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A kind of coating covering film and its preparation method and application

A covering film and coating technology, which is applied in the direction of coating, polyester coating, epoxy resin coating, etc., can solve the problems of polyimide being not resistant to alkali, hardening of the covering film, increasing the cost of the covering film, etc. No reduction in foldability and reliability, and excellent aging resistance

Active Publication Date: 2022-03-22
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the technical threshold of rigid-flex boards is high and the manufacturing process is complicated. Its processing flow must go through high-strength desmear (drill removal) and plasma (plasma treatment) processes. Most of the desmear processes in circuit board factories use high-strength alkali. Potassium permanganate solution treatment, and plasma will cause inevitable damage to organic materials
Ordinary cover films use polyimide film (PI film) as the base film. Polyimide is usually not resistant to alkali. After desmear and plasma processes, it is easy to cause the PI film to be bitten, thus making the cover film The mechanical properties, folding resistance and reliability of the
At present, many manufacturers in the industry increase the thickness of the PI film to slow down the impact of PI film biting on the performance of the cover film in the desmear and plasma processes. However, this method does not meet the development requirements of thin and short electronic products, and will make Overall hardening of the cover film and a substantial increase in the cost of the cover film
[0004] CN102083271A discloses a cover film for a printed circuit board, comprising a core layer, a black composite material layer with a low refractive index and an adhesive layer for adhering the cover film to a printed circuit board, the core layer fixing clip Placed between the composite material layer and the adhesive layer, the composite material layer is composed of a mixture of resin, black substance and inorganic filler, the composite material layer has a low refractive index and black color, the cover film provided by the patent It has good folding resistance and is suitable for flexible printed circuit boards, but this patent does not conduct research on slowing down the biting of PI films in desmear and plasma processes
CN102143645A discloses a cover film and a printed circuit board with the cover film. The cover film includes a base material with protective and electrical insulation functions and an adhesive layer for adhering the cover film to a copper foil substrate. The substrate has opposite first and second surfaces, and the adhesive layer contains silicon-containing additives, and the adhesive layer is fixedly covered on the first surface of the substrate. The covering film of this patent has relatively high hardness, but Damage to the cover film by the desmear and plasma processes is still unavoidable

Method used

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  • A kind of coating covering film and its preparation method and application
  • A kind of coating covering film and its preparation method and application
  • A kind of coating covering film and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0043] A coating covering film is composed of a release paper 1, an adhesive 2, a polyimide film 3 and a protective coating 4 arranged in sequence.

[0044] Among them, the adhesive is a modified epoxy adhesive with a thickness of 15 μm, the polyimide film is a Taiwan Damai TH type PI film with a thickness of 12.5 μm; the protective coating is a polyester coating with a thickness of 3 μm.

[0045] The preparation method is as follows:

[0046] (1) Stir and dissolve 100 parts by weight of VYLON 600 and 5 parts by weight of tetrahydrophthalic anhydride with methyl ethyl ketone, mix well, and control the solid content to 40wt%, to obtain a polyester composition solution;

[0047] (2) Take a 12.5 μm PI film for corona treatment, then coat the polyester composition solution on the corona-treated PI film, dry at 160°C for 3 minutes, and cure at 120°C for 2 hours to obtain a protective coating - polyimide film;

[0048] (3) Coat 15 μm of modified epoxy adhesive on the other side of...

Embodiment 2

[0050] A coated cover film consisting of release paper, adhesive, polyimide film and protective coating arranged in sequence.

[0051] Among them, the adhesive is a modified epoxy adhesive with a thickness of 15 μm; the polyimide film is a Damai TH type PI film from Taiwan, China, with a thickness of 12.5 μm; the protective coating is a polyester coating with a thickness of 4 μm.

[0052] The preparation method is as follows:

[0053] (1) Stir and dissolve 100 parts by weight of GK140 and 7 parts by weight of hexahydrophthalic anhydride with acetone, mix uniformly, and control the solid content to 40 wt%, to obtain a polyester composition solution;

[0054] (2) Take a 12.5 μm PI film for corona treatment, then coat the polyester composition solution on the corona-treated PI film, dry at 160°C for 3 minutes, and cure at 120°C for 2 hours to obtain a protective coating - polyimide film;

[0055] (3) Coat 15 μm of modified epoxy adhesive on the other side of the obtained PI fil...

Embodiment 3

[0057] A coated cover film consisting of release paper, adhesive, polyimide film and protective coating arranged in sequence.

[0058] Among them, the adhesive is a modified epoxy adhesive with a thickness of 15 μm, the polyimide film is a Taiwan Damai TH type PI film with a thickness of 12.5 μm; the protective coating is a polyester coating with a thickness of 5 μm.

[0059] The preparation method is as follows:

[0060] (1) Stir and dissolve 100 parts by weight of L411-03 and 7 parts by weight of methylhexahydrophthalic anhydride with acetone, mix uniformly, and control the solid content to 45wt%, to obtain a polyester composition solution;

[0061] (2) Take a 12.5 μm PI film for corona treatment, then coat the polyester composition solution on the corona-treated PI film, dry at 160°C for 3 minutes, and cure at 120°C for 2 hours to obtain a protective coating - polyimide film;

[0062] (3) Coat 15 μm of modified epoxy adhesive on the other side of the obtained PI film, dry...

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Abstract

The invention provides a coating cover film, a preparation method and application thereof, comprising a polyimide film and a release paper arranged on one side of the polyimide film, the polyimide film and the An adhesive is arranged in the middle of the release paper; wherein, the coating covering film further comprises a protective coating arranged on the other side of the polyimide film. The coating cover film provided by the invention has excellent softness and heat aging resistance, and after being processed by desmear and plasma processes, its mechanical properties, folding resistance and reliability are not reduced, and can meet the processing requirements of the flexible and rigid board for the cover film and performance requirements.

Description

technical field [0001] The invention belongs to the technical field of covering films, and relates to a coating covering film, a preparation method and application thereof. Background technique [0002] Reducing the assembly size and weight of electronic products, avoiding connection errors, increasing assembly flexibility, improving reliability and realizing three-dimensional installation under different assembly conditions are inevitable requirements for the increasing development of electronic products. The birth and development of rigid circuit board (PCB) and flexible circuit board (FPC) gave birth to the new product of soft and hard board; soft and hard board is the process of lamination of flexible circuit board and rigid circuit board. Combined according to relevant process requirements, a circuit board with FPC characteristics and PCB characteristics is formed. Rigid-flex board combines the advantages of flexible circuit board and rigid circuit board, which can rea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/25C09D167/00C09D175/00C09D163/00H05K1/03
CPCC09J7/25C09D167/00C09D175/00C09D163/00H05K1/0346H05K2201/0154C09J2479/086C09J2467/00C09J2475/00C09J2463/00C09J2301/122C09J2301/312
Inventor 左陈茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH