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A kind of modified polyimide, adhesive composition and its preparation method and application

A technology of polyimide and composition, applied in the field of flexible circuit boards, can solve the problems of inability to reduce the loss factor, reduce the peel strength, reduce the dielectric properties, etc.

Active Publication Date: 2022-03-29
ZHONGSHAN DONGYI HIGH TECH MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing technology mainly adds polytetrafluoroethylene, polyphenylene ether, polyimide, etc. to epoxy adhesives to reduce the dielectric properties. However, adding these agents not only reduces the dielectric properties, but also reduces the low peel strength. and heat resistance, while the dissipation factor cannot be reduced below 0.005

Method used

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  • A kind of modified polyimide, adhesive composition and its preparation method and application
  • A kind of modified polyimide, adhesive composition and its preparation method and application
  • A kind of modified polyimide, adhesive composition and its preparation method and application

Examples

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Effect test

Embodiment 1

[0050] This example provides a kind of modified polyimide, comprises the preparation raw material of following parts by weight:

[0051] 4,4'-biphenyl ether dianhydride: 5 to 15 parts,

[0052] Hexafluorodianhydride: 25-30 parts,

[0053] 2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]propane: 25 to 35 parts,

[0054] 4,4'-diaminodiphenyl ether: 5 to 10 parts,

[0055] Dimethylacetamide: 5-10 parts,

[0056] Pyridine: 15-20 parts.

Embodiment 2

[0058] This example provides a kind of preparation method of modified polyimide, and the steps include:

[0059] S1: Weigh the 4,4'-biphenyl ether dianhydride, hexafluorodianhydride, 2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl] according to the proportion Propane, 4,4'-diaminodiphenyl ether and pyridine, followed by 2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]propane, 4,4'- Add diaminodiphenyl ether and dimethylacetamide into the container, feed nitrogen gas at low temperature and stir until dissolved;

[0060] S2: adding 4,4'-biphenyl ether dianhydride and hexafluorodianhydride to the product of step S1 at intervals in batches for reaction;

[0061]S3: adding pyridine to the product of step S2 at 5-8° C., heat-retaining and then raising the temperature to react to obtain the modified polyimide.

[0062] The range of the low temperature in step S1 is 5-10°C. In step S1, add 2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]propane, 4,4'-diaminodiphenyl ether ...

Embodiment 3

[0067] This example provides a kind of bonding composition, comprises the preparation raw material of following parts by weight:

[0068] The modified polyimide of embodiment 1: 3~6 parts,

[0069] Polyphenylene ether: 5 to 25 parts,

[0070] Epoxy resin: 2 to 15 parts.

[0071] Among the above preparation materials, polyphenylene ether and epoxy resin are curing agents for modified polyimide, and the epoxy group of epoxy resin reacts with the carboxyl group of polyimide to form a three-dimensional grid structure, providing a good Heat resistance and adhesion, epoxy resin chooses dicyclopentadiene type epoxy resin with low water absorption rate, the introduction of this type of epoxy resin can reduce water absorption rate, has stable dielectric properties, and the dosage is modified polyimide The amine mass is 3-8%. If it is too low, the heat resistance will be poor and the peel strength will be low. If it is too high, the loss factor will be too large.

[0072] The polyphe...

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Abstract

The embodiment of the present invention provides a modified polyimide, an adhesive composition and its preparation method and application. The above-mentioned modified polyimide can provide the adhesive composition with better film-forming and cohesive properties. And toughness, the above-mentioned adhesive composition is suitable for making high-frequency cover film and high-frequency copper-clad foil, the high-frequency cover film and copper-clad foil that use it to make, dielectric constant (DK) is 2.8~3.1, dissipation factor ( Df) is 0.003~0.005, the peel strength is 1.0~1.5kgf / cm, and the solder heat resistance meets 300℃*10s*3 times.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit boards, and in particular relates to a modified polyimide, an adhesive composition, a preparation method and application thereof. Background technique [0002] In recent years, with the development of wireless network and satellite high-frequency communication for civil use, it is required to be able to transmit a large number of fast wireless signals. As an extension of 4G communication technology, 5G has greatly improved technical indicators such as transmission rate, user experience rate, traffic density, end-to-end delay, and network energy efficiency. The materials required for the new generation of products applied to flexible printed circuit boards are mostly high-frequency cover films and high-frequency copper clad foils with low dielectric constant and low dielectric loss factor. [0003] In order to achieve the flexibility and bonding performance of the flexible printed circuit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C09J171/12C09J163/00C09J179/08B32B27/28B32B27/10B32B7/12B32B29/00B32B15/20B32B15/08
CPCC08G73/1075C08G73/1039C08G73/1007C09J171/12C09J163/00C09J179/08B32B27/281B32B27/10B32B7/12B32B15/20B32B15/08C08L2205/03C08L2203/20C08L2201/08C08L63/00C08L79/08C08L71/12
Inventor 陈建平张正浩
Owner ZHONGSHAN DONGYI HIGH TECH MATERIAL