time technology, applied in optical mechanical equipment, patterned surface photoengraving process, optics, etc., can solve problems such as restricting the production efficiency of circuit boards, and achieve high hardness, fast light response speed, and adhesion. high effect

Inactive Publication Date: 2019-12-06
江门市阪桥电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When printing the solder resist material on the PCB to form the solder resist film, it needs to go through an exposure step, but the exposure time of the traditional ink is generally about 20-25 seconds under the 10KW exposure machine, which greatly restricts the production efficiency of the circuit board

Method used

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  • Photosensitive solder resist material with short exposure time and preparation method thereof
  • Photosensitive solder resist material with short exposure time and preparation method thereof
  • Photosensitive solder resist material with short exposure time and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A prepared photosensitive solder resist material with a short exposure time includes the components shown in Table 1 in parts by weight.

[0040] The preparation method of the photosensitive resin that adopts wherein is: by weight, in reaction container, with 8 parts of acrylic acid, 40 parts of o-cresol novolac epoxy resins, 38 parts of solvents, 0.3 parts of catalysts, 0.3 parts of hydroquinone are heated to After reacting at 100-110°C for 8-12 hours, add 12 parts of acid anhydride and react at 105°C for 4-6 hours, then add 1.5 parts of glycidyl methacrylate and react at 105°C for 4-6 hours. A photosensitive resin with an acid value of 55-65 mgKOH / g and a solid content of 62% was obtained.

[0041] The preparation method of the photosensitive solder resist material with short exposure time comprises the following steps:

[0042] 1) taking photosensitive resin, urethane acrylate, acrylic acid monomer, epoxy resin, photoinitiator, auxiliary agent, solvent, pigment and ...

Embodiment 2

[0047] A photosensitive solder resist material with a short exposure time, comprising the components shown in Table 1 in parts by weight.

[0048] The preparation method of the photosensitive resin that adopts wherein is: by weight, in reaction container, with 12 parts of acrylic acid, 38 parts of o-cresol novolac epoxy resins, 35 parts of solvents, 0.2 parts of catalysts, 0.3 parts of hydroquinone are heated to After reacting at 100-110°C for 8-12 hours, add 12 parts of acid anhydride and react at 105°C for 4-6 hours, then add 2.5 parts of glycidyl methacrylate and react at 105°C for 4-6 hours. A photosensitive resin with an acid value of 55-65 mgKOH / g and a solid content of 65% is obtained.

[0049] The method for preparing a photosensitive solder resist material with a short exposure time is the same as that in Example 1.

Embodiment 3

[0051] A photosensitive solder resist material with a short exposure time, comprising the components shown in Table 1 in parts by weight.

[0052] The preparation method of the photosensitive resin that adopts wherein is: by weight, in reaction vessel, with 15 parts of acrylic acid, 35 parts of o-cresol novolac epoxy resins, 35 parts of solvents, 0.2 parts of catalysts, 0.3 parts of hydroquinone are heated to After reacting at 100-110°C for 8-12 hours, add 12 parts of acid anhydride and react at 105°C for 4-6 hours, then add 2.5 parts of glycidyl methacrylate and react at 105°C for 4-6 hours. A photosensitive resin with an acid value of 55-65 mgKOH / g and a solid content of 65% is obtained.

[0053] The method for preparing a photosensitive solder resist material with a short exposure time is the same as that in Example 1.

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Abstract

The invention discloses a photosensitive solder resist material with short exposure time. The photosensitive solder resist material comprises the following components in parts by weight: 35-40 parts of photosensitive resin, 5-10 parts of polyurethane acrylate, 5-10 parts of acrylic acid monomers, 4-8 parts of epoxy resin, 1-4 parts of a pigment, 25-35 parts of a filler, 5-10 parts of a photoinitiator, 1-5 parts of an auxiliary agent and 3-8 parts of a solvent. Photosensitive resin is obtained by carrying out a polymerization reaction on acrylic acid and o-cresol formaldehyde epoxy resin, and then sequentially reacting a reaction product with anhydride and glycidyl methacrylate. The exposure time of the prepared photosensitive solder resist material is short, and is only 5-10 seconds, and the exposure time of traditional ink is generally about 20-25 seconds, so that the exposure time is shortened by 1-5 times compared with the traditional exposure time; the photosensitive solder resistmaterial also has the advantages of high temperature resistance, acid and alkali resistance, heat and oil resistance, high adhesive force and high hardness; and a solder resist mask obtained by coating has excellent insulativity and high temperature resistance.

Description

technical field [0001] The invention belongs to the technical field of solder resist ink for printed circuit boards, and in particular relates to a photosensitive solder resist material with a short exposure time and a preparation method thereof. The solder resist film can be formed by printing the photosensitive solder resist material with a short exposure time on a PCB. Background technique [0002] With the rapid development of the electronics industry, electronic products are gradually developing in the direction of miniaturization, light weight and high performance, which requires printed circuit boards (PCBs) to become increasingly dense, functional and reliable. When making circuit boards, often only a part of the pads need to be soldered, so it is necessary to cover the pads and lines that do not need to be soldered with solder mask. Coating the solder resist material on the surface of the PCB can form a polymer protective film--solder resist film, which can prevent ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/102C09D11/107G03F7/027
CPCC09D11/101C09D11/102C09D11/107G03F7/027
Inventor 钟远波谢瑞芳周瑞波
Owner 江门市阪桥电子材料有限公司
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