Preparation method of high-strength high-conductivity copper-selenium multi-element alloy material

Abstract

The invention provides a preparation method of a high-strength high-conductivity copper-selenium multi-element alloy material, and belongs to the field of novel copper alloy material processing. The alloy is prepared from 0.15%-0.6 w% of selenium, 0-0.25 w% of tellurium, 0.02%-0.1% w% of trace adding elements and the balance copper, wherein the trace adding elements are at least one or two of lithium, phosphorus and rare earth. An induction furnace is adopted for smelting, and the preparation method comprises the steps that batching, double-layer covering, alloy smelting, pouring and rapid cooling are conducted for obtaining a casting blank; the casting blank is extruded into a copper rod with the diameter phi of 10 mm through hot extruding, cold rolling forming is adopted, deformation isconducted four times, and then alloy crystal grains are lengthened and thinned in the deformation direction; and meanwhile second-phase particles are base-generated into fine fibrous structures, wherein the electrical conductivity can reach 86%-94% IACS, and the tensile strength can reach 520 MPa to 580 MPa.

Description

technical field [0001] The invention belongs to the field of processing novel copper alloy materials, and in particular relates to a preparation method of a high-strength and high-conductivity copper-selenium multi-element alloy material. Background technique [0002] Industrial pure copper has good electrical and thermal conductivity, and good plasticity. Therefore, industrial pure copper is widely used in electrical and thermal equipment. However, with the rapid development of industrial technology, industrial pure copper has low strength and low softening temperature. Such shortcomings limit its application, which requires the development of new high-strength and high-conductivity copper alloys. The copper alloys currently developed mainly include copper-zirconium, copper-chromium, copper-cadmium, copper-silver, and copper-magnesium alloys. , impact on the environment, electrical conductivity can not meet the requirements and many other reasons, so that these alloys have ...

AI Technical Summary

Problems solved by technology

[0002] Industrial pure copper has good electrical and thermal conductivity, and good plasticity. Therefore, industrial pure copper is widely used in electrical and thermal equipment. However, with the rapid development of industrial technology, industrial pure copper has low strength and low softening temperature. Such shortcomings limit its application, which requires the development of new high-strength and high-conductivity copper alloys. The copper alloys currently developed mainly include copper-zirconium, copper-chromium, copper-cadmium, copper-silver, and copper-magnesium alloys. , great impact on the environment, poor electrical conductivity and many other reasons, these alloys have not been used in a wide range

[0003] The addition of tellurium endows pure copper with special properties such as arc resistance and electric corrosion resistance. The application number is 02113262.3, and the name is "a tellurium-copper alloy material with high strength, high conductivity, and high arc extinguishing". The application number is 02133772.1, and the name is "Copper alloy materials for catenary wires" shows that the addition of the third component - magnesium, improves the strength of copper-tellurium alloys, but the conductivity is low, the highest is only 76% IACS, "Handbook of Commonly Used Metal Materials at Home and Abroad "(Compiled by Xi'an Standardization Information Research Institute) discloses free-cutting copper-tellurium-phosphorus alloys with grades C14500 and C14510, but their strength is only 260MPa, and they do not have comprehensive performance indicators that combine high strength and high conductivity, arc resistance and easy cutting.

At the same time, due to the use of high-purity tellurium as raw materials, these alloys have limited resources, resulting in restrictions on their research and application. Therefore, it is urgent to develop and develop new high-conductivity and heat-conducting materials.