Ultrasonic potential activating method for improving electric casting metal film base interface bonding strength

A technology of interface bonding strength and activation method, which is applied in the direction of electroforming and electrolysis, can solve the problems of insufficient activation of the substrate surface, achieve the effect of improving interface bonding energy, expanding the application range, and increasing the reaction rate

Active Publication Date: 2019-12-20
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Purpose of the invention: The purpose of the present invention is to solve the problem of insufficient surface activation of the substrate in the existing method, and propose an ultrasonic potential activation method to improve the interface bonding strength of the electroformed metal film base, thereby significantly improving the interface bonding between the electroformed layer and the metal substrate Strength, prolonging the service life of the electroformed layer

Method used

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  • Ultrasonic potential activating method for improving electric casting metal film base interface bonding strength
  • Ultrasonic potential activating method for improving electric casting metal film base interface bonding strength
  • Ultrasonic potential activating method for improving electric casting metal film base interface bonding strength

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Embodiment 1

[0057] The present invention is an ultrasonic potential activation method for improving the interface bonding strength of an electroformed metal film, comprising the following steps:

[0058] (1) The copper substrate is treated as a mirror surface by grinding and polishing process. The copper substrate is ultrasonically cleaned in acetone for 20 minutes, then ultrasonically cleaned in ethanol for 20 minutes, rinsed with deionized water and dried with nitrogen, and then placed Dry in an oven at 120°C for 2 hours, take it out and cool to room temperature;

[0059] (2) Spin-coat SU-8 photoresist on the surface of the copper substrate with a desktop glue leveler, the speed is 1450r / min, and the thickness of the obtained film is about 30μm; then use an oven at 85°C for 30min and then cool to room temperature ;Use a UV exposure machine to expose the film for 3 minutes, and the exposure dose is 400mJ / cm 2 , baked in an oven at 85°C for 1 min, then cooled to room temperature, and dev...

Embodiment 2

[0065] The present invention is an ultrasonic potential activation method for improving the interface bonding strength of an electroformed metal film, comprising the following steps:

[0066] (1) The copper substrate is treated as a mirror surface by grinding and polishing process. The copper substrate is ultrasonically cleaned in acetone for 20 minutes, then ultrasonically cleaned in ethanol for 20 minutes, rinsed with deionized water and dried with nitrogen, and then placed Dry in an oven at 120°C for 2 hours, take it out and cool to room temperature;

[0067] (2) Spin-coat SU-8 photoresist on the surface of the copper substrate with a desktop glue leveler, the speed is 1450r / min, and the thickness of the obtained film is about 30μm; then use an oven at 85°C for 30min and then cool to room temperature ;Use a UV exposure machine to expose the film for 3 minutes, and the exposure dose is 400mJ / cm 2 , baked in an oven at 85°C for 1 min, then cooled to room temperature, and dev...

Embodiment 3

[0073] The present invention is an ultrasonic potential activation method for improving the interface bonding strength of an electroformed metal film, comprising the following steps:

[0074] (1) The copper substrate is treated as a mirror surface by grinding and polishing process. The copper substrate is ultrasonically cleaned in acetone for 20 minutes, then ultrasonically cleaned in ethanol for 20 minutes, rinsed with deionized water and dried with nitrogen, and then placed Dry in an oven at 120°C for 2 hours, take it out and cool to room temperature;

[0075] (2) Spin-coat SU-8 photoresist on the surface of the copper substrate with a desktop glue leveler, the speed is 1450r / min, and the thickness of the obtained film is about 30μm; then use an oven at 85°C for 30min and then cool to room temperature ;Use a UV exposure machine to expose the film for 3 minutes, and the exposure dose is 400mJ / cm 2 , baked in an oven at 85°C for 1 min, then cooled to room temperature, and dev...

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Abstract

The invention discloses an ultrasonic potential activating method for improving electric casting metal film base interface bonding strength. The method comprises the following steps: substrates are pretreated; photoresist microstructures are prepared on the substrates; the metal substrates with micro electric glue film molding cavities are fixed on cathode back plates; the cathode back plates, anodes and electric casting liquid are put in an electric casting tank; the electric casting tank is put in an ultrasonic cleaning machine for water bath heating; ultrasonic vibration is applied to activate oxide layers on the surfaces of the substrates; the application of ultrasonic vibration is stopped for electric casting to obtain electric casting layers; and after electric casting, the metal substrates are taken out for flushing by de-ionized water, and are dried by using nitrogen to remove the micro electric casting glue film molding cavities on the metal substrates to obtain electric casting layers. The oxide layers of the substrates are activated through ultrasonic potentials to improve the electric casting metal film base interface bonding strength, so that the micro metal device manufacturing yield can be improved, the service life of micro metal devices is prolonged, the application range of a micro electric casting technology is widened, and the characteristics of simplicity,high efficiency and economy are achieved.

Description

technical field [0001] The invention relates to an ultrasonic activation method for micro-electroformed metals, in particular to an ultrasonic potential activation method for improving the interface bonding strength of an electroformed metal film base. Background technique [0002] Micro-electroforming technology is one of the effective methods for making electro-forming layers. The traditional micro-electro-forming process flow is "substrate pretreatment--micro-electro-forming mold making--conventional electro-forming", in which micro-electro-forming technology is used to make layers During the process, the oxide layer on the surface of the substrate will reduce the interfacial bonding performance between the casting layer and the substrate. The weak combination of the casting layer and the substrate makes the casting layer easy to fall off from the substrate, and in serious cases, it will cause the failure of the casting layer. This problem affects the quality of the nick...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/10
CPCC25D1/10
Inventor 赵忠李冲方记文朱鹏程杨林初
Owner JIANGSU UNIV OF SCI & TECH
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